Optoelectronic component and method for producing an optoelectronic component
View Patent ↗An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover including at least two second contact points, wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is provided.
1. An optoelectronic component comprising:
a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation,
a carrier comprising at least two first contact points,
a cover comprising at least two second contact points, and
a third contact point arranged on a top surface of the semiconductor chip, wherein
the cover comprises a cavity,
a top surface delimiting the cavity of the cover faces the semiconductor chip and is arranged perpendicular to the radiation exit surface of the semiconductor chip,
the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires,
the top surface delimiting the cavity has a further second contact point,
the further second contact point and the third contact point are electrically conductively and/or thermally conductively connected to one another by a third plurality of nanowires and a fourth plurality of nanowires, and
the nanowires provide a mechanically stable connection between the carrier and the cover.
2. The optoelectronic component according to claim 1 , in which
the first contact points comprise the first plurality of nanowires and the second contact points comprise the second plurality of nanowires, wherein
the first plurality of nanowires and the second plurality of nanowires are inserted into one another along a main direction of extension so that the mechanically stable connection is mediated.
3. The optoelectronic component according to claim 1 ,
in which the nanowires have one of the following materials: copper, gold, silver, platinum, nickel, tin.
4. The optoelectronic component according to claim 1 ,
in which a distance from the further second contact point to the third contact point is different from the distance of the at least two first contact points to the at least two second contact points.
5. The optoelectronic component according to claim 1 , in which
the semiconductor chip is arranged on a mounting element,
the mounting element has a fourth contact point on a side facing away from the semiconductor chip,
the carrier has a further first contact point, and
the further first contact point and the fourth contact point are electrically conductively and/or thermally conductively connected to one another by a fifth plurality of nanowires and a sixth plurality of nanowires.
6. The optoelectronic component according to claim 5 , wherein
a coating covers an inner side of the cover facing the carrier in an electrically conductive and/or thermally conductive manner at least in some areas, wherein
the second contact points and the further second contact point are part of the coating.
7. The optoelectronic component according to claim 6 ,
in which the inner surface of the cover is completely covered by the coating.
8. The optoelectronic component according to claim 1 , in which
the cover has a frame, which laterally surrounds the semiconductor chip, and
the cover has a cover plate which is arranged on the frame.
9. The optoelectronic component according to claim 8 , in which
a contact completely penetrates the frame in vertical direction, wherein
the contact connects at least one of the second contact points and the further second contact point in an electrically conductive and/or thermally conductive manner.
10. The optoelectronic component according to claim 8 ,
in which the cover plate is transparent to visible light.
11. The optoelectronic component according to claim 1 , in which
the semiconductor chip is an edge-emitting semiconductor laser chip, and
an optical element is attached to the radiation exit surface by means of an intermediate layer.
12. The optoelectronic component according to claim 11 ,
in which a micro resonator is embedded in the intermediate layer.
13. The optoelectronic component according to claim 11 , in which
an outer surface of the optical element is covered with a conversion layer.
14. The optoelectronic component according to claim 1 , wherein the optoelectronic component
comprises a dielectric filter and a holder, wherein
the holder has a radiation entrance surface and a radiation exit surface, and
the dielectric filter is transparent to the electromagnetic radiation of the semiconductor chip and opaque to a converted radiation of another wavelength range.
15. The optoelectronic component according to claim 14 , wherein
the dielectric filter is arranged on the radiation entrance surface or the radiation exit surface of the holder, and
a conversion element is arranged at the radiation exit surface of the holder, which at least partially converts electromagnetic radiation of the semiconductor chip into electromagnetic radiation of another wavelength range.
16. The optoelectronic component according to claim 14 , in which
the carrier projects laterally beyond the radiation exit surface, and
the holder and the carrier are thermally conductively connected to one another by a seventh plurality of nanowires and an eighth plurality of nanowires.
17. A method for producing an optoelectronic component with the following steps:
providing a carrier comprising at least two first contact points,
applying a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, to the carrier,
applying a cover comprising at least two second contact points to the carrier, wherein
the at least two first contact points and two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires, and
the first plurality of nanowires and the second plurality ( 6 b ) of nanowires provide a mechanically stable connection between the carrier and the cover.
18. The method according to claim 17 , wherein
the first plurality of nanowires and the second plurality of nanowires are pressed together at room temperature with a pressure in the vertical direction of between 1 MPa and 50 MPa inclusive for a period of between 0.5 s and 5 s inclusive when the cover is applied to the carrier.
19. An optoelectronic component comprising:
a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation,
a carrier comprising at least two first contact points, and
a cover comprising at least two second contact points, and
a third contact point arranged on a top surface of the semiconductor chip, wherein
the cover comprises a cavity,
a top surface delimiting the cavity of the cover faces the semiconductor chip and is arranged perpendicular to the radiation exit surface of the semiconductor chip,
the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires,
the top surface delimiting the cavity has a further second contact point,
the further second contact point and the third contact point are electrically conductively and/or thermally conductively connected to one another by a third plurality of nanowires and a fourth plurality of nanowires, and
the nanowires provide a mechanically stable connection between the carrier and the cover.