Semiconductor module and power conversion device
The present application provides a semiconductor module and a power conversion device wherein wiring inductance is reduced. The semiconductor module is characterized by including a semiconductor element, a first terminal on which the semiconductor element is mounted, a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions, and a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein a free region is provided among the multiple of wiring portions, and the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines are of the same potential.
1. A semiconductor module, comprising:
a semiconductor element;
a first terminal on which the semiconductor element is mounted;
a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions; and
a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein
a free region is provided among the multiple of wiring portions, and
the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines at a same potential.
2. The semiconductor module according to claim 1 , wherein the multiple of connection lines are extended from different side end faces of the semiconductor element.
3. The semiconductor module according to claim 1 , comprising:
a resin mold that seals the semiconductor element, the first terminal, the second terminal, and the multiple of connection lines; and
a third terminal formed protruding to an exterior from one end face of the resin mold, wherein
the first terminal or the second terminal is formed protruding to the exterior from an end face of the resin mold other than the one end face of the resin mold,
a first current energizing the first terminal or the second terminal is greater than a second current energizing the third terminal, and
the free region is provided on the other end face side of the semiconductor element.
4. The semiconductor module according to claim 3 , wherein the multiple of wiring portions are connected before protruding to the exterior from the other end face of the resin mold.
5. The semiconductor module according to claim 1 , wherein the second terminal is a potential terminal of the upper face of the semiconductor element of a lower arm of upper and lower arms configured by a multiple of semiconductor elements including the semiconductor element being connected.
6. The semiconductor module according to claim 1 , wherein the second terminal has an annular portion connected to, or integrally formed with, the multiple of wiring portions,
the free region is provided on an inner side of the annular portion, and
the multiple of connection lines and the multiple of wiring portions and the annular portion forming current paths with each of the multiple of connection lines are of the same potential.
7. The semiconductor module according to claim 6 , wherein a hole portion is formed in one portion of the free region.
8. The semiconductor module according to claim 6 , wherein an H-bridge circuit is configured by a multiple of semiconductor elements including the semiconductor element,
the second terminal is formed of a lead frame, the free region is disposed in a center of the lead frame, and
the multiple of semiconductor elements are disposed with linear symmetry centered on the free region.
9. The semiconductor module according to claim 8 , comprising four current paths in the annular portion in a periphery of the free region.
10. The semiconductor module according to claim 7 , wherein an H-bridge circuit is configured by a multiple of semiconductor elements including the semiconductor element,
the second terminal is formed of a lead frame, the free region is disposed in a center of the lead frame, and
the multiple of semiconductor elements are disposed with linear symmetry centered on the free region.
11. The semiconductor module according to claim 10 , comprising four current paths in the annular portion in a periphery of the free region.
12. The semiconductor module according to claim 2 , comprising:
a resin mold that seals the semiconductor element, the first terminal, the second terminal, and the multiple of connection lines; and
a third terminal formed protruding to an exterior from one end face of the resin mold, wherein
the first terminal or the second terminal is formed protruding to the exterior from an end face of the resin mold other than the one end face of the resin mold,
a first current energizing the first terminal or the second terminal is greater than a second current energizing the third terminal, and
the free region is provided on the other end face side of the semiconductor element.
13. The semiconductor module according to claim 12 , wherein the multiple of wiring portions are connected before protruding to the exterior from the other end face of the resin mold.
14. The semiconductor module according to claim 2 , wherein the second terminal is a potential terminal of the upper face of the semiconductor element of a lower arm of upper and lower arms configured by a multiple of semiconductor elements including the semiconductor element being connected.
15. The semiconductor module according to claim 2 , wherein the second terminal has an annular portion connected to, or integrally formed with, the multiple of wiring portions,
the free region is provided on an inner side of the annular portion, and
the multiple of connection lines and the multiple of wiring portions and the annular portion forming current paths with each of the multiple of connection lines are of the same potential.
16. The semiconductor module according to claim 15 , wherein a hole portion is formed in one portion of the free region.
17. The semiconductor module according to claim 15 , wherein an H-bridge circuit is configured by a multiple of semiconductor elements including the semiconductor element,
the second terminal is formed of a lead frame, the free region is disposed in a center of the lead frame, and
the multiple of semiconductor elements are disposed with linear symmetry centered on the free region.
18. The semiconductor module according to claim 3 , wherein the second terminal is a potential terminal of the upper face of the semiconductor element of a lower arm of upper and lower arms configured by a multiple of semiconductor elements including the semiconductor element being connected.
19. The semiconductor module according to claim 4 , wherein the second terminal is a potential terminal of the upper face of the semiconductor element of a lower arm of upper and lower arms configured by a multiple of semiconductor elements including the semiconductor element being connected.
20. A power conversion device, comprising:
the semiconductor module according to claim 1 ;
a main conversion circuit that converts and outputs an input power; and
a control circuit that outputs a control signal that controls the main conversion circuit to the main conversion circuit.
21. The semiconductor module of claim 3 , wherein the first current flows through a source or a drain of the semiconductor element, and the second current flows through a gate of the semiconductor element.