Low-halogen flame retardant polyamide compositions resistant to heat aging
A low-halogen flame retardant thermoplastic polyamide composition providing improved mechanical and electrical stability at elevated temperatures, where the thermoplastic composition comprises a polyamide resin; a non-halogen flame retardant; a heat stabilizer containing a copper halide and an organophosphorus compound; an optional lubricant and/or mold release agent; and an optional colorant.
1. A low-halogen thermoplastic polyamide composition consisting of:
a polyamide resin;
a melamine salt or a melamine adduct non-halogen flame retardant;
greater than 0.03% by weight of a copper-containing heat stabilizer comprising a copper halide and an organophosphorus compound;
0-5% by weight of a colorant;
0-5% by weight of a lubricant; and
0-5% by weight of a mold release agent;
wherein the polyamide composition comprises less than 1500 ppm halogen; and
wherein the polyamide composition demonstrates a relative thermal index value measured at a 0.4 mm thickness of greater than 130.
2. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide composition comprises less than 1300 ppm bromine.
3. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide resin is selected from the group consisting of PA-4,6; PA-6,I; PA-6,T;
PA-6,6; PA-6/6,6; and a mixture thereof.
4. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide resin comprises a first polyamide resin and a second polyamide resin.
5. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide resin consists of PA-6,6.
6. The thermoplastic polyamide composition according to claim 4 , wherein the first polyamide resin comprises a PA-6,6 resin and the second polyamide resin comprises a PA-6 resin.
7. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide composition comprises from 70 ppm to 135 ppm copper.
8. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide composition demonstrates a relative thermal index value measured at a 0.4 mm thickness of greater than 150.
9. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide composition demonstrates a volume resistivity greater than 1.00×10 15 Ω-cm, as measured according to IEC 60093.
10. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide composition demonstrates a flexural modulus greater than 3700 MPa, as measured according to ISO 178.
11. The thermoplastic polyamide composition according to claim 1 , wherein the polyamide composition is unfilled.
12. An article obtained from the thermoplastic polyamide composition according to claim 1 .
13. A low-halogen thermoplastic polyamide composition consisting of:
a polyamide resin comprising PA-6,6; PA-6T; PA-6I; or PA-6,6/6T/6I; or mixtures and copolyamides thereof;
a melamine salt or a melamine adduct non-halogen flame retardant;
0.03-2.5% by weight of a copper-containing heat stabilizer comprising a copper halide and an organophosphorus compound;
0-5% by weight of a colorant;
0-5% by weight of a lubricant; and
0-5% by weight of a mold release agent;
wherein the polyamide composition comprises less than 1500 ppm halogen; and
wherein the polyamide composition demonstrates a relative thermal index value measured at a 0.4 mm thickness of greater than 130.
14. The thermoplastic polyamide composition according to claim 13 , wherein the polyamide resin comprises PA-6,6; or PA-6,6/6T/6I; or combinations thereof.
15. An article obtained from the thermoplastic polyamide composition according to claim 13 .
16. A low-halogen thermoplastic polyamide composition consisting of:
50-95% by weight of a polyamide resin;
1-30% by weight of a melamine salt or a melamine adduct non-halogen flame retardant;
0.03-2.5% by weight of a copper-containing heat stabilizer comprising a copper halide and an organophosphorus compound; and
0-5% by weight of a colorant;
0-5% by weight of a lubricant;
0-5% by weight of a mold release agent;
wherein the polyamide composition comprises less than 1500 ppm halogen; and
wherein the polyamide composition demonstrates a relative thermal index value measured at a 0.4 mm thickness of greater than 130.
17. The thermoplastic polyamide composition according to claim 16 , wherein the polyamide composition comprises less than 1300 ppm bromine.
18. The thermoplastic polyamide composition according to claim 16 , wherein the polyamide resin is selected from the group consisting of PA-4,6; PA-6,I; PA-6,T; PA-6,6; PA-6/6,6; and a mixture thereof.
19. The thermoplastic polyamide composition according to claim 16 , wherein the polyamide resin consists of PA-6,6.
20. An article obtained from the thermoplastic polyamide composition according to claim 16 .