Leave-in etch mask for foil-based metallization of solar cells
Approaches for fabricating foil-based metallization of solar cells based on a leave-in etch mask, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes metal foil portions in alignment with corresponding ones of the alternating N-type and P-type semiconductor regions. A patterned wet etchant-resistant polymer layer is disposed on the conductive contact structure. Portions of the patterned wet etchant-resistant polymer layer are disposed on and in alignment with the metal foil portions.
1. A solar cell, comprising:
a substrate having a back surface and an opposing light-receiving surface;
a plurality of N-type and P-type semiconductor regions disposed in or above the back surface of the substrate;
a conductive contact structure disposed on the plurality of N-type and P-type semiconductor regions, the conductive contact structure comprising metal foil portions in alignment with corresponding ones of the N-type and P-type semiconductor regions, wherein one or more of the metal foil portions extends laterally beyond the substrate; and
a patterned epoxy material layer disposed on the conductive contact structure, the patterned epoxy material layer disposed on and in alignment with the metal foil portions, and the patterned epoxy material layer coating a top, a bottom and ends of each of the one or more of the metal foil portions that extends laterally beyond the substrate.
2. The solar cell of claim 1 , wherein the patterned epoxy material layer is disposed directly on sides of the substrate and directly on sides of the metal foil, and wherein a portion of the patterned epoxy material layer disposed on the substrate is continuous with a portion of the patterned epoxy material layer on the metal foil.
3. The solar cell of claim 1 , wherein a portion of the patterned epoxy material layer is disposed over the light-receiving surface of the substrate.
4. The solar cell of claim 1 , wherein a portion of the patterned epoxy material layer is disposed on an anti-reflective coating (ARC) material disposed on the light-receiving surface of the substrate.
5. The solar cell of claim 1 , wherein the conductive contact structure further comprises a plurality of metal seed material regions disposed on each of the N-type and P-type semiconductor regions, and wherein the metal foil portions are disposed on the plurality of metal seed material regions.
6. The solar cell of claim 1 , wherein a portion of the conductive contact structure is disposed on a bottom anti-reflective coating (BARC) material disposed on the N-type and P-type semiconductor regions.
7. The solar cell of claim 1 , wherein the N-type and P-type semiconductor regions comprise N-type and P-type polycrystalline silicon regions.
8. The solar cell of claim 1 , wherein the N-type and P-type semiconductor regions are disposed on a thin dielectric layer disposed on the back surface of the substrate.
9. The solar cell of claim 1 , wherein the substrate is a monocrystalline silicon substrate.
10. A solar cell, comprising:
a substrate having a back surface and an opposing light-receiving surface;
a plurality of N-type and P-type semiconductor regions disposed in or above the back surface of the substrate;
a conductive contact structure disposed on the plurality of N-type and P-type semiconductor regions, the conductive contact structure comprising metal foil portions in alignment with corresponding ones of the N-type and P-type semiconductor regions, wherein one or more of the metal foil portions extends laterally beyond the substrate; and
a patterned polyolefin material layer disposed on the conductive contact structure, the patterned polyolefin material layer disposed on and in alignment with the metal foil portions, and the patterned polyolefin material layer coating a top, a bottom and ends of each of the one or more of the metal foil portions that extends laterally beyond the substrate.
11. The solar cell of claim 10 , wherein the patterned polyolefin material layer is disposed directly on sides of the substrate and directly on sides of the metal foil, and wherein a portion of the patterned polyolefin material layer disposed on the substrate is continuous with a portion of the patterned polyolefin material layer on the metal foil.
12. The solar cell of claim 10 , wherein a portion of the patterned polyolefin material layer is disposed over the light-receiving surface of the substrate.
13. The solar cell of claim 10 , wherein a portion of the patterned polyolefin material layer is disposed on an anti-reflective coating (ARC) material disposed on the light-receiving surface of the substrate.
14. The solar cell of claim 10 , wherein the conductive contact structure further comprises a plurality of metal seed material regions disposed on each of the N-type and P-type semiconductor regions, and wherein the metal foil portions are disposed on the plurality of metal seed material regions.
15. The solar cell of claim 10 , wherein a portion of the conductive contact structure is disposed on a bottom anti-reflective coating (BARC) material disposed on the N-type and P-type semiconductor regions.
16. The solar cell of claim 10 , wherein the N-type and P-type semiconductor regions comprise N-type and P-type polycrystalline silicon regions.
17. The solar cell of claim 10 , wherein the N-type and P-type semiconductor regions are disposed on a thin dielectric layer disposed on the back surface of the substrate.
18. The solar cell of claim 10 , wherein the substrate is a monocrystalline silicon substrate.
19. A solar cell, comprising:
a substrate having a back surface and an opposing light-receiving surface;
a plurality of N-type and P-type semiconductor regions disposed in or above the back surface of the substrate;
a conductive contact structure disposed over the plurality of N-type and P-type semiconductor regions, the conductive contact structure comprising metal foil portions in alignment with corresponding ones of the N-type and P-type semiconductor regions, wherein one or more of the metal foil portions extends laterally beyond the substrate; and
a patterned wet etchant-resistant polymer layer disposed on the conductive contact structure, the patterned wet etchant-resistant polymer layer disposed on and in alignment with the metal foil portions, and the patterned wet etchant-resistant polymer layer coating a top, a bottom and ends of each of the one or more of the metal foil portions that extends laterally beyond the substrate.
20. The solar cell of claim 19 , wherein the patterned wet etchant-resistant polymer layer is disposed directly on sides of the substrate and directly on sides of the metal foil, and wherein a portion of the patterned wet etchant-resistant polymer layer disposed on the substrate is continuous with a portion of the patterned wet etchant-resistant polymer layer on the metal foil.