Power conversion device including cooling components
The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.
1. A power conversion device, comprising:
a housing that supports each constituent member;
a substrate, fixed to the housing, on which an electronic part is mounted, and extending in a horizontal direction;
a capacitor disposed between the housing and the substrate;
a multiple of semiconductor elements, attached onto the housing, that form an electrical circuit together with the capacitor;
a bus bar that has a heat dissipating portion and supplies power by connecting the capacitor and the semiconductor element to the substrate, wherein the heat dissipating portion includes a first end portion extending in the horizontal direction, and a second end portion extending in a vertical direction and passing through a gap between the substrate and the housing in the vertical direction;
a coolant path, provided on a lower face of the housing, along which a coolant that cools the housing is caused to flow;
a first heat conducting member that thermally couples the bus bar and the housing;
a second heat conducting member that thermally couples the capacitor and the housing; and
a third heat conducting member that thermally couples the semiconductor element and the housing, wherein
each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.
2. The power conversion device according to claim 1 , wherein the first heat conducting member and the second heat conducting member are of the same material.
3. The power conversion device according to claim 2 , wherein the bus bar is connected in at least one place to the semiconductor element.
4. The power conversion device according to claim 3 , wherein a multiple of the capacitor are mounted on the substrate.
5. The power conversion device according to claim 3 , wherein the housing has a protruding portion extended to a substrate side in the vertical direction, and the substrate is fixed to the protruding portion.
6. The power conversion device according to claim 2 , wherein the bus bar is connected in at least one place to the substrate.
7. The power conversion device according to claim 2 , wherein a multiple of the capacitor are mounted on the substrate.
8. The power conversion device according to claim 2 , wherein the housing has a protruding portion extended to a substrate side in the vertical direction, and the substrate is fixed to the protruding portion.
9. The power conversion device according to claim 2 , wherein the first heat conducting member or the second heat conducting member is provided between multiple faces of each of the heat dissipating portion of the bus bar, the capacitor, the housing, and a protruding portion of the housing.
10. The power conversion device according to claim 1 , wherein the bus bar is connected in at least one place to the semiconductor element.
11. The power conversion device according to claim 10 , wherein the bus bar is connected in at least one place to the substrate.
12. The power conversion device according to claim 11 , wherein the bus bar has a bipolar configuration of a positive pole and a negative pole, and the heat dissipating portion is provided in each pole, and
wherein the positive pole and the negative pole are spaced apart from each other in the horizontal direction, while extending in the vertical direction to be parallel with each other.
13. The power conversion device according to claim 11 , wherein the bus bar has a bipolar configuration of a positive pole and a negative pole, and a quantity of the heat dissipating portion differs between poles, and
wherein the positive pole and the negative pole are spaced apart from each other in the horizontal direction, while extending in the vertical direction to be parallel with each other.
14. The power conversion device according to claim 10 , wherein a multiple of the capacitor are mounted on the substrate.
15. The power conversion device according to claim 10 , wherein the housing has a protruding portion extended to a substrate side in the vertical direction, and the substrate is fixed to the protruding portion.
16. The power conversion device according to claim 1 , wherein the bus bar is connected in at least one place to the substrate.
17. The power conversion device according to claim 16 , wherein the housing has a protruding portion extended to a substrate side in the vertical direction, and the substrate is fixed to the protruding portion.
18. The power conversion device according to claim 1 , wherein a multiple of the capacitor are mounted on the substrate.
19. The power conversion device according to claim 1 , wherein the housing has a protruding portion extended to a substrate side in the vertical direction, and the substrate is fixed to the protruding portion.
20. The power conversion device according to claim 1 , wherein the heat dissipating portion of the bus bar is provided in multiple places.