Curable silicone composition and cured product thereof
A curable silicone composition is disclosed herein. The curable silicone composition comprises: (A) an alkenyl group-containing organopolysiloxane comprising (A 1 ) a linear organopolysiloxane having at least two alkenyl groups per molecule, and (A 2 ) a resinous organopolysiloxane; (B) a silicon atom-bonded hydrogen atom-containing organopolysiloxane comprising (B 1 ) a resinous organopolysiloxane, (B 2 ) a linear or partially branched organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having not less than 0.5 mass % of silicon atom-bonded hydrogen atoms, and (B 3 ) a linear organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having less than 0.5 mass % of silicon atom-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst. The curable silicone composition can be cured to form a cured product generally exhibiting good elongation and tensile strength.
1. A curable silicone composition, comprising:
(A) an alkenyl group-containing organopolysiloxane comprising the following components (A 1 ) and (A 2 ):
(A 1 ) a linear organopolysiloxane having at least two alkenyl groups per molecule, and
(A 2 ) a resinous organopolysiloxane comprising SiO 4/2 units, R 1 2 R 2 SiO 1/2 units, and R 1 3 SiO 1/2 units, wherein each R 1 is an independently selected monovalent hydrocarbon group free of aliphatic unsaturated bonds, and each R 2 independently is an alkenyl group, provided that a content of the alkenyl groups in component (A 2 ) is 0.5 to 5.0 mass %, and wherein a ratio of the total number of moles of the R 1 2 R 2 SiO 1/2 units and R 1 3 SiO 1/2 units to 1 mole of the SiO 4/2 units is in a range of from 0.70 to 1.10,
wherein a content of component (A 2 ) is in an amount of from 45 to 65 mass % of total mass of components (A 1 ) and (A 2 );
(B) a silicon atom-bonded hydrogen atom-containing organopolysiloxane comprising the following components (B 1 ) to (B 3 ), in an amount such that the silicon atom-bonded hydrogen atoms in component (B) is 0.1 to 5 moles per 1 mole of the alkenyl groups in component (A):
(B 1 ) a resinous organopolysiloxane comprising SiO 4/2 units and R 1 2 HSiO 1/2 units, wherein R 1 are as described above, and wherein a ratio of the total number of moles of the R 1 2 HSiO 1/2 units to 1 mole of the SiO 4/2 units is in a range of from 0.70 to 1.80,
(B 2 ) a linear or partially branched organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having not less than 0.5 mass % of silicon atom-bonded hydrogen atoms, and
(B 3 ) a linear organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having less than 0.5 mass % of silicon atom-bonded hydrogen atoms,
wherein a content of component (B 1 ) is in an amount of from 50 to 90 mass % of total mass of components (B 1 ) to (B 3 ), a content of component (B 2 ) is in an amount of from 1 to 30 mass % of total mass of components (B 1 ) to (B 3 ), and a content of component (B 3 ) is in an amount of from 1 to 30 mass % of total mass of components (B 1 ) to (B 3 ); and
(C) a hydrosilylation reaction catalyst, in a catalytic quantity.
2. The curable silicone composition according to claim 1 , wherein component (B 2 ) is an organopolysiloxane selected from the group consisting of a linear methylhydrogenpolysiloxane endblocked at both molecular chain terminals with trimethylsiloxy groups, a partially branched methylhydrogenpolysiloxane endblocked at molecular chain terminals with trimethylsiloxy groups, and a mixture thereof.
3. The curable silicone composition according to claim 2 , wherein component (B 3 ) is an organopolysiloxane selected from the group consisting of a copolymer of dimethylsiloxane and methylhydrogensiloxane endblocked at both molecular chain terminals with dimethylhydrogensiloxy groups, a dimethylpolysiloxane endblocked at both molecular terminals with dimethylhydrogensiloxy groups, and a mixture thereof.
4. The curable silicone composition according to claim 3 , further comprising:
(D) a hydrosilylation reaction inhibitor, in an amount of from 0.001 to 5 parts by mass per 100 parts by mass of component (A).
5. The curable silicone composition according to claim 2 , further comprising:
(D) a hydrosilylation reaction inhibitor, in an amount of from 0.001 to 5 parts by mass per 100 parts by mass of component (A).
6. The curable silicone composition according to claim 1 , wherein component (B 3 ) is an organopolysiloxane selected from the group consisting of a copolymer of dimethylsiloxane and methylhydrogensiloxane endblocked at both molecular chain terminals with dimethylhydrogensiloxy groups, a dimethylpolysiloxane endblocked at both molecular terminals with dimethylhydrogensiloxy groups, and a mixture thereof.
7. The curable silicone composition according to claim 6 , further comprising:
(D) a hydrosilylation reaction inhibitor, in an amount of from 0.001 to 5 parts by mass per 100 parts by mass of component (A).
8. The curable silicone composition according to claim 1 , further comprising:
(D) a hydrosilylation reaction inhibitor, in an amount of from 0.001 to 5 parts by mass per 100 parts by mass of component (A).
9. A cured product obtained by curing the curable silicone composition described in claim 1 .