Integrated tracking antenna array
A combiner network is provided. A combiner network may include a corporate combiner. The corporate combiner may include a first plurality of radiation elements. The corporate combiner may include a first H-plane combiner connected to the first plurality of radiation elements and connected by a U-bend to a first E-plane combiner. The corporate combiner may include a second H-plane combiner connected to the first E-plane combiner. The corporate combiner may further include a first port. A plurality of corporate combiners may be assembled together as a combiner network.
1. An antenna array, comprising:
a first combiner, comprising:
a first plurality of radiation elements;
a first combiner stage connected to the first plurality of radiation elements;
a second combiner stage directly connected to the first combiner stage by a first U-bend; and
a first port.
2. The antenna array of claim 1 , wherein the antenna array is linearly polarized.
3. The antenna array of claim 1 , wherein the antenna array is circularly polarized.
4. The antenna array of claim 1 , wherein the first combiner stage is parallel to the second combiner stage.
5. The antenna array of claim 1 , wherein the first combiner stage is perpendicular to the second combiner stage.
6. The antenna array of claim 1 , wherein the first combiner stage is a first H-plane combiner; and
wherein the second combiner stage is a second H-plane combiner.
7. The antenna array of claim 6 , further comprising:
a second combiner, comprising:
the first plurality of radiation elements;
a third H-plane combiner connected to the first plurality of radiation elements;
a fourth H-plane combiner connected to the third H-plane combiner by a second U-bend; and
a second port;
wherein each radiation element of the first plurality of radiation elements comprises a first waveguide port and a second waveguide port; and
wherein the first H-plane combiner is connected to the first waveguide ports, the third H-plane combiner is connected to the second waveguide ports.
8. The antenna array of claim 7 , further comprising:
a third combiner, comprising:
a second plurality of radiation elements; and
a fifth H-plane combiner connected to the second plurality of radiation elements;
wherein the fifth H-plane combiner is connected to the second H-plane combiner by a third U-bend.
9. The antenna array of claim 8 , further comprising:
a fourth combiner, comprising:
the second plurality of radiation elements;
a sixth H-plane combiner connected to the second plurality of radiation elements;
wherein the sixth H-plane combiner is connected to the fourth H-plane combiner by a fourth U-bend;
wherein each radiation element of the second plurality of radiation elements comprises a third waveguide port and a fourth waveguide port; and
wherein the fifth H-plane combiner is connected to the third waveguide ports and the sixth H-plane combiner is connected to the fourth waveguide ports.
10. The antenna array of claim 9 ,
wherein the first port is an RHCP port that is connected to the second H-plane combiner; and
wherein the second port is an LHCP port that is connected to the fourth H-plane combiner.
11. The antenna array of claim 10 , further comprising:
wherein the first combiner, the second combiner, the third combiner, and the fourth combiner together form a sub array of the antenna array.
12. The antenna array of claim 11 , further comprising:
a plurality of subarrays;
an RHCP connector for communicating an RHCP signal via each RHCP port of the plurality of subarrays; and
an LHCP connector for communicating an LHCP signal via each LHCP port of the plurality of subarrays.
13. The antenna array of claim 12 , further comprising:
a structural lattice that supports each of the plurality of first combiners, the plurality of second combiners, the plurality of third combiners, and the plurality of fourth combiners.
14. The antenna array of claim 13 , further comprising:
a heat sink comprising a plurality of fins.
15. The antenna array of claim 14 , further comprising:
a circuit card chassis that houses a circuit card connected to the RHCP connector and the LHCP connector for transmitting or receiving a signal.
16. The antenna array of claim 15 , further comprising:
a lid that covers the circuit card chassis.
17. The antenna array of claim 15 , further comprising:
a sealant between the lid and the circuit card chassis.
18. The antenna array of claim 15 , wherein the first combiner, the second combiner, the third combiner, the fourth combiner, the plurality of subarrays, the RHCP connector, the LHCP connector, the structural lattice, the heat sink, and the circuit card chassis are all formed as a single indivisible element by an additive manufacturing process.
19. The antenna array of claim 1 , wherein the first combiner stage is a first H-plane combiner; and
wherein the second combiner stage is a first E-plane combiner.
20. The antenna array of claim 19 , further comprising:
a second H-plane combiner connected to the first E-plane combiner.