IP Library Granted Patent US 11,397,120
Granted Patent B2
US 11,397,120 · App. 17/030,198 · Granted Jul 26, 2022

Interface pressure sensor system for electronic device

Inventors: Robert K. Montgomery, II (Cupertino, CA); Chin San Han (Mountain View, CA)
Assignee: Apple Inc.
G01L9/0051G01L19/0092G01L19/06G01L27/002G01L1/20
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Quick Facts
Patent No.
US 11,397,120
App. No.
17/030,198
Granted
Jul 26, 2022
Kind
B2
Abstract

An interface pressure sensor includes a fluid pressure sensor disposed in a volume defined by a shear wall. The volume is enclosed, and the fluid pressure sensor is encapsulated by, an infill material. The infill material defines a sensing surface that, when pressed, can impart a force that is detectable by the fluid pressure sensor.

Claims (36)

1. An interface pressure sensor system for detecting normal force to an interface surface, the interface pressure sensor system comprising:

an outer module enclosure defining an outer volume;

a set of interface sensor modules, each disposed within the outer volume, and each respective interface sensor modules comprising:

a respective module enclosure defining a respective interior volume;

a respective pressure sensor disposed within the respective interior volume; and

a respective infill material disposed over the barometric pressure sensor and filling the respective interior volume; and

an outer module infill material filling the first outer volume and at least partially enclosing the set of interface sensor modules within the first outer volume.

2. The interface pressure sensor system of claim 1 , wherein:

the outer module infill defines a first interface surface; and

at least one respective infill material of at least one interface sensor modules of the set of sensor modules defines a second interface surface.

3. The interface pressure sensor system of claim 2 , wherein the second interface surface is proud of the first interface surface.

4. The interface pressure sensor system of claim 2 , wherein the first interface surface is flush with the second interface surface.

5. The interface pressure sensor system of claim 2 , wherein:

at least one respective interface sensor module of the set of sensor modules comprises a respective processor operably coupled to the respective pressure sensor.

6. The interface pressure sensor system of claim 5 wherein the respective infill material is disposed over the respective processor.

7. The interface pressure sensor system of claim 1 , wherein the set of interface sensor modules comprises:

a first sensor module;

a second sensor module;

a third sensor module; and

a fourth sensor module.

8. The interface pressure sensor system of claim 7 , wherein the first and second sensor modules are disposed in a first row and the third and fourth sensor modules are disposed in a second row.

9. The interface pressure sensor system of claim 8 , wherein the first row is offset relative to the second row.

10. A pressure sensing system comprising:

a substrate;

a first frame disposed on the substrate and defining a first interior volume;

a second frame defining a second interior volume, the second frame disposed within the first interior volume;

a third frame defining a third interior volume, the third frame disposed within the first interior volume and separated from the second frame by a distance;

a first pressure sensor disposed within the second interior volume and comprising:

a first fluid pressure sensor; and

a first application-specific integrated circuit operably coupled to the first fluid pressure sensor and configured to generate a first output corresponding to pressure received by the first fluid pressure sensor;

a second pressure sensor disposed within the third interior volume and comprising:

a second fluid pressure sensor; and

a second application-specific integrated circuit operably coupled to the second fluid pressure sensor and configured to generate a second output corresponding to pressure received by the second fluid pressure sensor; and

an infill material filling the first interior volume, the second interior volume, and the third interior volume to encapsulate the first pressure sensor and the second pressure sensor, the infill material defining an interface surface to receive pressure input.

11. The pressure sensing system of claim 10 , wherein the first frame, the second frame, and the third frame are formed from rigid materials and are configured to reduce shear stresses imparted to the first fluid pressure sensor and the second fluid pressure sensor.

12. The pressure sensing system of claim 10 , wherein the first frame, the second frame, and the third frame are formed from metal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2020
From: MONTGOMERY, ROBERT K., II; HAN, CHIN SAN
To: APPLE INC.
Reel/Frame 053887/0194 →
Continuity (1)
Related Publication 20220090973A1 · Mar 24, 2022
Cited By (3)
US 12,207,905 US 12,644,789 US 12,656,202