PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING PACKAGING STRUCTURE
Packaging structure includes a first packaging component and a second packaging component arranged in the first packaging component. The packaging component includes a first substrate, a first redistribution layer, a first electronic component, and a first packaging body. The first redistribution layer is arranged on the first substrate. The first electronic component is arranged on the first redistribution layer and electrically coupled to the first redistribution layer. The first packaging body is arranged on the first substrate and covers the first electronic component. The second packaging component includes a second substrate, a second redistribution layer, a second electronic component, and a second packaging body. The redistribution layer is arranged on the second substrate and electrically coupled to the first redistribution layer. The second electronic component is arranged on the second redistribution layer and electrically coupled to the second redistribution layer. The second packaging body covers the second electronic component.
1 . A packaging structure comprising:
a first packaging component comprising a first substrate, a first redistribution layer, at least one first electronic component, and a first packaging body, the first redistribution layer arranged on the first substrate, the at least one first electronic component arranged on the first redistribution layer and electrically coupled to the first redistribution layer, and the first packaging body arranged on the first substrate and covering the at least one first electronic component; and
a second packaging component arranged in the first packaging component, the second packaging component comprising a second substrate, a second redistribution layer, at least one second electronic component, and a second packaging body, the redistribution layer arranged on the second substrate and electrically coupled to the first redistribution layer, the at least one second electronic component arranged on the second redistribution layer and electrically coupled to the second redistribution layer, and the second packaging body covering the at least one second electronic component.
2 . The packaging structure of claim 1 , further comprising a conductive member, wherein:
the first packaging body is provided with a blind hole facing the first substrate;
the conductive member is received in the blind hole; and
the first redistribution layer and the second redistribution layer are electrically coupled through the conductive member.
3 . The packaging structure of claim 2 , wherein:
the conductive member is a metal pad, a stud, a conductive column, or a solder ball.
4 . The packaging structure of claim 1 , wherein:
each first electronic component is provided with a first contact;
each first electronic component is electrically coupled through the first contact to the first redistribution layer.
5 . The packaging structure of claim 2 , wherein:
each first electronic component is provided with a first contact;
each first electronic component is electrically coupled through the first contact to the first redistribution layer.
6 . The packaging structure of claim 3 , wherein:
each first electronic component is provided with a first contact;
each first electronic component is electrically coupled through the first contact to the first redistribution layer.
7 . The packaging structure of claim 1 , wherein:
the first packaging component comprises a plurality of the first redistribution layers; and
the at least one first electronic component is arranged on the plurality of first redistribution layers.
8 . The packaging structure of claim 7 , wherein:
the second packaging component comprises a plurality of the second redistribution layers; and
the at least one second electronic component is arranged on the plurality of second redistribution layers.
9 . The packaging structure of claim 1 , wherein:
the second packaging body completely covers the at least one second electronic component.
10 . A method for manufacturing a packaging structure, the method comprising:
providing a first substrate;
forming a first redistribution layer on the first substrate;
providing at least one first electronic component, the at least one first electronic component arranged on the first redistribution layer and electrically coupled to the first redistribution layer;
providing a second packaging component comprising a second substrate, a second redistribution layer, at least one second electronic component, and a second packaging body, the second redistribution layer arranged on the second substrate and electrically coupled to the first redistribution layer, the at least one second electronic component arranged on the second redistribution layer and electrically coupled to the second redistribution layer, and the second packaging body covering the at least one second electronic component; and
forming a first packaging body on the first substrate, the first packaging body covering the at least one first electronic component and the second packaging component.
11 . The manufacturing method of claim 10 , further comprising:
after forming the first redistribution layer, forming a conductive member on the first redistribution layer, the conductive member electrically coupled to the first redistribution layer and the second redistribution layer.