Hermetically sealed electronic packages with electrically powered multi-pin electrical feedthroughs
A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.0, where a preferred thermal stress resistance could be designed for making highly hermetic sealed electronic package.
1. A hermetically sealed electronic package for electronic devices, the package comprising:
a thermal panel having a panel interior surface and a panel exterior surface, the electronic devices in thermal communication with the panel interior surface;
an enclosure coupled to the thermal panel, isolating environmental communication from internal electronic devices and modules; the enclosure having an enclosure interior surface and an enclosure exterior surface,
a cavity formed by the enclosure interior surface, wherein the panel exterior surface is coupled to the enclosure interior surface;
at least one electrical feedthrough coupled to the enclosure, the electrical feedthrough having at least one conducting pin penetrating from the enclosure interior surface of a header to the enclosure exterior surface, wherein each pin and header is sealed by a hydrophobic crystalline sealing material;
a getter disposed in the cavity;
an absorber disposed in the cavity; and
an emissive coating layer covering portions of the enclosure exterior surface.
2. The package of claim 1 , wherein the enclosure comprises a metal alloy selected from the group consisting of: nickel-cobalt ferrous alloy; titanium alloy; nickel-iron alloy, copper alloy; copper-zinc alloy; and aluminum alloy.
3. The package of claim 1 , wherein the thermal panel comprises a metal matrix composite having a thermal conductivity of between 100 W/m·K to 300 W/m·K, the metal matrix composite selected from the group consisting of: silicon carbide particles dispersed in copper matrix material and silicon carbide particles dispersed in aluminum matrix material.
4. The package of claim 3 , wherein the metal matrix composite comprises nano-scaled silicon carbide particles, and wherein the metal matrix composite comprises 60 to 70 percent silicon carbide particles to maintain optimum thermal conduction paths by particle grain boundaries.
5. The package of claim 1 , wherein the thermal panel comprises a metal matrix composite having a thermal conductivity of between 300 W/m·K to 800 W/m·K, the metal matrix composite selected from the group consisting of: diamond particles dispersed in a copper matrix material, diamond particles dispersed in an aluminum matrix material, and diamond particles dispersed in a silver matrix material.
6. The package of claim 5 , wherein the metal matrix composite comprises diamond particles having a size range of between 50 micrometers to 200 micrometers, and wherein the metal matrix composite comprises 55 to 70 percent diamond particles to maintain optimum thermal conduction paths by particle grain boundaries.
7. The package of claim 1 , wherein the thermal panel comprises a metal matrix composite having a thermal conductivity of between 600 W/m·K to 800 W/m·K, the metal matrix composite selected from the group consisting of: graphite fibers dispersed in copper matrix material and graphite fibers dispersed in aluminum matrix material.
8. The package of claim 1 , wherein the thermal panel comprises a metal matrix composite having a thermal conductivity of between 800 W/m·K to 1200 W/m·K, the metal matrix composite selected from the group consisting of: carbon fibers dispersed in copper matrix material, carbon nanofibers dispersed in copper alloy, carbon fibers dispersed in aluminum alloy, and carbon nanofibers dispersed in aluminum matrix material.
9. The package of claim 1 , wherein the getter is configured to absorb a substance selected from the group consisting of: moisture, organic vapor, hydrogen gas, oxygen gas, and nitrogen gas.
10. The package of claim 1 , wherein the absorber comprises a RF/MW absorber having an absorbing performance selected from the group consisting of: narrow-band 0.1-6 GHz absorbing performance and wideband 1-100 GHz absorbing performance.
11. The package of claim 1 , wherein the electrical feedthrough is in thermal communication with the thermal panel.
12. The package of claim 5 , wherein the metal matrix composite comprises diamond particles having a size range of between 50 micrometers to 200 micrometers, and wherein the metal matrix composite comprises 55 to 65 percent diamond particles in the copper matrix material to maintain optimum thermal conduction paths by particle grain boundaries.
13. The package of claim 5 , wherein the metal matrix composite comprises diamond particles having a size range of between 50 micrometers to 200 micrometers, and wherein the metal matrix composite comprises 55 to 65 percent diamond particles in the aluminum matrix material to maintain optimum thermal conduction paths by particle grain boundaries.
14. The package of claim 5 , wherein the metal matrix composite comprises diamond particles having a size range of between 50 micrometers to 200 micrometers, and wherein the metal matrix composite comprises 60 to 70 percent diamond particles in the silver matrix material to maintain optimum thermal conduction paths by particle grain boundaries.