Microelectronic packages with high integration microelectronic dice stack
A microelectronic package may include stacked microelectronic dice, wherein a first microelectronic die is attached to a microelectronic substrate, and a second microelectronic die is stacked over at least a portion of the first microelectronic die, wherein the microelectronic substrate includes a plurality of pillars extending therefrom, wherein the second microelectronic die includes a plurality of pillars extending therefrom in a mirror-image configuration to the plurality of microelectronic substrate pillars, and wherein the second microelectronic die pillars are attached to microelectronic substrate pillars with an attachment material.
1. A device, comprising:
a substrate having a plurality of pillars extending from a surface and a plurality of bond pads on the surface;
a first die including a plurality of pillars extending from a surface of the first die; and
a second die extending over at least a portion of the first die, the second die including a plurality of pillars extending from a surface of the second die;
wherein one of the plurality of pillars of the first die is coupled with one of the plurality of bond pads on the substrate by a solder material; and
wherein one of the plurality of pillars of the second die is coupled with one of the plurality of pillars of the substrate by an attachment material.
2. The device of claim 1 , wherein the attachment material comprises a solder material.
3. The device of claim 1 , further comprising:
a mold material on a back surface of the second die.
4. The device of claim 3 , wherein the mold material encapsulates the first die, the second die, the plurality of substrate pillars, the plurality of second die pillars, and the attachment material.
5. The device of claim 1 , further including an adhesive material between a back surface of the first die and the surface of the second die.
6. The device of claim 1 , wherein the substrate further includes an external connection surface opposing the surface of the substrate, and further including at least one external attachment interconnect attached to the external connection surface.
7. The device of claim 1 , wherein the first die is attached by its surface to the substrate die surface with at least one interconnect.
8. The device of claim 1 , wherein the substrate includes a plurality of second bond pads and wherein the plurality of substrate pillars are attached to the plurality of second die attachment bond pads.
9. The device of claim 1 , wherein the second die includes a plurality of bond pads and wherein the plurality of second die pillars are attached to the plurality of second die bond pads.
10. A method of forming a device, comprising:
forming a substrate having a surface and a plurality of pillars extending from the surface, wherein the plurality of pillars has an attachment material thereon;
forming a first die having an active surface and an opposing back surface;
attaching the first die by the active surface thereof to the substrate surface by a plurality of pillars of the first die and corresponding solder bumps on die attachment bond pads of the substrate;
forming a second die having a plurality of pillars extending from an active surface thereof, the active surface opposite a back surface; and
attaching the second microelectronic die to the substrate, wherein each of the plurality of second die pillars is attached to a respective substrate pillar with the attachment material and wherein the second die extends over at least a portion of the first die.
11. The method of claim 10 , further comprising:
disposing a mold material on the back surface of the second die.
12. The method of claim 11 , wherein disposing the mold material encapsulates the first die, the second die, the plurality of substrate pillars, the plurality of second die pillars, and the attachment material.
13. The method of claim 10 , wherein attaching the second die to the substrate comprises attaching each of the plurality of second die pillars to a respective substrate pillar with an attachment material comprising a solder material.
14. The method of claim 10 , further comprising disposing an adhesive material between the first die back surface and the second die active surface.
15. The method of claim 10 , wherein the substrate further includes an external connection surface opposing the substrate surface, and further including forming at least one external attachment interconnect on the substrate external connection surface.
16. The method of claim 10 , wherein attaching the first die by its active surface to the substrate surface comprises attaching the first die by its active surface to the substrate surface with at least one interconnect.
17. An electronic system, comprising:
a board; and
a microelectronic package on the board, wherein the microelectronic package comprises:
a substrate having a plurality of pillars extending from a surface and a plurality of bond pads on the surface;
a first die including a plurality of pillars extending from a surface of the first die; and
a second die extending over at least a portion of the first die, the second die including a plurality of pillars extending from a surface of the second die;
wherein one of the plurality of pillars of the first die is coupled with one of the plurality of bond pads on the substrate by a solder material; and
wherein one of the plurality of pillars of the second die is coupled with one of the plurality of pillars of the substrate by an attachment material.
18. The electronic system of claim 17 , wherein the attachment material comprises a solder material.
19. The electronic system of claim 17 , further comprising a mold material on a back surface of the second die.
20. The electronic system of claim 17 , further including an adhesive material between a back surface of the first die and the surface of the second die.