IP Library Granted Patent US 11,966,352
Granted Patent B2
US 11,966,352 · App. 17/065,878 · Granted Apr 23, 2024

Modularized riser system

Inventors: Yu-Feng Lin (Taipei, TW); Hao-Cheng Ku (Taipei, TW); Yi-Wei Lu (Taipei, TW)
Assignee: Dell Products L.P.
G06F13/4221G06F2213/0026
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Quick Facts
Patent No.
US 11,966,352
App. No.
17/065,878
Granted
Apr 23, 2024
Kind
B2
Abstract

An information handling system with modular riser components for receiving expansion cards having various requirements. The system includes a riser body assembly having a common support structure for receiving expansion cards. The common support structure may be coupled to different expansion structures to provide support of expansion cards having requirements that would not be met by the common support structure alone.

Claims (32)

1. An apparatus, comprising:

a modular riser configured to support an expansion card in an information handling system, the modular riser comprising:

a common riser body comprising a support structure, the support structure comprising:

a frame to support an expansion card, the frame comprising a first end having a first plate to support and removably couple to the expansion card, a second end opposite the first end and configured to couple to an expansion structure to provide additional support for the expansion card, a base extending between the first and second ends, a first side having a second plate at least partially extending between the first and second ends, and a second side opposite the first side; and

a moveable support coupled to the base and configured to support the expansion card and to move towards and away from the first side to permit installation or removal of the expansion card from the modular riser.

2. The apparatus of claim 1 , wherein the support structure of the common riser body is configured to support an expansion card with basic features, wherein the expansion card is at least one of a low-profile or half-height expansion card.

3. The apparatus of claim 2 , wherein the modular riser further comprises the expansion structure, wherein a combination of the expansion structure and the common riser body is configured to support an expansion card with additional features, wherein the expansion card comprises a full-length expansion card.

4. The apparatus of claim 1 , wherein the support structure is configured to support a Peripheral Component Interconnect Express (PCIe) card.

5. The apparatus of claim 1 , wherein the common riser body is not able to adjust a length of the support structure.

6. The apparatus of claim 1 , wherein the support structure is configured to couple to the expansion structure with a tool-less attachment linkage.

7. The apparatus of claim 3 , wherein the expansion structure comprises a rock-out preventer configured to prevent the expansion card supported by the support structure from being dislodged by movement of the information handling system.

8. The apparatus of claim 3 , wherein the expansion structure comprises a thermal block configured to direct air to flow across an expansion card supported by the support structure.

9. The apparatus of claim 8 , wherein the thermal block is configured to provide additional cooling to a graphics processing unit (GPU) of the expansion card.

10. An information handling system, comprising:

a chassis; and

a modular riser configured to support an expansion card in an information handling system, the modular riser coupled to the chassis, the modular riser comprising:

a common riser body comprising a support structure, the support structure comprising:

a frame to support the expansion card, the frame comprising a first end having a first plate to support and removably couple to the expansion card, a second end opposite the first end and configured to couple to an expansion structure to provide additional support for the expansion card, a base extending between the first and second ends, a first side having a second plate at least partially extending between the first and second ends, and a second side opposite the first side; and

a moveable support coupled to the base and configured to support the expansion card and to move towards and away from the first side to permit installation or removal of the expansion card from the modular riser.

11. The information handling system of claim 10 , wherein the support structure of the common riser body is configured to support an expansion card with basic features, wherein the expansion card is at least one of a low-profile or half-height expansion card.

12. The information handling system of claim 11 , wherein the modular riser further comprises the expansion structure, wherein a combination of the expansion structure and the common riser body is configured to support an expansion card with additional features, wherein the expansion card comprises a full-length expansion card.

13. The information handling system of claim 10 , wherein the support structure is configured to support a Peripheral Component Interconnect Express (PCIe) card.

14. The information handling system of claim 10 , wherein the common riser body is not able to adjust a length of the support structure.

15. The information handling system of claim 12 , wherein the expansion card comprises a graphics processing unit (GPU), the expansion structure further comprising a thermal block configured to direct air to flow across the expansion card supported by the support structure to cool the GPU.

16. A method comprising:

coupling a riser extension expansion structure to a support structure of a common riser body to form a modular riser, wherein the support structure comprises a frame to support an expansion card, the frame comprising a first end having a first plate to support and removably couple to the expansion card, a second end opposite the first end and configured to couple to an expansion structure to provide additional support for the expansion card, a base extending between the first and second ends, a first side having a second plate at least partially extending between the first and second ends, and a second side opposite the first side, and wherein the support structure further comprises a moveable support coupled to the base and configured to support the expansion card and to move towards and away from the first side to permit installation or removal of the expansion card from the modular riser without removing the modular riser from an information handling system;

installing the expansion card in the modular riser, wherein the expansion card would be too long, too heavy, or unable to be adequately cooled using features of the common riser body alone; and

installing the modular riser with the expansion card in the information handling system, the combination of the common riser body and the riser extension expansion structure providing features for supporting the expansion card.

17. The method of claim 16 , further comprising moving the moveable support away from the first side and thereafter removing the expansion card from the modular riser body assembly without removing the modular riser from the information handling system.

18. The method of claim 16 , wherein the coupling of the riser extension expansion structure to the support structure is performed without the use of a tool.

19. The apparatus of claim 1 , wherein the moveable support is configured to move along a channel built into a portion of the base, such that the movement of the moveable support is generally restricted to movement along one dimension.

20. The information handling system of claim 10 , wherein the moveable support is configured to move along a channel built into a portion of the base, such that the movement of the moveable support is generally restricted to movement along one dimension.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0523) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 060332/0664 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0434) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 060332/0740 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0609) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 062021/0570 →
RELEASE OF SECURITY INTEREST AT REEL 054591 FRAME 0471 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0463 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 054475/0609 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 054475/0434 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 054475/0523 →
SECURITY AGREEMENT Recorded Nov 13, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 054591/0471 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2020
From: KU, HAO-CHENG; LIN, YU-FENG; LU, YI-WEI
To: DELL PRODUCTS L.P.
Reel/Frame 054012/0041 →