Flexible micrometeoroid shield

1. An apparatus comprising:

a multilayer particle shield for a spacecraft, the particle shield including an inboard exterior layer configured to be disposed proximal to the spacecraft, an outboard exterior layer configured to be disposed distal from the spacecraft and at least one interior layer disposed between the inboard exterior layer and the outboard exterior layer, wherein:

the interior layer includes a semi-rigid, porous, compressible spacer;

the interior layer has a thickness no less than 50 times larger than a respective thickness of the inboard exterior layer and the outboard exterior layer; and

the interior layer includes a polyimide foam having a density of at least 5 kg/m 3 and a 50% compression force deflection greater than 5 kPa.

2. The apparatus of claim 1 , wherein the inboard exterior layer and the outboard exterior layer comprise a polyester or polyimide film.

3. The apparatus of claim 2 , wherein the polyester or polyimide film is metalized with an aluminum or copper alloy.

4. The apparatus of claim 1 , wherein a metallized portion of each of the inboard exterior layer and the outboard exterior layer has a first thickness in the range of 1-5 mils.

5. The apparatus of claim 4 , wherein the first thickness is about 2 mils.

6. The apparatus of claim 1 , wherein the interior layer has a second thickness in the range of 0.1 to 0.5 inches.

7. The apparatus of claim 6 , wherein the second thickness is about 0.3 inches.

8. The apparatus of claim 1 , wherein:

the interior layer includes an inboard sublayer, an outboard sublayer and a central sublayer disposed therebetween;

the inboard sublayer and the outboard sublayer are configured as semi-rigid, porous, compressible spacers; and

the central sublayer includes a metalized film.

9. The apparatus of claim 1 , further comprising an electrically conductive coupling between at least a metalized portion of the inboard exterior layer and a metalized portion of the outboard exterior layer.

10. The apparatus of claim 9 , wherein the electrically conductive coupling includes a conductive tape disposed around at least a portion of a perimeter of the particle shield.

11. The apparatus of claim 1 , further comprising one or more inserts configured to prevent outward bulging of the outboard exterior layer.

12. The apparatus of claim 1 , wherein one or both of the inboard exterior layer and the outboard exterior layer includes or is associated with an RF shield.

13. The apparatus of claim 12 , wherein the RF shield includes a polyester-aluminum laminate.

14. The apparatus of claim 1 , wherein one or both of the inboard exterior layer and the outboard exterior layer includes or is associated with a particle radiation shield.

15. The apparatus of claim 14 , wherein the particle radiation shield includes copper or a copper alloy having a third thickness of about 5 mils.

16. A method comprising:

installing a multilayer particle shield onto a spacecraft, the particle shield including a first exterior layer, a second exterior layer and at least one interior layer disposed between the first exterior layer and the second exterior layer, and

installing the particle shield includes disposing the first exterior layer proximal to the spacecraft; wherein:

the interior layer includes a semi-rigid, porous, compressible spacer;

the interior layer has a thickness no less than 50 times larger than a respective thickness of the inboard exterior layer and the outboard exterior layer; and

the interior layer includes a polyimide foam having a density of at least 5 kg/m 3 and a 50% compression force deflection greater than 5 kPa.

17. The method of claim 16 , wherein the first exterior layer and the second exterior layer are configured from metalized polyester film.

18. The method of claim 17 , wherein:

the interior layer includes an inboard sublayer, an outboard sublayer and a central sublayer disposed therebetween;

the inboard sublayer and the outboard sublayer are configured as semi-rigid, porous, compressible spacers; and

the central sublayer includes a metalized polyester film.

19. The method of claim 16 , wherein:

the particle shield includes a first electrically conductive coupling between at least a metalized portion of the first exterior layer and a metalized portion of the second exterior layer; and

installing the particle shield includes providing a second electrically conductive coupling between the first electrically conductive coupling and an electrical ground point of the spacecraft.

20. The method of claim 16 , wherein installing the particle shield includes:

cutting, from a bulk amount of multilayer sheet stock, layers of the multilayer particle shield having a shape defined by a planar pattern;

stacking and joining the cut layers; and

forming the particle shield to fit a spacecraft location.