Package comprising stacked filters
A package that includes a first filter device and a second filter device coupled to the first filter device. The first filter device includes a first substrate comprising a first piezoelectric material, and a first metal layer coupled to a first surface of the first substrate. The second filter device includes a second substrate comprising a second piezoelectric material, and a second metal layer coupled to a first surface of the first substrate. The package includes a first pillar interconnect configured to be electrically coupled to the first metal layer of the first filter device, where the first pillar interconnect extends through the second filter device. The package further includes a second pillar interconnect configured to be electrically coupled to the second metal layer of the second filter device.
1. A package comprising:
a first filter device comprising:
a first substrate comprising a first piezoelectric material; and
a first metal layer coupled to a first surface of the first substrate;
a second filter device coupled to the first filter device, the second filter device comprising:
a second substrate comprising a second piezoelectric material; and
a second metal layer coupled to a first surface of the second substrate;
a first encapsulation layer over at least a portion of the first substrate and under at least a portion of the second substrate;
a first pillar interconnect configured to be electrically coupled to the first metal layer of the first filter device, wherein the first pillar interconnect extends through the second filter device and the first encapsulation layer;
a second pillar interconnect configured to be electrically coupled to the second metal layer of the second filter device; and
a third pillar interconnect configured to be electrically coupled to ground, the first filter device and the second filter device, wherein the third pillar interconnect extends through the second substrate of the second filter device.
2. The package of claim 1 , wherein the first pillar interconnect extends through the second substrate of the second filter device.
3. The package of claim 1 ,
wherein the second filter further comprises a second encapsulation layer, and
wherein the third pillar interconnect further extends through the second encapsulation layer of the second filter device.
4. The package of claim 3 , further comprising a passivation layer located between the second substrate and the third pillar interconnect.
5. The package of claim 1 , wherein the first filter device includes a void, the void defined at least in part by an absence of the first encapsulation layer over a portion of the first substrate.
6. The package of claim 5 , wherein the void includes a dome shaped void.
7. The package of claim 1 , wherein a front side of the first filter device is coupled to a back side of the second filter device.
8. The package of claim 1 , wherein a front side of the first filter device is coupled to a front side of the second filter device.
9. The package of claim 1 , wherein the first filter device is configured to operate as a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter.
10. The package of claim 1 , further comprising a passivation layer located (i) between the first pillar interconnect and the first substrate, and (ii) between the second pillar interconnect and the second substrate.
11. The package of claim 1 , wherein the first filter device includes the first encapsulation layer coupled to at least a portion of the first substrate.
12. The package of claim 1 , wherein the first filter device comprises:
a first dielectric layer coupled to the first substrate; and
a sealing layer coupled to the first dielectric layer.
13. An apparatus comprising:
means for first signal filtering comprising a first substrate;
means for second signal filtering coupled to the means for first signal filtering, wherein the means for second signal filtering comprises a second substrate;
a first encapsulation layer over at least a portion of the means for first signal filtering and under at least a portion of the means for second signal filtering;
means for first pillar interconnection configured to be electrically coupled to the means for first signal filtering, wherein the means for first pillar interconnection extends through the means for second signal filtering wherein the first pillar interconnect extends through the second filter device and the first encapsulation layer;
means for second pillar interconnection configured to be electrically coupled to the means for second signal filtering; and
a passivation layer located (i) between the means for first pillar interconnection and the first substrate, and (ii) between the means for second pillar interconnection and the second substrate.
14. The apparatus of claim 13 , further comprising means for third pillar interconnection configured to be electrically coupled to ground, the means for first signal filtering and the means for second signal filtering, wherein the means for third pillar interconnection extends through the means for second signal filtering.
15. The apparatus of claim 13 , wherein a front side of the means for first signal filtering is coupled to a back side of the means for second signal filtering.
16. The apparatus of claim 13 , wherein a front side of the means for first signal filtering is coupled to a front side of the means for second signal filtering.
17. The apparatus of claim 13 , wherein the apparatus includes a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.
18. A method for fabricating a package, comprising:
providing a first filter device comprising:
a first substrate comprising a first piezoelectric material; and
a first metal layer coupled to a first surface of the first substrate;
coupling a second filter device to the first filter device, the second filter device comprising:
a second substrate comprising a second piezoelectric material; and
a second metal layer coupled to a first surface of the second substrate;
providing a first encapsulation layer over at least a portion of the first substrate and under at least a portion of the second substrate;
forming a first pillar interconnect configured to be electrically coupled to the first metal layer of the first filter device, wherein the first pillar interconnect extends through the second filter device and the first encapsulation layer;
forming a second pillar interconnect configured to be electrically coupled to the second metal layer of the second filter device; and
forming a third pillar interconnect configured to be electrically coupled to ground, the first filter device and the second filter device, wherein the third pillar interconnect extends through the second substrate of the second filter device.
19. The method of claim 18 , wherein the first pillar interconnect extends through the second substrate of the second filter device.
20. The method of claim 18 , further comprising forming a passivation layer located (i) between the first pillar interconnect and the first substrate, and (ii) between the second pillar interconnect and the second substrate,
wherein the second filter further comprises a second encapsulation layer, and
wherein the third pillar interconnect further extends through the second encapsulation layer of the second filter device.