UV-curable resin composition enabling thermoforming and replica film of real material comprising same

1. A UV-curable resin composition, comprising:

a prepolymer including a urethane-based oligomer and an acrylic oligomer;

an acrylate monomer; and

a photoinitiator;

wherein the prepolymer comprises 10 wt % to 40 wt % of a first urethane-based oligomer including a bifunctional aliphatic urethane acrylate, 5 wt % to 30 wt % of a second urethane-based oligomer including a trifunctional aliphatic urethane acrylate, and 1 wt % to 15 wt % of an acrylic oligomer;

wherein the acrylate monomer comprises 10 wt % to 30 wt % of tetrahydrofurfuryl acrylate, 5 wt % to 20 wt % of isobornyl acrylate, and 1 wt % to 10 wt % of hydroxyl pivalic acid neopentyl glycol diacrylate; and

wherein the photoinitiator comprises 1 wt % to 5 wt % of a short-wavelength photoinitiator and 0.5 wt % to 1 wt % of a long-wavelength photoinitiator;

wherein the wt % is based on a total weight of the UV-curable resin composition.

2. The UV-curable resin composition of claim 1 , wherein the urethane-based oligomer and the acrylic oligomer contain an acrylate end group.

3. The UV-curable resin composition of claim 1 , wherein the urethane-based oligomer includes:

a first urethane-based oligomer obtained by reacting a polymer of a first isocyanate and a polyol with a reactive monomer; and

a second urethane-based oligomer obtained by reacting a polymer of a second isocyanate and a polyol with a reactive monomer.

4. The UV-curable resin composition of claim 3 , wherein the first isocyanate is selected from the group consisting of toluene diisocyanate (TDI), naphthalene-1,5-diisocyanate, p-phenylene diisocyanate, toluidine diisocyanate, 4,4′-diphenyl methane diisocyanate, 4,4′-methylene dicyclohexyl diisocyanate, hexamethylene diisocyanate, dicyclohexylmethane diisocyanate, isophorone diisocyanate and combinations thereof.

5. The UV-curable resin composition of claim 3 , wherein the second isocyanate includes a trifunctional triisocyanate having an isocyanurate structure.

6. The UV-curable resin composition of claim 3 , wherein the polyol of each of the first urethane-based oligomer and the second urethane-based oligomer includes polyester polyol.

7. The UV-curable resin composition of claim 3 , wherein the reactive monomer of each of the first urethane-based oligomer and the second urethane-based oligomer is selected from the group consisting of 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, pentaerythritol triacrylate and combinations thereof.

8. The UV-curable resin composition of claim 3 , wherein the first urethane-based oligomer has a weight average molecular weight of 2,000 g/mol to 5,000 g/mol and the second urethane-based oligomer has a weight average molecular weight of 1,000 g/mol to 4,000 g/mol.

9. The UV-curable resin composition of claim 1 , wherein the acrylic oligomer includes acrylic acrylate.

10. The UV-curable resin composition of claim 1 , wherein the acrylic oligomer has a weight average molecular weight of 40,000 g/mol to 70,000 g/mol.

11. The UV-curable resin composition of claim 1 , further comprising an additive selected from the group consisting of a UV stabilizer, a heat-resistant stabilizer and combinations thereof.

12. A replica film of a real material, comprising:

a substrate layer; and

a resin layer formed on the substrate layer and including a first surface facing the substrate layer and a second surface opposite the first surface, the second surface having the same surface pattern as a surface pattern of the real material, and

wherein the resin layer includes the UV-curable resin composition of claim 1 .

13. The replica film of claim 12 having flexibility with a radius of curvature of 0.5 mm to 10 mm.

14. A method of manufacturing a replica film of a real material, the method comprising:

obtaining a stack by forming a resin layer including the UV-curable resin composition of claim 1 on a substrate layer;

forming the same surface pattern as a surface pattern of the real material on a surface of the resin layer included in the stack; and

subjecting the stack to thermoforming.

15. The method of claim 14 , wherein the stack is subjected to thermoforming in a state in which the following conditions 1) to 3) are satisfied:

1) A mold temperature of higher than 130° C. to lower than 150° C.;

2) A hot-plate temperature of 140° C. to 150° C.; and

3) a pressing time of longer than 15 sec to 20 sec or less.

16. The method of claim 15 , wherein the replica film has flexibility with a radius of curvature of 0.5 mm to 10 mm.