Vibration removal apparatus and method for dual-microphone earphones
The present disclosure provides a microphone apparatus. The microphone apparatus may include a microphone and a vibration sensor. The microphone may be configured to receive a first signal including a voice signal and a first vibration signal. The vibration sensor may be configured to receive a second vibration signal. And the microphone and the vibration sensor are configured such that the first vibration signal may be offset with the second vibration signal.
1. A microphone apparatus, comprising a microphone and a vibration sensor, wherein
the microphone is configured to receive a first signal including a voice signal and a first vibration signal;
the vibration sensor is configured to receive a second vibration signal; and
the microphone and the vibration sensor are configured such that the first vibration signal can be offset with the second vibration signal, wherein
a cavity volume of the vibration sensor is proportional to a cavity volume of the microphone, and a ratio of the cavity volume of the vibration sensor to the cavity volume of the microphone is in a range of 3:1 to 6.5:1.
2. The apparatus of claim 1 , wherein
a cavity volume of the vibration sensor is configured such that an amplitude-frequency response of the vibration sensor to the second vibration signal is the same as an amplitude-frequency response of the microphone to the first vibration signal, and/or a phase-frequency response of the vibration sensor to the second vibration signal is the same as a phase-frequency response of the microphone to the first vibration signal.
3. The apparatus of claim 1 , further comprising a signal processing unit configured to make the first vibration signal offset with the second vibration signal and output the voice signal.
4. The apparatus of claim 1 , wherein the vibration sensor is a closed microphone or a dual-link microphone.
5. The apparatus of claim 1 , further comprising a vibration unit, at least one portion of the vibration unit being located in a housing, and the vibration unit being configured to generate the first vibration signal and the second vibration signal, wherein
the microphone and the vibration sensor are located at adjacent positions on the housing or at symmetrical positions on the housing with respect to the vibration unit.
6. An earphone system, comprising a vibration speaker, a microphone apparatus, and a housing, wherein
the vibration speaker and the microphone apparatus are located in the housing, and
the microphone apparatus includes a microphone and a vibration sensor, wherein
the microphone is configured to receive a first signal including a voice signal and a first vibration signal;
the vibration sensor is configured to receive a second vibration signal, and the first vibration signal and the second vibration signal being generated by vibration of the vibration speaker; and
the microphone and the vibration sensor are configured such that the first vibration signal can be offset with the second vibration signal, wherein
a cavity volume of the vibration sensor is proportional to a cavity volume of the microphone, and a ratio of the cavity volume of the vibration sensor to the cavity volume of the microphone is in a range of 3:1 to 6.5:1.
7. The earphone system of claim 6 , wherein
a cavity volume of the vibration sensor is configured such that an amplitude-frequency response of the vibration sensor to the second vibration signal is the same as an amplitude-frequency response of the microphone to the first vibration signal, and/or a phase-frequency response of the vibration sensor to the second vibration signal is the same as a phase-frequency response of the microphone to the first vibration signal.
8. The earphone system of claim 6 , further comprising a signal processing unit configured to make the first vibration signal offset with the second vibration signal and output the voice signal.
9. The earphone system of claim 6 , wherein the vibration sensor is a closed microphone or a dual-link microphone.
10. The earphone system of claim 9 , wherein
the microphone is a front cavity opening earphone or a back cavity opening earphone, and
the vibration sensor is a closed microphone with a closed front cavity and a closed back cavity.
11. The earphone system of claim 9 , wherein
the microphone is a front cavity opening earphone or a back cavity opening earphone, and
the vibration sensor is a dual-link microphone with an open front cavity and an open back cavity.
12. The earphone system of claim 11 , wherein the front cavity opening of the microphone includes at least one opening on a top or a side wall of the front cavity.
13. The earphone system according to claim 6 , wherein the microphone and the vibration sensor are independently connected to a same housing.
14. The earphone system of claim 13 , wherein the microphone and the vibration sensor are located at adjacent positions on the housing or at symmetrical positions on the housing with respect to the vibration speaker.
15. The earphone system of claim 13 , wherein a connection between the microphone or the vibration sensor and the housing includes one of a cantilever connection, a peripheral connection, or a substrate connection.
16. The earphone system of claim 6 , wherein the microphone and the vibration sensor are both micro-electromechanical system microphones.