Digital pressure sensor with rubber cover

1. A digital pressure sensor, comprising:

a substrate;

a pressure sensing structure configured for measuring a pressure of an object to be measured;

a signal processing chip configured for receiving a sensing signal of the pressure sensing structure, the pressure sensing structure and the signal processing chip are mounted on the substrate, the signal processing chip has an analog-digital conversion module that converts the sensing signal output by the pressure sensing structure into a digital signal and outputs the digital signal, the signal processing chip is electrically connected to the substrate; and

a rubber cover having an opening through which the pressure is sensed, the substrate and the rubber cover are connected to each other and form a mounting cavity for holding the pressure sensing structure and the signal processing chip.

2. The digital pressure sensor of claim 1 , wherein the pressure sensing structure has a soft rubber deformable under pressure and a pressure sensing chip configured for sensing deformation of the soft rubber and generating the sensing signal.

3. The digital pressure sensor of claim 2 , wherein the pressure sensing chip is disposed on a side of the soft rubber away from the opening and is electrically connected to the substrate.

4. The digital pressure sensor of claim 2 , wherein the soft rubber is a silica gel with which the mounting cavity is filled.

5. The digital pressure sensor of claim 2 , wherein the signal processing chip is configured for sensing a temperature of the pressure sensing chip and implementing a temperature detection module that detects a temperature value of the object to be measured.

6. The digital pressure sensor of claim 2 , further comprising a metal wire electrically connecting the pressure sensing chip and the substrate.

7. The digital pressure sensor of claim 1 , wherein the rubber cover includes a base and a boss disposed on the base.

8. The digital pressure sensor of claim 7 , wherein the boss has a first groove and the base has a second groove at a position corresponding to the first groove, the first groove and the second groove constitute the mounting cavity.

9. The digital pressure sensor of claim 8 , wherein the pressure sensing structure is disposed within the mounting cavity.

10. The digital pressure sensor of claim 9 , wherein the base has a second cavity configured for holding the signal processing chip, the second cavity and the mounting cavity are spaced apart.

11. The digital pressure sensor of claim 8 , wherein the pressure sensing structure and the signal processing chip are stacked sequentially in the mounting cavity.

12. The digital pressure sensor of claim 9 , wherein the signal processing chip is mounted on an end face of the substrate away from the rubber cover.

13. The digital pressure sensor of claim 12 , further comprising an epoxy resin securing the signal processing chip on the substrate.

14. The digital pressure sensor of claim 13 , wherein the epoxy resin covers an external surface of the signal processing chip and a contact portion between the signal processing chip and the substrate.

15. The digital pressure sensor of claim 1 , further comprising an interaction device mounted on an outer surface of the rubber cover, the interaction device is electrically connected to the substrate.

16. The digital pressure sensor of claim 1 , wherein the signal processing chip includes a data calibration module that compensates for the sensing signal.