Polyimide, laminate, and electronic device including same

1. A polyimide film-based flexible electronic device substrate formed from a polyimide that does not comprise a compound including a Si-containing group, wherein the polyimide has a maximum gradient of 0.005/V or more in a capacitance-voltage measurement of a laminate in which a polyimide film having a film thickness of 0.75 μm is formed on a silicon wafer having a resistance value of 4 Ωcm; wherein the maximum gradient is a maximum value of an absolute value of a gradient in a normalized capacity-voltage curve during a third scan of forward direction scans; wherein a capacity-voltage curve is measured by applying a direct current voltage to the polyimide film with respect to the silicon wafer between a lowest voltage V 1 and a highest voltage V 2 , and measuring capacitance while the direct current voltage is scanned in a forward direction from the lowest voltage V 1 to the highest voltage V 2 and scanned in a negative direction from the highest voltage V 2 to the lowest voltage V 1 ; where the lowest voltage V 1 is a voltage at which the capacity of only the polyimide film is observed, and the normalized capacity-voltage curve is normalized so that the capacity at the lowest voltage V 1 is 1.

2. The polyimide film-based flexible electronic device substrate according to claim 1 , wherein a weight ratio of an imide group (—CONCO—) in a repeating unit of the polyimide is less than 38.3 wt %.

3. The polyimide film-based flexible electronic device substrate according to claim 1 , wherein the concentration of amine end groups calculated from a feed ratio in the entire polyimide is 29 μmol/g or less.

4. A polyimide precursor comprising a repeating unit which is obtainable by reacting:

a tetracarboxylic acid component (A) comprising at least 3,3′, 4,4′-biphenyltetracarboxylic dianhydride, and

a diamine component (B) comprising:

(B-1) at least one diamine selected from the group consisting of 1,4-diaminobenzene, [1.1′: 4′,1″-terphenyl]-4,4″-diamine, and 1,4-bis [2-(4-aminophenyl)-2-propyl]benzene, and

(B-2) at least one diamine selected from the group consisting of 9,9-bis (4-aminophenyl) fluorene, 4,4′-(49H-fluorene-9,9-diyl)bis([1,1′-biphenyl]-5,2-diyl))bis(oxy))diamine, and 4,4′-([1,1′-binaphthalene]-2,2′-diylbis(oxy))diamine,

with the proviso that when the diamine component (B) comprises 1,4-diaminobenzene and 9,9-bis(4-aminophenyl)fluorene), the amount of diamine compound(s) other than the diamine of (B-1) and the diamine (B-2) is 20 mol % or less, with the proviso that the repeating unit does not include a Si-containing group.

5. The polyimide precursor according to claim 4 , wherein the diamine component (B) comprises the diamine of (B-1) and the diamine of (B-2) in an amount of 40 mol % or more in total.

6. The polyimide precursor according to claim 4 , wherein a sum of ratios of the repeating units derived from 3,3′, 4,4′-biphenyltetracarboxylic dianhydride and the diamine (B-1) and the repeating units derived from 3,3′, 4,4′-biphenyltetracarboxylic dianhydride and the diamine (B-2) is 40 mol % or more.

7. A polyimide obtained by imidizing the polyimide precursor according to claim 4 .

8. A polyimide film comprising the polyimide according to claim 7 .

9. A flexible electronic device comprising the polyimide film according to claim 1 .

10. The flexible electronic device according to claim 9 , wherein the substrate is formed from the polyimide film according to claim 8 .

11. A method for manufacturing a flexible electronic device according to claim 9 , comprising:

applying a polyimide precursor solution or a polyimide precursor solution composition onto a carrier substrate, and performing imidization to form a laminate having a carrier substrate and a polyimide film that becomes the substrate.