Miniaturized electronic devices and related methods
Miniaturized sealed electronic devices and methods of making and using them are disclosed herein. The miniaturized sealed electronic device disclosed herein includes an electronic device, an electrically insulating substrate, a barrier layer (e.g., a barrier material thin film, and/or a barrier material cap), cured adhesive and a sealant. The miniaturized sealed electronic device is made using methods described herein to create a small footprint, with minimal encapsulation, as compared to sealed electronic devices made by traditional methods.
1. A sealed electronic device, comprising
an electrically insulating layer and a barrier layer with an electronic device between the electrically insulating layer and the barrier layer, wherein the electronic device is encapsulated by a cured adhesive and wherein a perimeter of the electrically insulating layer and the barrier layer is greater than a perimeter of the electronic device; and
a sealant at the perimeter of the electrically insulating layer and the barrier layer.
2. The sealed electronic device of claim 1 , wherein the sealant is selected from the group consisting of a thermoplastic polymer, a thermoset resin, an epoxy, and a metal.
3. The sealed electronic device of claim 1 , wherein the barrier layer comprises a barrier layer thin film positioned over and beyond the perimeter of the electronic device or a barrier layer cap positioned over and about the electronic device.
4. The sealed electronic device of claim 3 , wherein the barrier layer cap is configured to be sealed to the electrically insulating layer about the perimeter of the electronic device.
5. The sealed electronic device of claim 3 , wherein the barrier layer cap comprises glass, ceramic, polymer, or metal.
6. The sealed electronic device of claim 4 , wherein the barrier layer cap is thermally sealed to the electrically insulating layer, is chemically sealed to the electrically insulating layer, or is photo-curably sealed to the electrically insulating layer.
7. The sealed electronic device of claim 1 , wherein the cured adhesive and the sealant are photo-cured.
8. The sealed electronic device of claim 1 , wherein the cured adhesive and the sealant are thermally-cured.
9. The sealed electronic device of claim 1 , wherein the cured adhesive and the sealant are chemically-cured.
10. The sealed electronic device of claim 1 , wherein the electronic device is a solid state battery, a light emitting diode, a photovoltaic device, or a sensor.
11. The sealed electronic device of claim 6 , wherein the barrier layer cap is photo-curably sealed to the electrically insulating layer.
12. The sealed electronic device of claim 6 , wherein the barrier layer cap is thermally sealed to the electrically insulating layer.
13. The sealed electronic device of claim 6 , wherein the barrier layer cap is chemically sealed to the electrically insulating layer.
14. The sealed electronic device of claim 1 , wherein the sealed electronic device is a medical implant.
15. The sealed electronic device of claim 1 , wherein the electronic device has a length and a width of from about 10 microns (μm) to about 10,000 μm.
16. The sealed electronic device of claim 1 , wherein the electronic device has a thickness of from about 5 microns (μm) to about 50 μm.
17. The sealed electronic device of claim 1 , wherein the electrically insulating layer is selected from the group consisting of a silicon wafer substrate, a gallium arsenide wafer substrate, a glass substrate, and a ceramic substrate.
18. The sealed electronic device of claim 1 , wherein the sealant at the perimeter of the electrically insulating layer and the barrier layer is 1 nanometer (nm) to about 1 mm from the electronic device.
19. The sealed electronic device of claim 18 , wherein a cross section of the sealant at the perimeter of the electrically insulating layer and the barrier layer is no more than 10 times wider than a width of the electronic device.
20. The sealed electronic device of claim 1 , further comprising one or more sealed conductive feedthroughs addressable on a same side of the electronic device.
21. The sealed electronic device of claim 20 , wherein the sealed conductive feedthroughs addressable on a same side of the electronic device comprise an anode feedthrough and a cathode feedthrough.