Socket having solder balls
A socket includes a flat-plate-shaped housing, a plurality of contacts supported by the flat-plate-shaped housing, a frame attached to the flat-plate-shaped housing and extending along the flat-plate-shaped housing, a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and facing a circuit board, and a plurality of second solder balls disposed on the lower surface of the flat-plate-shaped housing. The frame defines, in an in-plane direction of the flat-plate-shaped housing, a position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted. The first solder balls electrically connect to each of the contacts and electrically connect to the circuit board. The second solder balls are not electrically connected to the contacts.
1. A socket, comprising:
a flat-plate-shaped housing;
a plurality of contacts supported by the flat-plate-shaped housing;
a frame attached to the flat-plate-shaped housing and extending along the flat-plate- shaped housing, the frame defining, in an in-plane direction of the flat-plate-shaped housing, a position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted;
a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and facing a circuit board, the first solder balls electrically connect to each of the contacts and electrically connect to the circuit board; and
a plurality of second solder balls disposed on the lower surface of the flat-plate-shaped housing and aligned with the frame, the second solder balls are not electrically connected to the contacts.
2. The socket of claim 1 , wherein the second solder balls are positioned closer to an edge of the flat-plate-shaped housing than the first solder balls.
3. A socket, comprising:
a flat-plate-shaped housing;
a plurality of contacts supported by the flat-plate-shaped housing;
a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and electrically connected to the contacts;
a plurality of second solder balls disposed on the lower surface and not electrically connected to the contacts; and
a frame attached to the flat-plate-shaped housing and extending along the flat-plate- shaped housing, the second solder balls are positioned on the lower surface of the flat-plate- shaped housing and are aligned with the frame.
4. The socket of claim 3 , wherein the first solder balls and the second solder balls connect the socket to a circuit board.
5. The socket of claim 4 , wherein the first solder balls electrically connect the contacts to the circuit board.
6. The socket of claim 5 , wherein the second solder balls only mechanically fix the flat-plate-shaped housing to the circuit board.
7. The socket of claim 3 , wherein the second solder balls are positioned closer to an edge of the flat-plate-shaped housing than the first solder balls.
8. The socket of claim 7 , wherein the first solder balls are position in a central portion of the flat-plate-shape housing.
9. The socket of claim 3 , wherein the flat-plate-shaped housing has a plurality of through-holes extending through the flat-plate shaped housing, an inner wall surface of each of the through-holes is a conductive metal.
10. The socket of claim 9 , wherein the contacts each have a press-fit portion inserted into one of the through-holes and electrically connected to the inner wall surface of the through-hole.
11. The socket of claim 10 , wherein each of the contacts protrudes beyond an upper surface of the flat-plate-shaped housing opposite the lower surface.
12. The socket of claim 10 , wherein the first solder balls are electrically connected to the inner walls surfaces of the through-holes.
13. The socket of claim 3 , wherein the frame defines, in an in- plane direction of the flat-plate-shaped housing, the position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted.
14. The socket of claim 13 , further comprising a first spring element disposed on a first side of the frame and a second spring element disposed on a second side of the frame, the second side does not face the first side.
15. The socket of claim 14 , wherein the first spring element pushes the electronic component toward a third side of the frame facing the first side and the second spring element pushes the electronic component toward a fourth side facing the second side.
16. The socket of claim 15 , further comprising a plurality of receiving portions on the fourth side, the receiving portions inwardly bulge toward the second side.
17. The socket of claim 13 , further comprising a plurality of sitting elements disposed in a plurality of insertion holes of the flat-plate-shaped housing.
18. The socket of claim 17 , wherein the sitting elements abut the lower surface of the electronic component and regulate a spacing between the electronic element and an upper surface of the flat-plate-shaped housing.
19. A socket, comprising:
a flat-plate-shaped housing;
a plurality of contacts supported by the flat-plate-shaped housing;
a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and electrically connected to the contacts;
a plurality of second solder balls disposed on the lower surface and not electrically connected to the contacts;
a frame attached to the flat-plate-shaped housing and extending along the flat-plate-shaped housing;
a first spring element disposed on a first side of the frame; and
a second spring element disposed on a second side of the frame, the second side does not face the first side.
20. The socket of claim 19 , wherein the first spring element pushes an electronic component toward a third side of the frame facing the first side and the second spring element pushes the electronic component toward a fourth side facing the second side.
21. The socket of claim 20 , further comprising a plurality of receiving portions on the fourth side, the receiving portions inwardly bulge toward the second side.
22. A socket, comprising:
a flat-plate-shaped housing;
a plurality of contacts supported by the flat-plate-shaped housing;
a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and electrically connected to the contacts;
a plurality of second solder balls disposed on the lower surface and not electrically connected to the contacts; and
a plurality of sitting elements disposed in a plurality of insertion holes of the flat-plate-shaped housing.
23. The socket of claim 22 , wherein the sitting elements abut a lower surface of an electronic component and regulate a spacing between the electronic component and an upper surface of the flat-plate-shaped housing.