Liquid cooling module for an information handling system
Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.
1. A liquid cooling system configured to decrease an operating temperature of a processor on a graphics card installed in a first card slot of an information handling system, the liquid cooling system comprising:
a plate mounted on the graphics card and coupled to the processor;
a pump coupled to the processor via the plate, wherein heat generated by the processor is transferred from the processor to heat a liquid within the pump; and
a liquid cooling module on a mounting card installed in a second card slot of the information handling system, the liquid cooling module comprising:
a radiator fluidly coupled to the pump and configured to cool the heated liquid received from the pump, the radiator comprising:
a radiator inlet tube configured to transfer the heated liquid from the pump to the radiator; and
a radiator outlet tube configured to transfer a cooled liquid from the radiator to the pump; and
a blower comprising at least one blower inlet configured to receive a portion of an air flow and direct the portion of the air flow across the radiator, the portion of the air flow causing the heated liquid to become a cooled liquid.
2. The liquid cooling module of claim 1 , wherein the second card slot is a Peripheral Component Interconnect Express (PCIe) card slot.
3. The liquid cooling system of claim 1 , wherein:
the plate comprised of a material having a high thermal conductivity, wherein the plate is configured to transfer the heat from the processor to the pump.
4. The liquid cooling system of claim 1 , wherein a rotational speed of the blower is controlled by a controller on the graphics card, the rotational speed controlling the portion of the air flow across the radiator.
5. The liquid cooling system of claim 1 , wherein the liquid cooling module has a width encompassing one card slot, wherein a third card slot is located between the first card slot and the second card slot.
6. The liquid cooling system of claim 1 , wherein the liquid cooling module has a width encompassing two card slots.
7. The liquid cooling system of claim 1 , wherein the liquid cooling module has a width encompassing three card slots.
8. A method for decreasing an operating temperature of a processor on a graphics card installed in a first slot of an information handling system, the method comprising:
coupling a plate to the processor;
coupling a pump to the processor via the plate, wherein heat generated by the processor is transferred from the processor via the plate to heat a liquid within the pump;
mounting a mounting card of a liquid cooling module to a second card slot of the information handling system, the mounting card coupled to an exterior surface of the liquid cooling module;
pumping, by the pump on the graphics card, the heated liquid from the graphics card through a radiator inlet tube to a radiator of the liquid cooling module;
receiving, by a blower of the liquid cooling module, a portion of a surrounding air flow;
directing, by the blower, an air flow across the radiator, the portion of the air flow causing the heated liquid to become a cooled liquid, wherein the cooled liquid is transferred back to the pump.
9. The method of claim 8 , wherein the second card slot is a Peripheral Component Interconnect Express (PCIe) card slot.
10. The method of claim 8 ,
the plate comprised of a material having a high thermal conductivity on the graphics card to transfer the heat from the processor to the pump.
11. The method of claim 8 , further comprising:
controlling, by a controller of the graphics card, a rotational speed of the blower, the rotational speed controlling the portion of the air flow across the radiator.
12. The method of claim 8 , wherein the liquid cooling module has a width encompassing one card slot, wherein a third card slot is located between the first card slot and the second card slot.
13. The method of claim 8 , wherein the liquid cooling module has a width encompassing two card slots.
14. The method of claim 8 , wherein the liquid cooling module has a width encompassing three card slots.
15. An information handling system, comprising:
a graphics card in a first card slot, the graphics card comprising:
a processor;
a plate coupled to the processor; and
a pump coupled to the processor via plate, wherein heat generated by the processor is transferred from the processor via the plate to a liquid within the pump to heat the liquid, wherein the pump is configured for pumping the heated liquid;
a radiator inlet tube having a first end coupled to the pump;
a liquid cooling module mounted on a mounting card in a second card slot, the liquid cooling module including:
a radiator inlet coupled to a second end of the radiator inlet tube and configured to receive the heated liquid from the pump;
a radiator configured to receive the heated liquid from the pump via the radiator inlet;
a blower comprising a plurality of inlets configured to receive a portion of an airflow surrounding the blower and configured to direct the portion of the air flow across the radiator to cool the heated liquid to become a cooled liquid;
a radiator outlet configured to receive the cooled liquid from the radiator; and
a radiator outlet tube having a first end coupled to the radiator outlet and a second end coupled to the pump, the radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the pump.
16. The information handling system of claim 15 , wherein the second card slot is a Peripheral Component Interconnect Express (PCIe) card slot.
17. The information handling system of claim 15 , wherein the plate comprised of a material having a high thermal conductivity to transfer the heat from the processor to the pump.
18. The information handling system of claim 15 , wherein a rotational speed of the blower is controlled by a controller of the graphics card, the rotational speed controlling the portion of the air flow across the radiator.
19. The information handling system of claim 15 , wherein the liquid cooling module has a width encompassing one card slot.
20. The information handling system of claim 15 , wherein the liquid cooling module has a width encompassing two card slots.