Lead-free solder composition
An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.
1. An electrical assembly, comprising:
a wire electrical cable soldered to a conductive pad disposed on a glass surface by a solder alloy consisting of:
24% to 28% indium by weight;
5% to 20% zinc by weight;
1% to 6% silver by weight; and
a remaining weight of the solder alloy being tin.
2. The electrical assembly according to claim 1 , wherein the solder alloy includes about 9% zinc by weight.
3. The electrical assembly according to claim 1 , wherein the solder alloy includes about 12% zinc by weight.
4. The electrical assembly according to claim 1 , wherein the solder alloy includes about 3% silver by weight.
5. The electrical assembly according to claim 1 , wherein the solder alloy includes about 5% silver by weight.
6. A solder alloy, consisting of:
24% to 28% indium by weight;
5% to 20% zinc by weight;
1% to 6% silver by weight;
1% to 3% copper by weight; and
a remaining weight of the solder alloy being tin.
7. The solder alloy according to claim 6 , wherein the solder alloy includes about 9% zinc by weight.
8. The solder alloy according to claim 6 , wherein the solder alloy includes about 12% zinc by weight.
9. The solder alloy according to claim 6 , wherein the solder alloy includes about 3% silver by weight.
10. The solder alloy according to claim 6 , wherein the solder alloy includes about 5% silver by weight.
11. An electrical assembly, comprising:
a wire electrical cable soldered to a conductive pad disposed on a glass surface by a solder alloy consisting of:
17% to 28% indium by weight;
12% to 20% zinc by weight;
1% to 6% silver by weight; and
a remaining weight of the solder alloy being tin.
12. The electrical assembly according to claim 11 , wherein the solder alloy includes about 18% indium by weight.
13. The electrical assembly according to claim 11 , wherein the solder alloy includes about 22% indium by weight.
14. The electrical assembly according to claim 11 , wherein the solder alloy includes about 24% indium by weight.
15. The electrical assembly according to claim 11 , wherein the solder alloy includes about 3% silver by weight.
16. The electrical assembly according to claim 11 , wherein the solder alloy includes about 5% silver by weight.
17. A solder alloy, consisting of:
17% to 28% indium by weight;
12% to 20% zinc by weight;
1% to 6% silver by weight;
1% to 3% copper by weight; and
a remaining weight of the solder alloy being tin.
18. The solder alloy according to claim 17 , wherein the solder alloy includes about 18% indium by weight.
19. The solder alloy according to claim 17 , wherein the solder alloy includes about 22% indium by weight.
20. The solder alloy according to claim 17 , wherein the solder alloy includes about 24% indium by weight.
21. The solder alloy according to claim 17 , wherein the solder alloy includes about 3% silver by weight.
22. The solder alloy according to claim 17 , wherein the solder alloy includes about 5% silver by weight.