Curable composition
A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, X 1 being C 1 -C 6 substituted or unsubstituted alkyl, X 2 being CH 3 or H, After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.
1. A curable composition comprising:
a polymerizable material consisting essentially of a monomer of Formula (1):
wherein R is H or alkyl or alkylaryl, n being 1-4, m is 0-6, X 1 is C 1 -C 6 alkyl, X 2 is CH 3 or H; and
at least one second acrylate monomer different from the monomer of Formula (1),
wherein
an amount of the monomer of Formula (1) is at least 5 wt % and not greater than 30 wt % based on the total weight of the curable composition;
an amount of the at least one second monomer is at least 50 wt % based on the total weight of the curable composition; and
a viscosity of the curable composition is not greater than 20 mPa s.
2. The curable composition of claim 1 , wherein the monomer of Formula (1) includes a di-functional acrylate monomer.
3. The curable composition of claim 2 , wherein the di-functional acrylate monomer includes a structure of Formula (2):
4. The curable composition of claim 1 , wherein an amount of the polymerizable material is at least 80 wt % and not greater than 98 wt % based on the total weight of the curable composition.
5. The curable composition of claim 1 , wherein the at least one second acrylate monomer is selected from the group consisting of benzyl acrylate (BA), or isobornyl acrylate (IBOA), or neopentyl glycol diacrylate (A-NPG), and any combination thereof.
6. The curable composition of claim 1 , wherein the composition has a viscosity not greater than 15 mPa s.
7. The curable composition of claim 1 , further comprising a photo-initiator.
8. The curable composition of claim 1 , wherein the curable composition is adapted for use as a resist in a nanoimprint lithographic process.
9. The curable composition of claim 1 , wherein an Ohnishi number of the curable composition after curing is not greater than 3.6.
10. A laminate comprising a substrate and a cured layer overlying the substrate, wherein the cured layer is formed from the curable composition of claim 1 .
11. The laminate of claim 10 , wherein the cured layer has an Ohnishi number of not greater than 3.6.
12. A method of forming a cured layer on a substrate, comprising:
applying a curable composition on a substrate, wherein the curable composition comprises a polymerizable material including a monomer having a structure of Formula (1):
wherein R is H or alkyl or alkylaryl, n is 1-4, m is 0-6, X 1 is C 1 -C 6 alkyl, X 2 is CH 3 or H; and at least one second acrylate monomer different from the monomer of Formula (1), wherein an amount of the monomer of Formula (1) is at least 5 wt % and not greater than 30 wt % based on the total weight of the curable composition, an amount of the at least one second monomer is at least 50 wt % based on the total weight of the curable composition, and a viscosity of the curable composition is not greater than 20 mPa s;
bringing the curable composition into contact with a superstrate;
curing the curable composition with light and/or heat to form a cured layer; and
removing the superstrate from the cured layer.
13. The method of claim 12 , wherein a viscosity of the curable composition is not greater than 15 mPa s.
14. The method of claim 12 , wherein the monomer of Formula (1) includes a structure of Formula (2)
15. A method of manufacturing an article, comprising:
applying a curable composition on a substrate, wherein the curable composition comprises a polymerizable material including a monomer having a structure of Formula (1):
wherein R is H or alkyl or alkylaryl, n is 1-4, m is 0-6, X 1 is C 1 -C 6 alkyl, X 2 is CH 3 or H; and at least one second acrylate monomer different from the monomer of Formula (1), wherein an amount of the monomer of Formula (1) is at least 5 wt % and not greater than 30 wt % based on the total weight of the curable composition, an amount of the at least one second monomer is at least 50 wt % based on the total weight of the curable composition, and a viscosity of the curable composition is not greater than 20 mPa s;
bringing the curable composition into contact with a superstrate;
curing the curable composition with light and/or heat to form a cured layer; and
removing the superstrate from the cured layer;
removing the superstrate from the photo-cured layer; and
processing the substrate with the photo-cured layer to make the article.
16. The method of claim 15 , wherein the viscosity of the curable composition is not greater than 15 mPa·s.