Method for mounting high voltage capacitor banks

1. A capacitor bank assembly for impedance injection into a power transmission line, the capacitor bank assembly comprising:

a conductive mount tray comprising convective cooling slots;

a plurality of capacitors vertically mounted and held by the conductive mount tray;

a first conductive plate to which all positive terminals of the plurality of capacitors are connected;

a second conductive plate to which all negative terminals of the plurality of capacitors are connected;

an insulating material separating the first conductive plate and the second conductive plate;

a cooling plate thermally coupled to the conductive mount tray, wherein the conductive mount tray is mounted to the cooling plate; and

a heat sink thermally coupled to the cooling plate to provide cooling to ambient air, wherein the cooling plate is attached to the heat sink;

wherein the plurality of capacitors are cooled by convective air flow passing through the convective cooling slots and by conductive cooling from the conductive mount tray to the cooling plate;

wherein the capacitor bank assembly is a subsystem or component of a transformerless impedance injection unit.

2. The capacitor bank assembly of claim 1 , wherein the capacitor bank assembly is configured to withstand sustained vibration of at least 3 g at 200 hertz and shock test of at least 80 g at 6 milliseconds.

3. The capacitor bank assembly of claim 1 , wherein:

each of the plurality of capacitors has a case with a grounding stud connected to the conductive mount tray.

4. The capacitor bank assembly of claim 1 , wherein the insulating material comprises a sheet having a thickness in a range of 0.005 to 0.060 inches.

5. The capacitor bank assembly of claim 1 , wherein the insulating material comprises NOMEX® 410 meta-aramid polymer.

6. The capacitor bank assembly of claim 1 , further comprising:

a sponge-like material filling spaces between capacitors in the plurality of capacitors.

7. The capacitor bank assembly of claim 1 , further comprising:

a material comprising foam rubber filling spaces between capacitors in the plurality of capacitors.

8. The capacitor bank assembly of claim 1 , further comprising:

one or more high current drivers attached to and thermally coupled to the cooling plate;

the one or more high current drivers electrically coupled to the plurality of capacitors to charge and discharge each of the plurality of capacitors;

the plurality of capacitors being thermally coupled to the conductive mount tray; and

the plurality of capacitors and the conductive mount tray being thermally coupled to, or thermally decoupled from, the one or more high current drivers and the cooling plate.

9. The capacitor bank assembly of claim 1 , further comprising:

one or more high current drivers, each high current driver comprising an insulated gate bipolar transistor (IGBT) to charge and discharge the plurality of capacitors.

10. The capacitor bank assembly of claim 1 , wherein:

the conductive mount tray includes a combination of air cooling and conductive cooling to cool the capacitor bank assembly.

11. The capacitor bank assembly of claim 1 , further comprising:

a power switching assembly;

wherein the power switching assembly and the conductive mount tray, with the plurality of capacitors, the first conductive plate, the second conductive plate and the insulating material, are integrated with a single wall of the transformerless impedance injection unit.

12. The capacitor bank assembly of claim 1 , wherein:

the plurality of capacitors are operable to store energy for injection of a reactive impedance into the power transmission line for power flow control.

13. The capacitor bank assembly of claim 1 , wherein a sum of capacitance for the plurality of capacitors is in a range of 0.1 to 10 mF (millifarads).

14. The capacitor bank assembly of claim 1 , wherein each of the plurality of capacitors has a capacitance in a range of 250 to 4000 μF (microfarads).