Carrier for lighting modules and lighting device

1. A lighting device comprising:

at least one carrier having a triangular cross section and comprising:

at least one mounting portion on an edge of the triangular cross section, the at least one mounting portion comprising at least three mounting faces, and

a heat sink body portion adjacent and protruding sidewards from the at least one mounting portion; and

at least one lighting module mounted on each of the at least three mounting faces.

2. The lighting device of claim 1 , wherein each of the at least three mounting faces comprises at least one mounting face contact section electrically coupled between at least two of the at least three mounting faces.

3. The lighting device of claim 1 , wherein the at least three mounting faces are arranged adjacent to each other.

4. The lighting device of claim 1 , wherein the at least three mounting faces are at an angle to each.

5. The lighting device of claim 1 , wherein the at least three mounting faces are substantially parallel to each other.

6. The lighting device of claim 1 , wherein a middle one of the at least three mounting faces has an enclosing angle of 45° to 135° with respect to the other two of the at least three mounting faces.

7. The lighting device of claim 1 , wherein the at least one lighting module comprises a plurality of lighting modules, and each of the at least three mounting faces is electrically coupled to at least two of the plurality of lighting modules.

8. The lighting device of claim 7 , further comprising a ceramic substrate thermally coupled to the at least one mounting portion.

9. The lighting device of claim 8 , further comprising:

at least one top routing layer,

at least one bottom routing layer, and

at least one third routing layer on a side of the ceramic substrate between the at least one top routing layer and the at least one bottom routing layer,

the at least one top routing layer, the at least one bottom routing layer, and the at least one third routing layer electrically coupling at least two of the plurality of the lighting modules in series.

10. The lighting device of claim 8 , wherein:

the at least one lighting module comprises at least three lighting module packages, each of the at least three lighting module packages comprising multiple top contact chips and being thermally coupled to each of the at least three mounting faces, and

each of the at least three mounting faces is electrically coupled in series via the at least one mounting face contact section of each of the at least three mounting faces.

11. The lighting device of claim 10 , further comprising:

at least one pre-molded package or at least one circuit board electrically coupling a first lighting module and a last lighting module of the multiple lighting modules with a connector to drive the at least three lighting module packages.

12. The lighting device of claim 9 , wherein the at least one pre-molded package or the at least one circuit board is configured to be coupled with the first lighting module and the last lighting module of the multiple lighting modules via a lead frame.

13. The lighting device of claim 7 , wherein at least one lighting module of the multiple lighting modules is configured to emit light of a different intensity than at least one other lighting module of the multiple lighting modules.

14. A method of manufacturing a lighting device comprising:

providing a carrier having a triangular cross section and comprising at least one mounting portion on an edge of the triangular cross section, the at least one mounting portion comprising at least three mounting faces;

thermally coupling a heat sink body portion to the at least one mounting portion of the carrier such that the heat sink body portion protrudes sidewards from the at least one mounting portion; and

mounting at least one lighting module on each of the at least three mounting faces.

15. The method of claim 14 , further comprising, prior to mounting the at least one lighting module:

providing a ceramic substrate comprising a top routing layer and a bottom routing layer, the ceramic substrate comprising multiple sections of ceramic tiles that are separable from each other and arranged in at least one of rows or columns;

forming a ceramic strip of the multiple sections of ceramic tiles;

depositing a third routing layer on a side between the top routing layer and the bottom routing layer; and

forming a monolithic ceramic tile of the ceramic strip.

16. The method of claim 14 , further comprising:

forming the heat sink body portion integrally with the at least one mounting portion;

mounting three respective lighting module packages comprising multiple top contact chips on each of the three mounting faces; and

electrically coupling the multiple top contact chips of each of the lighting module packages in series.

17. The method of claim 16 , further comprising:

mounting a pre-molded package or a circuit board to the carrier, the pre-molded package comprising a lead frame.

18. The method of claim 17 , further comprising:

arranging the pre-molded package or the circuit board in at least one cavity of the carrier; and

electrically coupling a first lighting module and a last lighting module of the three lighting module packages with the pre-molded package or the circuit board.