IP Library Granted Patent US 12,278,031
Granted Patent B2
US 12,278,031 · App. 17/094,431 · Granted Apr 15, 2025

Soft magnetic composite materials and methods and powders for producing the same

Inventors: Francis William Herbert (Pennsylvania, PA); Chins Chinnasamy (Lancaster, PA); James William Sears (Reading, PA); Christopher Phillip Allen (West Reading, PA); Jaydip Das (Santa Clara, CA); Nir Vaks (Reading, PA)
Assignee: Carpenter Technology Corporation
H01F1/147B22F1/08B22F1/102B22F1/16B22F3/15B22F10/10B22F10/12B22F10/14B22F10/20B22F10/64B33Y10/00H01F41/02B22F1/065B22F1/068B22F10/34B22F2304/056
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Quick Facts
Patent No.
US 12,278,031
App. No.
17/094,431
Granted
Apr 15, 2025
Kind
B2
Abstract

A powder including a plurality of particulates, each particulate including a soft magnetic metallic core coated with a continuous dielectric coating having a thickness selected from a range of 100 nanometers to 100 micrometers. The particulates have a mean particle size selected from a range of 100 nanometers to 250 micrometers. Methods for forming the powder are disclosed. A soft magnetic composite component includes a soft magnetic material in a dielectric matrix, wherein (i) the soft magnetic material comprises a plurality of particulates comprising metallic cores, (ii) each metallic core is coated by a continuous dielectric coating covering >90% of a surface area of the metallic core, (iii) the metallic cores are electrically isolated from each other, and (iv) the dielectric coatings of adjacent metallic cores are consolidated together. Methods for formation of the soft magnetic component by additive manufacturing and hot isostatic pressing are disclosed.

Claims (19)

1. A method for fabricating a soft magnetic composite component by additive manufacturing, the method comprising:

providing to an additive manufacturing system a powder comprising a plurality of particulates, each particulate comprising a soft magnetic metallic core coated with a continuous conformal dielectric coating comprising a dielectric material covering more than 90% of a surface area of the metallic core, wherein the continuous conformal dielectric coating is formed by deposition; and

fabricating the soft magnetic composite component by forming consolidated material from the powder by additive manufacturing,

wherein (i) additive manufacturing comprises Binder Jetting, (ii) a porosity of the magnetic composite component is less than 5% by volume, and (iii) the soft magnetic metallic cores in the magnetic composite component are electrically and magnetically isolated from each other by a continuous three-dimensional network of the dielectric material.

2. The method of claim 1 , wherein the metallic core comprises a soft magnetic pure metal or alloy comprising at least one of Fe, Co, Ni, Fe—Co, Fe—Co—V, Fe—Ni, Fe—Si, FeCoSiB, FeSiAl, amorphous magnetic materials, metal-metalloid systems (metallic glasses), or alloys or combinations thereof.

3. The method of claim 1 , wherein the metallic core comprises a coercivity selected from a range of 0.01 Oe to 50 Oe.

4. The method of claim 1 , wherein the continuous three-dimensional network of the dielectric material comprises physical interfaces disposed between proximate particulates.

5. The method of claim 1 , wherein the continuous dielectric coating comprises a first surface layer comprising a dielectric material comprising at least one of a hydride, an oxide, a nitride, a boride, a carbide, carbon, a sulfide, a fluoride, a polymer, phosphorus, or combinations thereof.

6. The method of claim 1 , wherein a thickness of the continuous dielectric coating is less than 1 micrometer.

7. The method of claim 1 , wherein fabricating the soft magnetic composite component comprises a densification step after additive manufacturing.

8. The method of claim 1 , wherein the magnetic composite component has a tensile breaking strength greater than 150 MPa.

9. The method of claim 1 , wherein the particulates comprise a unimodal particle size distribution with a mean particle size selected from a range of 100 nanometers to 250 micrometers.

10. The method of claim 1 , wherein the powder further comprises a plurality of uncoated soft magnetic particulates, and a smaller mean particle size of the powder is a mean particle size of the uncoated soft magnetic particulates and a larger mean particle size of the powder is a mean particle size of the coated particulates, the plurality of uncoated soft magnetic particulates and the coated particulates comprising a same alloy.

11. The method of claim 1 , wherein the continuous dielectric coating comprises a plurality of heterogeneous surface layers.

12. The method of claim 1 , wherein a shape of each particulate is at least one of flat or oblong.

13. The method of claim 1 , wherein a ratio of dielectric material to metal in the component is selected from a range of 1:1-1:2,500.

14. The method of claim 7 , wherein densification comprises an isostatic method.

15. The method of claim 1 , wherein deposition of the continuous conformal dielectric coating comprises at least one of atomic layer deposition (ALD), molecular layer deposition, physical vapor deposition, sol-gel, chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), plasma torch synthesis, spray coating, high velocity oxygen fuel coating, arc coating, co-precipitation, epoxy coating, a supercritical CO 2 method, high pressure coating, or combinations thereof or (i) functionalizing each magnetic metallic core by applying a plurality of dielectric nanoparticles to the core, and (ii) densifying the dielectric nanoparticles to form the continuous dielectric coating.

16. The method of claim 1 , wherein a thickness of the continuous conformal dielectric coating is at least 100 nanometers.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2025
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: CARPENTER TECHNOLOGY CORPORATION
Reel/Frame 072983/0743 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2024
From: HERBERT, FRANCIS WILLIAM; CHINNASAMY, CHINS; SEARS, JAMES WILLIAM; ALLEN, CHRISTOPHER PHILLIP; DAS, JAYDIP; VAKS, NIR
To: CARPENTER TECHNOLOGY CORPORATION
Reel/Frame 066341/0462 →
SECURITY INTEREST Recorded Apr 14, 2023
From: CARPENTER TECHNOLOGY CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063326/0230 →
Continuity (2)
Provisional Application 62933785 · Nov 11, 2019
Related Publication 20210142933A1 · May 13, 2021
References Cited (119)
US 4177089A · Bankson · 1979 [cited by applicant]
US 5238507A · Kugimiya et al. · 1993 [cited by applicant]
US 5352522A · Kugimiya et al. · 1994 [cited by applicant]
US 5629092A · Gay et al. · 1997 [cited by applicant]
US 6051324A · Moorhead et al. · 2000 [cited by applicant]
US 6171363B1 · Shekhter et al. · 2001 [cited by applicant]
US 6203897B1 · Koizumi et al. · 2001 [cited by applicant]
US 6485579B1 · Nillius et al. · 2002 [cited by applicant]
US 6686406B2 · Tomomatsu et al. · 2004 [cited by applicant]
US 6762925B2 · Uchida et al. · 2004 [cited by applicant]
US 6817085B2 · Uchikoba et al. · 2004 [cited by applicant]
US 7147916B2 · Iwasaki et al. · 2006 [cited by applicant]
US 7172660B2 · Song et al. · 2007 [cited by applicant]
US 7175717B2 · Song et al. · 2007 [cited by applicant]
US 7255941B2 · Kijima et al. · 2007 [cited by applicant]
US 7390567B2 · Matsukawa et al. · 2008 [cited by applicant]
US 7532099B2 · Brunner · 2009 [cited by applicant]
US 7700194B2 · Suetsuna et al. · 2010 [cited by applicant]
US 7740939B2 · Harada et al. · 2010 [cited by applicant]
US 7815820B2 · Tan et al. · 2010 [cited by applicant]
US 7871474B2 · Unoki et al. · 2011 [cited by applicant]
US 8313087B2 · Hesse et al. · 2012 [cited by applicant]
US 8329087B2 · Shimizu · 2012 [cited by applicant]
US 8840800B2 · Suetsuna et al. · 2014 [cited by applicant]
US 8864929B2 · Aramaki et al. · 2014 [cited by applicant]
US 9196403B2 · Maeda et al. · 2015 [cited by applicant]
US 9248501B1 · Johannes et al. · 2016 [cited by applicant]
US 9251458B2 · Finn et al. · 2016 [cited by applicant]
US 9596755B2 · Sethumadhavan et al. · 2017 [cited by applicant]
US 9676927B2 · Musick et al. · 2017 [cited by applicant]
US 9887598B2 · Hosek et al. · 2018 [cited by applicant]
US 9943909B2 · Akimoto et al. · 2018 [cited by applicant]
US 10022789B2 · Hosek et al. · 2018 [cited by applicant]
US 10150184B2 · Bruck et al. · 2018 [cited by applicant]
US 10259072B2 · Holcomb · 2019 [cited by applicant]
US 10269479B2 · Simon et al. · 2019 [cited by applicant]
US 10312019B2 · Zlatkov · 2019 [cited by applicant]
US 10328491B2 · Heikkila · 2019 [cited by applicant]
US 20020025272A1 · Witherspoon · 2002 [cited by examiner]
US 20030129405A1 · Zhang et al. · 2003 [cited by applicant]
US 20040060683A1 · Sercombe et al. · 2004 [cited by applicant]
US 20040086708A1 · Verma et al. · 2004 [cited by applicant]
US 20050019558A1 · Verma et al. · 2005 [cited by applicant]
US 20050257854A1 · Maeda · 2005 [cited by examiner]
US 20070290161A1 · Tokuoka et al. · 2007 [cited by applicant]
US 20090197063A1 · Uchikiba et al. · 2009 [cited by applicant]
US 20100001226A1 · Aramaki et al. · 2010 [cited by applicant]
US 20130056674A1 · Inagaki et al. · 2013 [cited by applicant]
US 20130057371A1 · Shimoyama et al. · 2013 [cited by applicant]
US 20130292081A1 · Hosek · 2013 [cited by examiner]
US 20140291886A1 · Mark et al. · 2014 [cited by applicant]
US 20150050178A1 · Chan et al. · 2015 [cited by applicant]
US 20150076732A1 · Kemmer et al. · 2015 [cited by applicant]
US 20150353773A1 · Dornseif et al. · 2015 [cited by applicant]
US 20160043602A1 · Hosek et al. · 2016 [cited by applicant]
US 20160064144A1 · Wang · 2016 [cited by applicant]
US 20160230026A1 · Furusawa · 2016 [cited by applicant]
US 20160263833A1 · Vittitow et al. · 2016 [cited by applicant]
US 20160307679A1 · Taheri et al. · 2016 [cited by applicant]
US 20160368056A1 · Swaminathan et al. · 2016 [cited by applicant]
US 20170095858A1 · Stankowski et al. · 2017 [cited by applicant]
US 20170120386A1 · Lin et al. · 2017 [cited by applicant]
US 20170144224A1 · DeMuth et al. · 2017 [cited by applicant]
US 20170239719A1 · Buller · 2017 [cited by examiner]
US 20170252804A1 · Hanni et al. · 2017 [cited by applicant]
US 20170306221A1 · Koole et al. · 2017 [cited by applicant]
US 20180001553A1 · Buller et al. · 2018 [cited by applicant]
US 20180021854A1 · Fukada et al. · 2018 [cited by applicant]
US 20180158604A1 · Craft et al. · 2018 [cited by applicant]
US 20180214944A1 · Martin et al. · 2018 [cited by applicant]
US 20180298215A1 · Andersen et al. · 2018 [cited by applicant]
US 20180311728A1 · Kottilingam et al. · 2018 [cited by applicant]
US 20180319108A1 · Sherrer et al. · 2018 [cited by applicant]
US 20180339340A1 · Karlen et al. · 2018 [cited by applicant]
US 20180369909A1 · Ibe et al. · 2018 [cited by applicant]
US 20180369912A1 · Gold · 2018 [cited by applicant]
US 20190062871A1 · Wilson et al. · 2019 [cited by applicant]
US 20190076926A1 · Imano et al. · 2019 [cited by applicant]
US 20190193151A1 · Okumura et al. · 2019 [cited by applicant]
US 20190193160A1 · Brunhuber et al. · 2019 [cited by applicant]
US 20200399744A1 · Smith et al. · 2020 [cited by applicant]
US 20210035716A1 · Adharapurapu · 2021 [cited by examiner]
CN 104332265A · 2015 [cited by applicant]
EP 0541887A1 · 1993 [cited by applicant]
EP 1201621A1 · 2002 [cited by applicant]
EP 1521276A2 · 2005 [cited by applicant]
EP 2226142A1 · 2010 [cited by applicant]
EP 2752244A1 · 2014 [cited by applicant]
EP 3138643A1 · 2017 [cited by applicant]
JP H04226003A · 1992 [cited by applicant]
JP H06204021A · 1994 [cited by applicant]
JP 4211591B2 · 2009 [cited by applicant]
JP 4601907B2 · 2010 [cited by applicant]
JP 5555945B2 · 2014 [cited by applicant]
KR 101826421B1 · 2018 [cited by applicant]
WO WO2007052772A1 · 2007 [cited by applicant]
WO 2014149761A2 · 2014 [cited by applicant]
WO WO2015142494A1 · 2015 [cited by applicant]
WO WO2016196223A1 · 2016 [cited by applicant]
WO WO2017099478A1 · 2017 [cited by applicant]
WO WO2017203717A1 · 2017 [cited by applicant]
WO WO2018091855A1 · 2018 [cited by applicant]
WO WO2018167430A1 · 2018 [cited by applicant]
WO WO2018208155A1 · 2018 [cited by applicant]
WO WO19089764 · 2019 [cited by applicant]
WO WO2020014287A2 · 2020 [cited by applicant]
Maklakov et al. Corrosion-resistive magnetic powder Fe@SiO2 for microwave applications, Journal of Alloys and Compounds 706 (2017) pp. 267-273 (Year: 2017). [cited by examiner]
The International Search Report and Written Opinion for PCT/US2020/059872 dated Feb. 4, 2021. [cited by applicant]
“3D Printing New Method, Additive Manufacturing with Powder Bed,” Aerospace Engineering, https://www.youtube.com/watch?app=desktop&v=r0vLl-S5ZtQ, Nov. 5, 2017. [cited by applicant]
Akedo, “Aerosol Deposition of Ceramic Thick Films at Room Temperature: Densification Mechanism of Ceramic Layers,” Journal of the American Ceramic Society, (2006), vol. 89, Issue 6, pp. 1834-1839, (Abstract only). [cited by applicant]
Benack, et al., “Additive Manufacturing Methods for Soft Magnetic Composites (SMCs),” Microsc. Microanal., (2018), 24 Suppl 1, pp. 1066-1067. [cited by applicant]
“Metal Powder and Powder Metallurgy Technology,” Mechanicstips.blogspot.com, https://www.youtube.com/watch?v=weystTEhGkk, Mar. 23, 2018. [cited by applicant]
Murr, “A Metallographic Review of 3D Printing/Additive Manufacturing of Metal and Alloy Products and Components,” Metallography, Microstructure, and Analysis, (2018), pp. 103-132. [cited by applicant]
Roy, et al., “Characterization of Nanocrystalline NiCuZn Ferrite Powders Synthesized by Sol-Gel Auto-Combustion Method,” Journal of Materials Processing Technology, (2008), vol. 197, Issues 1-3, pp. 279-283. [cited by applicant]
Shishkovsky, et al., “Thermoelectric Properties of Gradient Polymer Composites with Nano-Inclusions Fabricated by Laser Assisted Sintering,” Laser Physics Letters, (2017), vol. 14, No. 3, (Abstract only). [cited by applicant]
Yan, et al., “Additive Manufacturing of Magnetic Components for Power Electronics Integration,” Presentation at 3DPEIM, (2016), pp. 1-12. [cited by applicant]
Suzuki et al. (1997) “Native Oxide Layers Formed on the Surface of Ultra High-Purity Iron and Copper Investigated by Angle Resolved XPS,” Materials Transactions, JIM 38(11):1004-1009. [cited by applicant]
Martin et al. (2017) “3D printing of high-strength aluminium alloys,” Nature (549):365-380. [cited by applicant]
Smith et al. “NASA High Temperature Alloy Development—GRX-810,” Turbo Expo 2023 (16 pages). [cited by applicant]