Compositions and methods using same for deposition of silicon-containing film
Described herein are compositions and methods using same for forming a silicon-containing film such as without limitation a silicon oxide, silicon nitride, silicon oxynitride, a carbon-doped silicon nitride, or a carbon-doped silicon oxide film on at least a surface of a substrate having a surface feature. In one aspect, the silicon-containing films are deposited using a compound having Formula I or II described herein.
1. A method for depositing a silicon oxide film in a flowable chemical vapor deposition process, the method comprising:
placing a substrate having a surface feature into a reactor which are maintained at one or more temperatures ranging from about −20° C. to about 100 and a pressure of the reactor is maintained at 100 torr or less;
introducing into the reactor a mixture comprising a nitrogen source and a cyclodisilazane compound comprising at least one Si-H bond and having a boiling point between about 100° C. and about 200° C.;
wherein the cyclodisilazane compound comprising at least one Si—H bond and having a boiling point between about 100° C. and about 200° C. is 1,3-bis(tert-butyl)-2-methylcyclodisilazane and the 1,3-bis(tert-butyl)-2-methylcyclodisilazane reacts with the nitrogen source to form a nitride containing film on at least a portion of the surface feature at a temperature of about 40° C. or less;
treating the substrate with an oxygen source at one or more temperatures ranging from about 100° C. to about 1000° C. to form the silicon oxide film on at least a portion of the surface feature to provide the film; and
wherein the deposition process is a plasma enhanced chemical vapor deposition process and the plasma is generated remotely.
2. The method of claim 1 wherein the nitrogen source is selected from the group consisting of ammonia, hydrazine, monoalkylhydrazine, dialkylhydrazine, nitrogen, nitrogen plasma, a plasma comprising nitrogen and hydrogen, a plasma comprising nitrogen and helium, a plasma comprising nitrogen and argon, ammonia plasma, a plasma comprising ammonia and helium, a plasma comprising ammonia and argon, a plasma comprising ammonia and nitrogen, NF 3 , NF 3 plasma, organic amine plasma, and mixtures thereof.
3. The method of claim 1 wherein the deposition process is a plasma enhanced chemical vapor deposition and the plasma is generated in situ.
4. The method of claim 1 wherein the oxygen source is selected from the group consisting of water (H 2 O), oxygen (O 2 ), oxygen plasma, ozone (O 3 ), NO, N 2 O, carbon monoxide (CO), carbon dioxide (CO 2 ), N 2 O plasma, carbon monoxide (CO) plasma, carbon dioxide (CO 2 ) plasma, and combinations thereof.
5. The method of claim 1 wherein the film has a wet etch rate and the wet etch rate is less than 2.2 times that of a thermal oxide films in a 100:1 dilute HF solution.
6. The method of claim 1 further comprising: treating the film with at least one selected from plasma, ultraviolet light, infrared light, or combinations thereof.
7. The method of claim 1 , wherein the 1,3-bis(tert-butyl)-2-methylcyclodisilazane reacts with the nitrogen source to form a nitride containing film on at least a portion of the surface feature at a temperature of about 10° C. to about 20° C.