IP Library Granted Patent US 11,984,512
Granted Patent B2
US 11,984,512 · App. 17/033,444 · Granted May 14, 2024

Memory structure for self-erasing secret storage

Inventors: Uri Bear (Pardes-Hana, IL); Elad Peer (Yokneam Ilit, IL); Elena Sidorov (Haifa, IL); Rami Sudai (Haifa, IL); Reuven Elbaum (Haifa, IL); Steve J. Brown (Phoenix, AZ)
Assignee: INTEL CORPORATION
H01L29/788G11C16/0408H01L29/42324H01L29/66825H10B41/00H10B43/00
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Quick Facts
Patent No.
US 11,984,512
App. No.
17/033,444
Granted
May 14, 2024
Kind
B2
Abstract

In one embodiment, memory cell includes a control gate, a floating gate, a substrate comprising a source region and a drain region, a first isolator between the control gate and floating gate, and a second isolator between the floating gate and the substrate. The memory cell is configured to have a retention time that is within a statistical window around a selected lifespan. The selected lifespan may be less than ten years, such as, for example, less than one year, less than one month, or less than one week.

Claims (12)

1. A system comprising:

a processor coupled to a memory, the memory comprising at least one non-volatile memory cell that is configured to store a charge in a gate and have a retention time that is within a statistical window around a selected lifespan, wherein the gate includes a control gate, and wherein the non-volatile memory cell is stressed by applying cycles of high voltage to the control gate of the non-volatile memory such that the charge is set to leak and continue to leak based on a predetermined amount or percentage over a predetermined amount of time based on the selected lifespan.

2. The system of claim 1 , wherein the selected lifespan is less than ten years, wherein the cycles are applied such that properties of one or more isolators associated with the non-volatile memory cell are reduced to modify thickness of the one or more isolators, or one or more dopants in a channel region are added or removed to modify channel properties associated with a channel between a source and a drain.

3. The system of claim 1 , wherein the statistical window is between 95% of the selected lifespan and 105% of the selected lifespan.

4. The system of claim 1 , wherein the non-volatile memory cell is to store charge based on a control signal being applied thereto and is to leak the stored charge over time based on conductance of an oxide including a leaky gate oxide, and the selected lifespan indicates an amount of time that the stored charge is detectable in the non-volatile memory cell.

5. The system of claim 1 , wherein the memory comprises a flash memory device and the memory cell is integrated in the flash memory device, wherein the gate includes a floating gate, and wherein the non-volatile memory cell includes a floating gate-based memory cell.

6. The system of claim 1 , wherein the system comprises a system-on-chip (SoC).

7. An apparatus comprising:

a non-volatile memory cell including a sidewall storage-based non-volatile memory cell that is configured to have a retention time that is within a statistical window around a selected lifespan, wherein the non-volatile memory cell is configured to store a charge in a gate including a control gate, and wherein the non-volatile memory cell is stressed by applying cycles of high voltage to the control gate of the non-volatile memory such that the charge is set to leak and continue to leak based on a predetermined amount or percentage over a predetermined amount of time based on the selected lifespan.

8. The apparatus of claim 7 , wherein the statistical window is between 95% of the selected lifespan and 105% of the selected lifespan wherein the cycles are applied such that properties of one or more isolators associated with the non-volatile memory cell are reduced to modify thickness of the one or more isolators, or one or more dopants in a channel region are added or removed to modify channel properties associated with a channel between a source and a drain.

9. The apparatus of claim 7 , wherein the memory cell is to store a charge in the control gate based on a control signal being applied to the control gate, is to leak the stored charge over time based on conductance of an oxide including a leaky gate oxide, and the selected lifespan indicates an amount of time that the stored charge is detectable in the sidewall spacer.

10. The apparatus of claim 7 , wherein the apparatus comprises a flash memory device and the memory cell is integrated in the flash memory device, wherein the gate includes a floating gate, and wherein the non-volatile memory cell includes a floating gate-based memory cell.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072914/0491 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2021
From: BEAR, URI; PEER, ELAD; SIDOROV, ELENA; SUDAI, RAMI; ELBAUM, REUVEN; BROWN, STEVEN J.
To: INTEL CORPORATION
Reel/Frame 055063/0879 →