IP Library Granted Patent US 11,502,450
Granted Patent B2
US 11,502,450 · App. 17/067,615 · Granted Nov 15, 2022

Systems for dynamically adjustable grounding connections

Inventors: Yi-Pai Chu (Taoyuan, TW); Chih-Wen Huang (Taoyuan, TW)
Assignee: Dell Products L.P.
H01R13/6205H01R13/652
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Quick Facts
Patent No.
US 11,502,450
App. No.
17/067,615
Granted
Nov 15, 2022
Kind
B2
Abstract

A grounding contact configured to electrically couple a first chassis wall to a second chassis wall, that includes a standoff a magnet, and a contact element, where the standoff is rigidly coupled to the first chassis wall, where the contact element is directly contacting the second chassis wall, and where the contact element is disposed between the magnet and the second chassis wall.

Claims (31)

1. A grounding contact configured to electrically couple a first chassis wall to a second chassis wall, comprising:

a standoff rigidly coupled to the first chassis wall, the standoff comprising a plurality of arm cutouts and a magnetic holder;

a magnet disposed in the magnetic holder; and

a contact element disposed between the magnet and the second chassis wall, the contact element directly contacting the second chassis wall, and the contact element comprising a plurality of contact arms disposed in the plurality of arm cutouts,

wherein the plurality of contact arms and the plurality of arm cutouts prevent the contact element from detaching from the grounding contact using tension that increases as the contact element separates from the standoff; and wherein the first chassis wall and the second chassis wall are electrically coupled via the contact element and the standoff.

2. The grounding contact of claim 1 , wherein the contact element is not rigidly coupled to the first chassis wall.

3. A method for electrically coupling a first chassis wall and a second chassis wall, comprising:

moving the second chassis wall towards the first chassis wall, the first chassis wall comprising a standoff rigidly coupled thereto, the standoff comprising a plurality of arm cutouts and a magnetic holder;

in response to moving the second chassis wall:

causing a contact element to contact the second chassis wall, the contact element disposed between a magnet and the second chassis wall, the contact element comprising a plurality of contact arms disposed in the plurality of arm cutouts, wherein the plurality of contact arms and the plurality of arm cutouts prevent the contact element from detaching from the grounding contact using tension that increases as the contact element separates from the standoff; and

in response to the contact element contacting the second chassis wall:

electrically coupling the first chassis wall and the second chassis wall.

4. The method of claim 3 , wherein causing the contact element to contact the second chassis wall comprises:

causing the magnet to move towards the second chassis wall.

5. The method of claim 3 , wherein after electrically coupling the first chassis wall and the second chassis wall:

moving the second chassis wall away from the first chassis wall.

6. The method of claim 5 , wherein in response to moving the second chassis wall away from the first chassis wall:

causing a magnet to move away from the second chassis wall.

7. The method of claim 5 , wherein in response to moving the second chassis wall away from the first chassis wall:

electrically decoupling the first chassis wall and the second chassis wall.

8. The method of claim 5 , wherein in response to moving the second chassis wall away from the first chassis wall:

causing the contact element to move towards the first chassis wall.

9. A chassis, comprising:

a first chassis wall;

a second chassis wall; and

a grounding contact, comprising:

a standoff rigidly coupled to the first chassis wall, the standoff comprising a plurality of arm cutouts and a magnetic holder;

a magnet disposed in the magnetic holder; and

a contact element disposed between the magnet and the second chassis wall, the contact element directly contacting the second chassis wall, and the contact element comprising a plurality of contact arms disposed in the plurality of arm cutouts,

wherein the plurality of contact arms and the plurality of arm cutouts prevent the contact element from detaching from the grounding contact using tension that increases as the contact element separates from the standoff; and wherein the first chassis wall and the second chassis wall are electrically coupled via the contact element and the standoff.

10. The chassis of claim 9 , wherein the contact element is not rigidly coupled to the first chassis wall.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0434) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 060332/0740 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0609) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 062021/0570 →
RELEASE OF SECURITY INTEREST AT REEL 054591 FRAME 0471 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0463 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 054475/0434 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 054475/0523 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 054475/0609 →
SECURITY AGREEMENT Recorded Nov 13, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 054591/0471 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2020
From: CHU, YI-PAI; HUANG, CHIH-WEN
To: DELL PRODUCTS L.P.
Reel/Frame 054312/0904 →