IP Library Granted Patent US 11,419,278
Granted Patent B2
US 11,419,278 · App. 17/043,669 · Granted Aug 23, 2022

LED light source for supplemental lighting for plants and lamp with light source

Inventors: Xuke Li (Hangzhou, CN); Xiang Pan (Hangzhou, CN)
Assignee: HANGZHOU HANHUl OPTOELECTRONIC TECHNOLOGY CO., LTD.
A01G7/045H01L25/0753H01L33/504
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Quick Facts
Patent No.
US 11,419,278
App. No.
17/043,669
Granted
Aug 23, 2022
Kind
B2
Abstract

An upside-down type LED light source for supplemental lighting for plants includes a substrate, an LED chip, a first glue powder layer, and a second glue powder layer; the LED chip is mounted on one surface of the substrate; the LED chip being a blue LED chip; the first glue powder layer is disposed between the LED chip and the substrate, and the LED chip is covered by the second glue powder layer; the LED chip is fixed on the substrate through the first glue powder layer, wherein the first glue powder is a mixture of a glue and red phosphors; and the second glue powder layer covers the LED chip and completely wraps the LED chip; the second glue powder layer is one of a mixture of the glue and yellow phosphors, and a mixture of the glue and infrared phosphors.

Claims (29)

1. An upside-down type LED light source for supplemental lighting for plants, wherein the upside-down type LED light source comprises a substrate, an LED chip, a first glue powder layer, and a second glue powder layer;

the LED chip is mounted on one surface of the substrate; the LED chip is a blue LED chip;

the first glue powder layer is disposed between the LED chip and the substrate, and the LED chip is covered by the second glue powder layer;

the LED chip is fixed on the substrate through the first glue powder layer, wherein the first glue powder is a mixture of a glue and red phosphors; and

the second glue powder layer covers the LED chip and completely wraps the LED chip; the second glue powder layer is one of a mixture of the glue and yellow phosphors, and a mixture of the glue and infrared phosphors,

wherein a thickness of the first glue powder layer is 0.1 mm-0.5 mm, and a thickness of the second glue powder layer is 0.1 mm-0.9 mm, so that a ratio of photon flux densities of red light of 600 nm-680 nm, blue light of 420 nm-480 nm, infrared light, green light, and ultraviolet light is in a range of (70-90):(10-30):(1-30):(5-20):(0.01-1.

2. The upside-down type LED light source for supplemental lighting for plants according to claim 1 , wherein a weight ratio of the glue to the red phosphors is 100:10-150.

3. The upside-down type LED light source for supplemental lighting for plants according to claim 1 , wherein a weight ratio of the glue to the yellow phosphors is 100:10-30.

4. The upside-down type LED light source for supplemental lighting for plants according to claim 1 , wherein a weight ratio of the glue to the infrared phosphors is 100:10-40.

5. The upside-down type LED light source for supplemental lighting for plants according to claim 1 , wherein the blue LED chip is one of the LED chip having a luminescence peak in a range of 400 nm to 480 nm, and a combination of multi-wavelength blue LED chips with a luminescence peak in the range of 400 nm to 480 nm.

6. A lamp, comprising the upside-down type LED light source for supplemental lighting for the plants according to claim 1 .

7. The lamp according to claim 6 , wherein a weight ratio of the glue to the red phosphors is 100:10-150.

8. The lamp according to claim 6 , wherein a weight ratio of the glue to the infrared phosphors is 100:10-40.

9. The lamp according to claim 6 , wherein a weight ratio of the glue to the yellow phosphors is 100:10-40.

10. The lamp according to claim 6 , wherein the blue LED chip is one of the LED chip having a luminescence peak in a range of 400 nm to 480 nm, and a combination of multi-wavelength blue LED chips with a luminescence peak in the range of 400 nm to 480 nm; and the ultraviolet LED chip is the LED chip having a luminescence peak in a wavelength range of 320 nm to 400 nm.

11. An upside-down type LED device for supplemental lighting for plants, wherein the upside-down type LED device comprises a substrate, an LED chip, a first glue powder layer, and a second glue powder layer;

the LED chip is mounted on one surface of the substrate; the LED chip comprising at least one selected from the list consisting of a blue LED chip, an ultraviolet LED chip, and a combination of the blue LED chip and the ultraviolet LED chip;

the first glue powder layer is disposed between the LED chip and the substrate, and the LED chip is covered by the second glue powder layer;

the LED chip is fixed on the substrate through the first glue powder layer, wherein the first glue powder layer is a mixture of a glue and infrared phosphors, of a mixture of the glue and yellow phosphors; and

the second glue powder layer covers the LED chip and completely wraps the LED chip; the second glue powder layer being a mixture of the glue and red phosphors,

wherein a thickness of the first glue powder layer is 0.1 mm-0.5 mm, and a thickness of the second glue powder layer is 0.1 mm-0.9 mm, so that a ratio of photon flux densities of red light of 600 nm-580 nm, blue light of 420 nm-480 nm, infrared light, green light, and ultraviolet light is in a range of (70-90):(10-30):(1-30):(5-20):(0.01-1).

12. The upside-down type LED device for supplemental lighting, for plants according to claim 11 , wherein a weight ratio of the glue to the red phosphors is 100:10-150.

13. The upside-down type LED device for supplemental lighting for plants according to claim 11 , wherein a weight ratio of the glue to the infrared phosphors is 100:10-40.

14. The upside-down type LED device for supplemental lighting for plants according to claim 11 , wherein a weight ratio of the glue to the yellow phosphors is 100:10-40.

15. The upside-down type LED device for supplemental lighting for plants according to claim 11 , wherein the blue LED chip is one of the LED chip having a luminescence peak in a range of 400 nm to 480 nm, and a combination of multi-wavelength blue LED chips with a luminescence peak in the range of 400 nm to 480 nm; and the ultraviolet LED chip is the LED chip having a luminescence peak in a wavelength range of 320 nm to 400 nm.

16. A lamp, comprising the upside-down type LED light device for supplemental lighting for the plants according to claim 11 .

17. The lamp according to claim 16 , wherein a weight ratio of the glue to the red phosphors is 100:10-450.

18. The lamp according to claim 16 , wherein a weight ratio of the glue to the infrared phosphors is 100:10-40.

19. The lamp according to claim 16 , wherein a weight ratio of the glue to the yellow phosphors is 100:10-40.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2024
From: HANGZHOU HANHUI OPTOELECTRONIC TECHNOLOGY CO., LTD.
To: HANGZHOU LANGTUO BIOTECHNOLOGY CO., LTD.
Reel/Frame 068642/0480 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2020
From: LI, XUKE; PAN, XIANG
To: HANGZHOU HANHUI OPTOELECTRONIC TECHNOLOGY CO., LTD.
Reel/Frame 053941/0445 →
Priority Claims (4)
CN 201811399092.X · Nov 22, 2018 · national
CN 201811399094.9 · Nov 22, 2018 · national
CN 201811400237.3 · Nov 22, 2018 · national
CN 201811400238.8 · Nov 22, 2018 · national
Continuity (1)
Related Publication 20210015052A1 · Jan 21, 2021