Micro light emitting devices
Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height from an LED base and including a plurality of epitaxial layers including a first n-layer, a first active layer, and a first p-layer. A second flat region is provided, at a second height from the LED base and parallel to the first flat region, and includes at least a second n-layer. A sloped sidewall connecting the first flat region and the second flat region is provided and includes at least a third n-layer, the first n-layer being thicker than at least a portion of third n-layer. A p-contact is formed on the first p-layer and an n-contact formed on the second n-layer.
1. A method for manufacturing a monolithic light emitting diode (LED) array, comprising:
growing an epitaxial layer including an active layer and a p-layer on a patterned body, the patterned body comprising:
a patterned substrate and a continuous epitaxial n-layer, or a patterned n-layer on a planar substrate,
a first plurality of flat regions comprising a first crystallographic plane orientation and being located a first distance from a base of the patterned body,
a second plurality of flat regions comprising the first crystallographic plane orientation and being located a second distance from a base of the patterned body, the second distance being smaller than the first distance,
a plurality of sloped sidewalls comprising a second crystallographic plan orientation, and
a portion of the n-layer positioned adjacent to the sloped sidewalls having a thickness less than a thickness of portions of the n-layer adjacent any of the flat regions;
applying a first resist to the epitaxial layer adjacent to the p-layer, the resist being patterned to provide access to the patterned substrate or the planar substrate;
etching through the epitaxial layer to the patterned substrate or the planar substrate;
depositing n-contact metals to produce n-contacts electrically coupled to the patterned substrate or the planar substrate;
applying a second resist to the epitaxial layer, the second resist designed for placement of p-contacts;
depositing p-contact metals to produce the p-contacts electrically coupled to the p-layer to form a plurality of light emitting diodes (LEDs);
bonding to a thin film transistor (TFT) backplane to the plurality of LEDs, the bonding causing the p-contacts and n-contacts to provide the electrical connections to the LEDs;
injecting an underfill to fill in areas surrounding the p-contacts, n-contacts, and p-layer, and
removing the patterned substrate or the planar substrate and exposing the n-layer, thereby forming a thin film flip chip (TFFC) array.
2. The method of claim 1 further comprising submicron patterning of the exposed n-layer.
3. The method of claim 1 further comprising depositing a phosphor layer onto the exposed n-layer.
4. A method for manufacturing a monolithic light emitting diode (LED) array, the method comprising:
growing an epitaxial layer including an active layer and a p-layer on a patterned body, the patterned body comprising:
a patterned substrate and a continuous epitaxial n-layer, or a patterned n-layer on a planar substrate,
a first plurality of flat regions comprising a first crystallographic plane orientation and being located a first distance from a base of the patterned substrate,
a second plurality of flat regions comprising the first crystallographic plane orientation and being located a second distance from a base of the patterned body, the second distance being smaller than the first distance,
a plurality of sloped sidewalls comprising a second crystallographic plan orientation, and
a portion of the n-layer positioned adjacent to the sloped sidewalls having a thickness less than a thickness of portions of the n-layer adjacent any of the flat regions;
applying a first resist to the p-layer, the first resist being patterned to provide access to a portion of the p-layer;
depositing a p-contact adjacent to the p-layer to form a plurality of light emitting diodes (LEDs);
bonding to a thin film transistor (TFT) backplane to form a plurality of light emitting diodes (LEDs), the bonding causing the p-contacts to provide the electrical connections to the LEDs;
injecting an underfill to fill in areas surrounding the p-contacts, n-contacts, and p-layer; and
removing the patterned substrate or planar substrate by inverting the manufactured structure to expose the n-layer thereby forming a vertical injection thin film (VTF) array.
5. The method of claim 4 further comprising submicron patterning of exposed n-layer.
6. The method of claim 4 further comprising depositing n-contact and optical isolation metals in electrical contact to the n-layer.
7. The method of claim 4 further comprising depositing a phosphor layer onto the exposed n-layer.
8. A method for manufacturing a monolithic light emitting diode (LED) array comprising a plurality of micro-light emitting diodes (uLEDs) comprising a plurality of epitaxial layers, the method comprising:
epitaxially depositing an n-layer on a patterned substrate, the patterned substrate comprising a first plurality of flat regions comprising a first crystallographic plane orientation and being located a first distance from a base of the patterned substrate, a second plurality of flat regions comprising the first crystallographic plane orientation and being located a second distance from a base of the patterned substrate, the second distance being smaller than the first distance, a plurality of sloped sidewalls comprising a second crystallographic plan orientation, and a portion of the n-layer positioned adjacent to the sloped sidewalls having a thickness less than a thickness of portions of the n-layer adjacent any of the flat regions;
epitaxially depositing an active layer on an area of the n-layer adjacent to the first plurality of flat regions and adjacent to the sloped sidewalls, such that a portion of the active layer positioned adjacent to the sloped sidewalls has a thickness less than a thickness of the portion of the active layer adjacent to the first plurality of flat regions;
epitaxially depositing a p-layer on an area of the active layer adjacent to the first plurality of flat regions and adjacent to the sloped sidewalls, such that a portion of the p-layer layer positioned adjacent to the sloped sidewalls has a thickness less than a thickness of the portion of the p-layer layer adjacent to the first plurality of flat regions;
forming a plurality of p-contacts on the portion of the p-layer adjacent to the first plurality of flat regions; and
forming a plurality of n-contacts on the portion of the n-layer adjacent to the second plurality of flat regions, whereby the plurality of uLEDs is formed.
9. The method of claim 8 in an absence of any sidewall passivation steps.
10. The method of claim 8 further comprising bonding the plurality of uLEDs to a thin film transistor (TFT) backplane.
11. The method of claim 10 further comprising removing the patterned substrate.
12. The method of claim 10 , wherein the p-contact and the n-contact are formed on the same side of the epitaxial layers thereby forming a thin film flip chip (TFFC) array.
13. The method of claim 10 , wherein the p-contact and the n-contact are formed on opposite sides of the epitaxial layers thereby forming a vertical injection thin film (VTF) array.
14. A method for manufacturing a monolithic light emitting diode (LED) array comprising a plurality of micro-light emitting diodes (uLEDs) comprising a plurality of epitaxial layers, the method comprising:
forming a patterned template comprising an n-layer on a substrate, the patterned template comprising a first plurality of flat regions comprising a first crystallographic plane orientation and being located a first distance from a base of the substrate, a second plurality of flat regions comprising the first crystallographic plane orientation and being located a second distance from a base of the substrate, the second distance being smaller than the first distance, a plurality of sloped sidewalls comprising a second crystallographic plan orientation, and a portion of the n-layer positioned adjacent to the sloped sidewalls has a thickness less than a thickness of portions of the n-layer adjacent any of the flat regions;
epitaxially depositing an active layer on an area of the n-layer adjacent to the first plurality of flat regions and adjacent to the sloped sidewalls, such that a portion of the active layer positioned adjacent to the sloped sidewalls has a thickness less than a thickness of the portion of the active layer adjacent to the first plurality of flat regions;
epitaxially depositing a p-layer on an area of the active layer adjacent to the first plurality of flat regions and adjacent to the sloped sidewalls, such that a portion of the p-layer layer positioned adjacent to the sloped sidewalls has a thickness less than a thickness of the portion of the p-layer layer adjacent to the first plurality of flat regions;
forming a plurality of p-contacts on the portion of the p-layer adjacent to the first plurality of flat regions; and
forming a plurality of n-contacts on the portion of the n-layer adjacent to the second plurality of flat regions, whereby the plurality of uLEDs is formed.
15. The method of claim 14 in an absence of any sidewall passivation steps.
16. The method of claim 14 further comprising bonding the plurality of uLEDs formed to a thin film transistor (TFT) backplane.
17. The method of claim 16 further comprising removing the substrate.
18. The method of claim 16 , wherein the p-contact and the n-contact are formed on the same side of the epitaxial layers thereby forming a thin film flip chip (TFFC) array.
19. The method of claim 16 , wherein the p-contact and the n-contact are formed on opposite sides of the epitaxial layers thereby forming a vertical injection thin film (VTF) array.