Cryogenic radio-frequency resonator for surface ion traps
The present subject matter provides technical solutions for the technical problems facing cryogenic ion traps by providing a cryogenic radio-frequency (RF) resonator that is compact, monolithic, modular, and impedance-matched to a cryogenic ion trap. The cryogenic RF resonator described herein is power-efficient, properly impedance-matched to the RF source, has a stable gain profile, and is compatible with a low temperature and ultra-high vacuum environment. In some examples, the gain profile is selected so that the cryogenic RF resonator acts as a cryogenic RF amplifier. This cryogenic RF resonator improves the performance of ion traps by reducing or minimizing the heat load and reducing or minimizing the unwanted noise that may erroneously drive trapped ions. These features of the present subject matter improve the performance of atomic clocks and mass spectrometers, and especially improve the performance of trapped ion quantum computers.
1. An impedance-matched cryogenic radio-frequency resonator system comprising:
an inductive device submerged at least partially within a substrate, the substrate formed from a thermally conductive and vibration-reducing material;
a cryogenic capacitive device coupled to the inductive device and mounted on a circuit board that is submerged at least partially within the substrate to form a cryogenic resonant circuit;
a radio-frequency (RF) input port to route an input RF signal to the cryogenic resonant circuit, the cryogenic resonant circuit generating a voltage-amplified RF signal; and
an RF output port to route the voltage-amplified RF signal.
2. The system of claim 1 , wherein:
the cryogenic resonant circuit forms an amplifier circuit to generate the voltage-amplified RF signal; and
the RF output port provides the voltage-amplified RF signal to a surface ion trap.
3. The system of claim 1 , further including a thermally conductive enclosure.
4. The system of claim 3 , wherein the thermally conductive enclosure includes a thermally conductive high-purity copper.
5. The system of claim 3 , wherein the thermally conductive substrate is thermally coupled to the thermally conductive enclosure.
6. The system of claim 3 , wherein the thermally conductive enclosure includes at least one thermally conductive surface configured to mate with a thermally conductive mounting substrate.
7. The system of claim 1 , wherein the cryogenic capacitive device includes a cryogenic capacitive material.
8. The system of claim 2 , wherein the cryogenic capacitive device is configured to provide an adjustable capacitance, the adjustable capacitance modifying the amplifier impedance.
9. The system of claim 8 , wherein the cryogenic capacitive device includes one or more capacitors, each of the one or more capacitors configured to be removable to provide the adjustable capacitance.
10. The system of claim 8 , wherein the cryogenic capacitive device includes a user-selectable capacitance to provide the adjustable capacitance.
11. An impedance-matched cryogenic radio-frequency resonator method comprising:
receiving an input radio-frequency (RF) signal via an RF input port at a cryogenic resonant circuit, the cryogenic resonant circuit including:
an inductive device submerged at least partially within a substrate, the substrate formed from a thermally conductive and vibration-reducing material; and
a cryogenic capacitive device coupled to the inductive device and mounted on a circuit board at least partially within the substrate to form the cryogenic resonant circuit;
generating a voltage-amplified RF signal at the cryogenic resonant circuit based on the input RF signal; and
output the voltage-amplified RF signal via an RF output port.
12. The method of claim 11 , wherein:
the cryogenic resonant circuit includes an amplifier circuit to generate the voltage-amplified RF signal; and
the output of the RF signal includes outputting the amplified RF signal to a surface ion trap.
13. The method of claim 11 , wherein the cryogenic resonant circuit is submerged within a thermally conductive enclosure.
14. The method of claim 13 , wherein the thermally conductive enclosure includes a thermally conductive high-purity copper.
15. The method of claim 13 , wherein the substrate includes a thermally conductive substrate and is thermally coupled to the thermally conductive enclosure.
16. The method of claim 13 , wherein the thermally conductive enclosure includes at least one thermally conductive surface configured to mate with a thermally conductive mounting substrate.
17. The method of claim 11 , wherein the cryogenic capacitive device includes a cryogenic capacitive material.
18. The method of claim 11 , wherein the cryogenic capacitive device is configured to provide an adjustable capacitance, the adjustable capacitance modifying a circuit impedance value associated with the cryogenic resonant circuit.
19. The method of claim 18 , wherein the cryogenic capacitive device includes a one or more capacitors, each of the one or more capacitors configured to be removable to provide the adjustable capacitance.
20. The method of claim 18 , further including receiving a user-selectable capacitance input to provide the adjustable capacitance.