Electronic semiconductor component and method for producing an electronic semiconductor component
An electronic semiconductor component with a housing structure and a cavity introduced into the housing structure is specified. The cavity comprises a base surface. Furthermore, the electronic semiconductor component comprises an auxiliary layer arranged on the base surface of the cavity and a marking penetrating the auxiliary layer at least as far as the base surface of the cavity. The marking comprises an optical contrast that depends on both an optical property of the housing structure and an optical property of the auxiliary layer. Furthermore, a method for producing an electronic semiconductor component is given.
1. An electronic semiconductor component with
a housing structure comprising a leadframe,
a cavity inserted into the housing structure, which comprises a base surface,
an auxiliary layer disposed on the base surface of the cavity, and
a marking penetrating the auxiliary layer to at least the base surface of the cavity, wherein the marking comprises an optical contrast which depends on both an optical property of the housing structure and an optical property of the auxiliary layer.
2. The electronic semiconductor component according to claim 1 , wherein the optical contrast of the marking is increased by the auxiliary layer.
3. The electronic semiconductor component according to claim 1 , in which the marking penetrates the auxiliary layer in such a way that underlying regions of the housing structure are exposed.
4. The electronic semiconductor component according to claim 1 , in which the auxiliary layer comprises ablation marks of a laser ablation process.
5. The electronic semiconductor component according to claim 1 , in which the optical property is the average absorption or maximum absorption in a predetermined wavelength range.
6. The electronic semiconductor component according to claim 1 , in which the cavity is at least 100 μm deep.
7. The electronic semiconductor component according to claim 1 , in which the auxiliary layer is formed with at least one of the following materials: resin, silicone, plastic.
8. The electronic semiconductor component according to claim 1 , in which the auxiliary layer comprises a dark grey or black appearance.
9. The electronic semiconductor component according to claim 1 , in which the auxiliary layer is formed as a molded layer.
10. A method for producing an electronic semiconductor component according to claim 1 , wherein the auxiliary layer is placed in the cavity by one of the following methods: jetting, dispensing, doctor blading, molding.
11. A method for producing an electronic semiconductor component according to claim 1 , wherein the housing structure and the auxiliary layer are produced in a single method step.
12. A production of an electronic semiconductor component with a housing structure according to claim 1 , wherein
a marking is introduced into the cavity of the housing structure by means of a laser ablation process, and
the marking is read and processed automatically.
13. An electronic semiconductor component with
a housing structure,
a cavity inserted into the housing structure, which comprises a base surface,
an auxiliary layer disposed on the base surface of the cavity, and
a marking penetrating the auxiliary layer to at least the base surface of the cavity, wherein the marking comprises an optical contrast which depends on both an optical property of the housing structure and an optical property of the auxiliary layer,
wherein the electronic semiconductor component is an optoelectronic semiconductor component intended for emission or detection of electromagnetic radiation.