Method of manufacturing electrical conductor tracks in a region of an intravascular blood pump
A method of manufacturing electrical tracks in a region of an intravascular blood pump is provided. The method can include providing an intravascular blood pump with a flow cannula including a spiral structure, a sensor and an electrical connection region, applying a conductor structure to a coatable material of the flow cannula, electrically connecting a first portion of the conductor track structure to the sensor and a second portion of the conductor track structure to the electrical connection region and closing the spiral structure using a flexible material where the flexible material can be silicone or polyurethane.
1. A method of manufacturing electrical conductor tracks in a region of an intravascular blood pump, the method comprising:
providing the intravascular blood pump comprising:
a flow cannula comprising a spiral structure;
a sensor; and
an electrical connection region;
applying a conductor track structure to a coatable material of the flow cannula;
electrically connecting a first portion of the conductor track structure to the sensor;
electrically connecting a second portion of the conductor track structure to the electrical connection region; and
closing the spiral structure using a flexible material, wherein the flexible material comprises silicone or polyurethane.
2. The method of claim 1 , wherein applying the conductor track structure comprises applying the conductor track structure about the spiral structure of the flow cannula.
3. The method according to claim 1 , wherein providing the intravascular blood pump comprises providing the intravascular blood pump having the sensor disposed in a tip region of the intravascular blood pump.
4. The method according to claim 3 , wherein the sensor comprises an ultrasonic element.
5. The method according to claim 3 , wherein the sensor comprises a pressure sensor.
6. The method according to claim 3 , wherein the sensor comprises a temperature sensor.
7. The method according to claim 1 , wherein providing the intravascular blood pump comprises providing the intravascular blood pump having the sensor integrated into a surface coating structure of the intravascular blood pump.
8. The method according to claim 7 , wherein the sensor comprises at least one of a strain sensor, a breakage sensor, and a temperature sensor.
9. The method according to claim 7 , wherein applying the conductor track structure comprises applying one or more meandering conductor tracks forming one or more sensor regions of the sensor.
10. The method according to claim 9 , wherein applying the one or more meandering conductor tracks forming the one or more sensor regions comprises applying a different material than one or more conductor tracks outside the sensor regions.
11. The method according to claim 9 , wherein applying the one or more meandering conductor tracks forming the one or more sensor regions comprises applying platinum.
12. The method according to claim 1 , wherein applying the conductor track structure to the coatable material comprises applying the conductor track structure to a material of the flow cannula comprising at least one of: nickel-titanium alloys, titanium, stainless steel, glass, and ceramic.
13. The method according to claim 1 , wherein applying the conductor track structure comprises applying a multilayer structure.
14. The method according to claim 1 , wherein electrically connecting at least the first portion or the second portion of the conductor track structure comprises forming a frictional connection.
15. The method according to claim 1 , wherein applying the conductor track structure comprises:
applying an insulating base layer to the coatable material;
applying a photoresist material;
applying the conductor track structure, wherein the conductor track structure is applied by sputtering;
removing the photoresist material; and
applying an electrically insulating surface, wherein the electrical insulating surface is biocompatible.
16. The method according to claim 15 , wherein the intravascular blood pump further comprises:
a tip;
a first region comprising at least one blood through-opening;
a flow cannula;
a second region comprising at least one blood through-opening;
a motor-operated pump device; and
a conducting cable.
17. The method according to claim 16 , wherein providing the intravascular blood pump comprises providing the intravascular blood pump having the sensor disposed in a tip region of the intravascular blood pump.
18. The method according to claim 1 , wherein applying the conductor track structure comprises:
applying an insulating base layer to the coatable material;
applying an initial metallic conductor layer, wherein the initial metallic conductor layer is applied by sputtering;
applying a photoresist material;
thickening exposed portions of the initial metallic conductor layer using a wet chemical electroplating process;
removing the photoresist material;
removing portions of the initial metallic conductor layer outside conductor tracks;
applying an electrically insulating surface, wherein the electrically insulating surface is biocompatible.
19. The method according to claim 18 , wherein the intravascular blood pump further comprises:
a tip;
a first region comprising at least one blood through-opening;
a flow cannula;
a second region comprising at least one blood through-opening;
a motor-operated pump device; and
a conducting cable.
20. The method according to claim 19 , wherein providing the intravascular blood pump comprises providing the intravascular blood pump having the sensor disposed in a tip region of the intravascular blood pump.