Transmitting tag
A tag is provided that includes a battery having a printed anode and cathode. A printed circuit connection layer is formed in one of the anode or the cathode. A printed antenna is formed in one of the anode or the cathode. A low-power transmitter coupled to the circuit connection layer.
1. A system comprising
a printed circuit connection layer formed in one of an anode or a cathode;
a printed antenna formed in one of the anode or the cathode;
a low-power transmitter coupled to the circuit connection layer; and
a removable tab configured to activate the low-power transmitter upon removal.
2. The system of claim 1 , wherein the low-power transmitter comprises a fractional-N phase-locked loop transceiver.
3. The system of claim 1 , wherein the removable tab comprises an insulator disposed between a first conductor and a second conductor.
4. The system of claim 1 , wherein the removable tab is configured to be replaced after removal.
5. The system of claim 1 , further comprising an identification device coupled to the tag.
6. The system of claim 1 , wherein the removable tab is coupled to a removable container cover and is configured to activate the low power transmitter when the removable container cover is removed from the container.
7. The system of claim 1 , further comprising a financial authorization device coupled to the removable tab.
8. The system of claim 1 , wherein the low power transmitter is configured to transmit location data.
9. The system of claim 1 , wherein the removable tab covers a light sensor.
10. The system of claim 1 , wherein the removable tab is configured to allow a magnetic field sensor to operate when removed.
11. A method of manufacturing a system, comprising:
forming a first metallic layer on a paper substrate;
forming a first oxide on the first metal layer;
forming an electrolyte layer on the oxide layer;
forming a second oxide layer on the electrolyte layer; and
forming a second metallic layer on the second oxide layer.
12. The method of claim 11 further comprising coupling a circuit to one of the first metallic layer or the second metallic layer.
13. The method of claim 11 , wherein forming the first metallic layer comprises forming a plurality of circuit connection pads.
14. The method of claim 12 , wherein coupling the circuit to one of the first metallic layer or the second metallic layer comprises coupling the circuit to the circuit connection pads of the first metallic layer.
15. The method of claim 13 wherein forming the second metallic layer comprises forming a plurality of circuit connection pads.
16. The method of claim 15 wherein coupling the circuit to one of the first metallic layer or the second metallic layer comprises coupling the circuit to the circuit connection pads of the second metallic layer.
17. The method of claim 11 wherein forming the first metallic layer comprises forming an antenna as part of the first metallic layer.
18. The method of claim 11 wherein forming the second metallic layer comprises forming an antenna as part of the second metallic layer.
19. A method of manufacturing a system, comprising:
forming a first metallic layer on a paper substrate;
soldering one or more circuit components to the first metallic layer;
forming a first oxide on the first metal layer;
forming an electrolyte layer on the oxide layer;
forming a second oxide layer on the electrolyte layer; and
forming a second metallic layer on the second oxide layer.
20. The method of claim 19 further comprising coupling a circuit to one of the first metallic layer or the second metallic layer.