Optoelectronic component and the connectivity thereof
The invention relates to an optoelectronic component having: a carrier; an optoelectronic semiconductor chip; an insulation layer, which has an electrically insulating material; and a first contact layer, which has an electrically conductive material. According to the invention, the insulation layer is arranged on the carrier and has a cavity; the semiconductor chip is arranged in the cavity; the first contact layer is arranged between the semiconductor chip and the carrier and between the insulation layer and the carrier; and the first contact layer has at least one interruption, such that the carrier is free of the first contact layer at least in some parts in the region of the cavity.
1. An optoelectronic component, comprising:
a carrier,
an optoelectronic semiconductor chip,
an insulating layer which has an electrically insulating material, and
a first contact layer which has an electrically conductive material,
wherein
the insulating layer is arranged on the carrier and has a cavity,
the optoelectronic semiconductor chip is arranged in the cavity,
the first contact layer is arranged between the optoelectronic semiconductor chip and the carrier and between the insulating layer and the carrier,
the first contact layer has at least one interruption, such that the carrier is free of the first contact layer at least in places in a region of the cavity, in which a third contact layer, which has an electrically conductive material, is arranged at least in places on a top side of the insulating layer facing away from the carrier,
the cavity has side walls which are perpendicular to a main extension plane of the carrier,
the cavity extends completely through the insulating layer from a top side facing away from the carrier to the carrier,
a second contact layer, which has an electrically conductive material, is arranged at least in places on an underside of the carrier facing away from the insulating layer and has at least one interruption, so that the carrier is free of the second contact layer at least in places in the region of the cavity,
the carrier comprises at least one area in the region of the cavity which is free of the first contact layer, the second contact layer and the optoelectronic semiconductor chip,
the carrier is free of the second contact layer on the underside of the carrier facing away from the insulating layer in the at least one area,
a fourth contact layer electrically connected to the second contact layer through at least one via in the insulating layer; and
the optoelectronic semiconductor chip is protruded over by the insulating layer in a vertical direction or ends flush therewith, wherein the vertical direction is perpendicular to a main extension plane of the optoelectronic component.
2. The optoelectronic component according to claim 1 , in which the optoelectronic semiconductor chip and the insulating layer are arranged without contact to each other.
3. The optoelectronic component according to claim 1 , in which the first contact layer is electrically conductively connected to the second contact layer.
4. The optoelectronic component according to claim 1 , in which the optoelectronic semiconductor chip has electrical contacts on a side facing away from the carrier.
5. The optoelectronic component according to claim 4 , in which the electrical contacts of the optoelectronic semiconductor chip are electrically conductively connected to electrical connections on the underside of the carrier facing away from the insulating layer.
6. The optoelectronic component according to claim 1 , which is surface mountable.
7. The optoelectronic component according to claim 1 , which is free of an electrically conductive layer extending over an entire extent of the optoelectronic component in a lateral direction, wherein the lateral direction being parallel to the main extension plane of the optoelectronic component.
8. The optoelectronic component of claim 1 , wherein the top side of the insulating layer is at least partially free of the third contact layer.
9. An optoelectronic component, comprising:
a carrier,
an optoelectronic semiconductor chip,
an insulating layer which has an electrically insulating material, and
a first contact layer which has an electrically conductive material,
wherein
the insulating layer is arranged on the carrier and has a cavity,
the optoelectronic semiconductor chip is arranged in the cavity,
the first contact layer is arranged between the optoelectronic semiconductor chip and the carrier and between the insulating layer and the carrier,
the first contact layer has at least one interruption, such that the carrier is free of the first contact layer at least in places in a region of the cavity, in which a third contact layer, which has an electrically conductive material, is arranged at least in places on a top side of the insulating layer facing away from the carrier,
the cavity has side walls which are perpendicular to a main extension plane of the carrier from the top side of the insulating layer to the carrier,
the cavity extends completely through the insulating layer from a top side facing away from the carrier to the carrier,
a second contact layer, which has an electrically conductive material, is arranged at least in places on an underside of the carrier facing away from the insulating layer and has at least one interruption, so that the carrier is free of the second contact layer at least in places in the region of the cavity,
the third contact layer is not located in the region of the cavity, and
a fourth contact layer electrically connected to the second contact layer through at least one via in the insulating layer,
in which the optoelectronic semiconductor chip is protruded over by the insulating layer in a vertical direction or ends flush therewith, wherein the vertical direction is perpendicular to a main extension plane of the optoelectronic component.
10. The optoelectronic component according to claim 9 , wherein the optoelectronic component is free of an electrically conductive layer extending over an entire extent of the optoelectronic component in a lateral direction, the lateral direction being parallel to the main extension plane of the optoelectronic component.
11. An optoelectronic component, comprising:
a carrier,
an optoelectronic semiconductor chip,
an insulating layer which has an electrically insulating material, and
a first contact layer which has an electrically conductive material,
wherein
the insulating layer is arranged on the carrier and has a cavity,
the optoelectronic semiconductor chip is arranged in the cavity,
the first contact layer is arranged between the optoelectronic semiconductor chip and the carrier and between the insulating layer and the carrier,
the first contact layer has at least one interruption, such that the carrier is free of the first contact layer at least in places in a region of the cavity, in which a third contact layer, which has an electrically conductive material, is arranged at least in places on a top side of the insulating layer facing away from the carrier,
the optoelectronic semiconductor chip is flush with the insulating layer in a vertical direction, wherein the vertical direction being perpendicular to a main extension plane of the optoelectronic component,
a fourth contact layer electrically connected to a second contact layer through at least one via in the insulating layer, and
in which the third contact layer completely covers the top side of the insulating layer.
12. The optoelectronic component according to claim 11 , in which a second contact layer, which has an electrically conductive material, is arranged at least in places on an underside of the carrier facing away from the insulating layer and has at least one interruption, so that the carrier is free of the second contact layer at least in places in the region of the cavity.
13. The optoelectronic component according to claim 11 , in which the first contact layer has two interruptions in an area of the cavity.