Chassis structure
A chassis structure is disclosed. The chassis structure has a chassis with a storage space and a computer node. The storage space is provided for accommodating the computer node. The node has a body removably stored in the storage space. The body has a front and a back portion. The node has a tray frame located in the front portion. The node has a sliding assembly for longitudinally and slideably moving the tray frame between a received and a withdrawn position. The back portion has a first and a second ducting structure, and is provided for accommodating two components. The first ducting structure disposed over the first component, and the second ducting structure disposed over the second component. The first ducting structure is offset from the second ducting structure for guiding different portions of the fluid flow over the first component and the second component, respectively.
1. A chassis structure, comprising:
a chassis including:
a first bottom panel;
a first sidewall and a second sidewall longitudinally extending in the chassis and located on respective sides of the first bottom panel;
a partition wall longitudinally extending in the chassis;
a back wall extending between the first sidewall and the second sidewall at a back of the chassis, the back wall having apertures for allowing fluid flow between inside of the chassis and outside of the chassis;
the first bottom panel, the first sidewall, the second sidewall, the partition wall, and the back wall defining two storage spaces in the chassis;
a given one of the two storage spaces accommodating a computer node, the computer node including:
a body including:
a second bottom panel;
a third sidewall and a fourth sidewall longitudinally extending in the body and located on respective sides of the second bottom panel;
the body being removably stored in the given one of the two storage spaces,
the body having a front portion and a back portion, the front portion and the back portion being disposed longitudinally sequentially in the body from a front end of the body to a back end of the body;
a tray frame located in the front portion of the body and including a top access opening,
the tray frame for accommodating a first electronic component;
a sliding assembly including (i) a side of the tray frame and (ii) a corresponding one of the third sidewall and the fourth sidewall,
the sliding assembly configured for longitudinally and slideably moving the tray frame between a received position and a withdrawn position,
the back portion of the body including a first ducting structure and a second ducting structure,
the back portion for accommodating a second electronic component and an other second electronic component;
the first ducting structure disposed over the second electronic component, the first ducting structure for guiding the fluid flow over the second electronic component for cooling the second electronic component during operation;
the second ducting structure disposed over the other second electronic component, the second ducting structure for guiding the fluid flow over the other second electronic component for cooling the other second electronic component during operation;
the first ducting structure being offset from the second ducting structure for guiding different portions of the fluid flow over the second electronic component and the other second electronic component, respectively.
2. The chassis structure of claim 1 , wherein the first electronic component has a first operation temperature and the second electronic component has a second operation temperature, the second operation temperature being above the first operation temperature.
3. The chassis structure of claim 1 , wherein the first ducting structure being offset from the second ducting structure includes the first ducting structure being longitudinally offset from the second ducting structure in the body.
4. The chassis structure of claim 1 , wherein the first ducting structure being offset from the second ducting structure includes the first ducting structure being laterally offset from the second ducting structure along a longitudinal axis of the body.
5. The chassis structure of claim 1 , wherein the first ducting structure guides a first portion of the fluid flow over the second electronic component and the second ducting structure guides a second portion of the fluid flow over the other second electronic component,
the back portion further including a third ducting structure,
the third ducting structure being disposed in the back portion of the body so as to prevent fluid communication between the first portion of the fluid flow and the second portion of the fluid flow.
6. The chassis structure of claim 5 , wherein the third ducting structure has a vertically extending wall, the vertically extending wall being a fluid barrier for preventing fluid communication between the first portion of the fluid flow and the second portion of the fluid flow.
7. The chassis structure of claim 5 , wherein the third ducting structure is disposed longitudinally in between the second electronic component and the other second electronic component.
8. The chassis structure of claim 5 wherein the first ducting structure, the second ducting structure and the third ducting structure are integrally formed.
9. The chassis structure of claim 1 , wherein the chassis structure is configured to be accommodated in a server rack.
10. The chassis structure of claim 9 , wherein at least one of the chassis structure and the server rack further includes a fan,
the fan for generating the fluid flow (i) from a front end of the chassis, (ii) towards a back end of the chassis and (iii) towards the outside of the chassis.
11. The chassis structure of claim 10 , wherein the fan is longitudinally aligned with the apertures and is removably attached to the back wall.
12. The chassis structure of claim 1 , wherein the back portion of the body further has a motherboard, the second electronic component being electrically coupled to and located on the motherboard.
13. The chassis structure of claim 12 , wherein the motherboard is configured for electrically coupling external storage devices.
14. The chassis structure of claim 12 , wherein the motherboard includes a DC converter for operating under at least one of a first voltage and a second voltage.
15. The chassis structure of claim 14 , wherein the tray frame is further for accommodating a fourth electronic component disposed longitudinally sequentially in the tray frame after the first electronic component.
16. The chassis structure of claim 15 , wherein the withdrawn position includes a first withdrawn position and a second withdrawn position, and wherein the fourth electronic component is accessible through the top access opening only in the second withdrawn position.
17. The chassis structure of claim 15 , wherein the tray frame further includes a latching assembly for pivotably moving the fourth electronic component from a stored position to an easy-access position,
the fourth electronic component in the stored position being parallel to the top access opening,
the fourth electronic component in the easy-access position being at an angle with the top access opening.
18. The chassis structure of claim 15 , wherein a fourth ducting structure is located in the tray frame and disposed over the fourth electronic component, the fourth ducting structure including a plurality of back-facing apertures for distributing the fluid flow.
19. The chassis structure of claim 1 , wherein the computer node includes a network port, the network port for acquiring processable tasks to be processed by the second electronic component, the network port being located on a given side of the tray frame and facing a front of the chassis structure.
20. The chassis structure of claim 1 , wherein the withdrawn position includes a first withdrawn position and a second withdrawn position, and wherein the first electronic component is accessible through the top access opening in the first withdrawn position and the second withdrawn position.