IP Library Granted Patent US 11,281,336
Granted Patent B2
US 11,281,336 · App. 17/024,398 · Granted Mar 22, 2022

Optical sensor having apertures

Inventors: Richard Klenkler (San Jose, CA); Arash Akhavan Fomani (Saratoga, CA); Marek Mienko (San Jose, CA)
Assignee: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
G06F3/0421G06F3/0412G06K9/00013
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Quick Facts
Patent No.
US 11,281,336
App. No.
17/024,398
Granted
Mar 22, 2022
Kind
B2
Abstract

Systems and methods for optical imaging are disclosed. An optical sensor includes: an image sensor array comprising a plurality of pixels; and a collimator filter disposed above the image sensor array, the collimator filter comprising a plurality of light collimating apertures and light blocking material, wherein multiple light collimating apertures of the plurality of light collimating apertures are disposed within a photosensitive area of one of the pixels in the plurality of pixels, and wherein the multiple light collimating apertures are disposed over different portions of the photosensitive area of the one of the pixels.

Claims (18)

1. A device, comprising:

a display layer comprising a plurality of light emitting elements;

an image sensor array comprising a plurality of pixels, wherein the image sensor array is disposed below the display layer and configured to sense light emitted from the plurality of light emitting elements and reflected from a sensing surface of a cover layer of the device;

a collimator filter disposed between the display layer and the image sensor array, the collimator filter comprising a plurality of light collimating apertures, wherein multiple light collimating apertures of the plurality of light collimating apertures are disposed within a photosensitive area of one of the pixels in the plurality of pixels, and wherein the multiple light collimating apertures are disposed over different portions of the photosensitive area of the one of the pixels; and

a blocking layer disposed between the cover layer and the plurality of light emitting elements,

wherein the multiple light collimating apertures are arranged in a hexagonal packing arrangement or a square packing arrangement.

2. The device of claim 1 , further comprising:

a silicon sensor substrate, wherein the image sensor array comprises an array of photodiodes formed in the silicon sensor substrate, wherein the photosensitive area of one of the pixels corresponds to a single one of the photodiodes.

3. The device of claim 1 , further comprising:

a glass thin film transistor substrate, wherein the image sensor array comprises a plurality of photodiodes formed on the glass thin film transistor substrate, wherein the photosensitive area of one of the pixels corresponds to a single one of the photodiodes.

4. The device of claim 1 , wherein the plurality of light collimating apertures include an array of clusters of light collimating apertures, wherein each cluster includes multiple light collimating apertures disposed within a photosensitive area of a respective single one of the pixels of the plurality of pixels.

5. The device of claim 4 , wherein the pixels of the plurality of pixels are arranged in a square array, wherein the array of clusters is arranged in a square array corresponding to the plurality of pixels, and wherein the multiple light collimating apertures in each of the clusters are arranged in the hexagonal packing arrangement.

6. The device of claim 4 , wherein the pixels of the plurality of pixels are arranged in a square array, wherein the array of clusters is arranged in a square array corresponding to the plurality of pixels, and wherein the multiple light collimating apertures in each of the clusters are arranged in the square packing arrangement.

7. The device of claim 6 , wherein a spacing between adjacent apertures in one of the clusters is less than a spacing between adjacent apertures from a neighboring pair of the clusters.

8. The device of claim 1 , wherein the blocking layer comprises a thin metal or electron conducting layer.

9. The device of claim 1 , wherein the blocking layer comprises a dye or pigment.

10. The device of claim 1 , wherein the blocking layer comprises sub-layers or nano-sized features.

11. The device of claim 1 , wherein the blocking layer covers the plurality of light collimating apertures.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2022
From: WILL SEMICONDUCTOR (SHANGHAI) CO., LTD
To: BEIJING JIIOV TECHNOLOGY CO., LTD
Reel/Frame 060426/0640 →