Wavelength converting layer patterning for LED arrays
A method includes depositing a layer comprising a photoinitiator and a curable material onto a surface and applying a nanoimprint mold on the layer of curable material to form a mesh comprising intersecting walls defining cavities. After applying the nanoimprint mold, the mesh is illuminated with light causing decarboxylation of the photoinitator to initiate curing of the curable material. After curing the curable material, the nanoimprint mold is removed and a wavelength converting material is deposited in the cavities to form an array of wavelength converting pixels.
1. A method comprising:
depositing a layer comprising a photoinitiator and a curable material onto a surface;
applying a mold on the layer of curable material to form a mesh comprising intersecting walls defining cavities;
after applying the mold, illuminating the mesh with light causing decarboxylation of the photoinitator to initiate curing of the curable material;
after curing the curable material removing the mold; and
after removing the mold depositing a wavelength converting material in the cavities to form an array of wavelength converting pixels.
2. The method of claim 1 , wherein the pixels in the array have widths of 100 microns or less and adjacent pixels are spaced apart by 20 microns or less.
3. The method of claim 1 , comprising aligning an array of light emitting semiconductor diodes with the array of wavelength converting pixels and attaching each wavelength converting pixel to a corresponding light emitting semiconductor diode.
4. The method of claim 1 , wherein the curable material comprises one or more of a siloxane material, a polysilazane, or a sol-gel material.
5. The method of claim 1 , wherein the photoinitiator is a salt.
6. The method of claim 1 , wherein the decarboxylated photoinitator catalyzes reaction of chain ends or cross-linkable substrates of the curable material.
7. The method of claim 1 , wherein the decarboxylated photoinitiator catalyzes a condensation polymerization or a ring opening polymerization of the curable material.
8. The method of claim 1 , wherein the decarboxylation produces a super base.
9. The method of claim 8 , comprising removing the super base by evaporation or thermal decomposition of the super base after curing of the curable material.
10. The method of claim 1 , wherein:
the curable material comprises one or more of a siloxane material, a polysilazane, or a sol-gel material;
the photoinitiator is a salt;
illuminating the mesh with light comprises illuminating the mesh with ultraviolet light absorbed by the photoinitiator to cause the decarboxylation of the photoinitiator; and
decarboxylation of the photoiniator produces a super base.
11. The method of claim 10 , wherein the super base catalyzes reaction of chain ends or crosslinkable substrates of the curable material.
12. The method of claim 10 , wherein the super base catalyzes a condensation polymerization or a ring opening polymerization of the curable material.
13. The method of claim 10 , comprising removing the super base by evaporation or thermal decomposition of the super base after curing of the curable material.
14. The method of claim 10 , wherein the pixels in the array have widths of 100 microns or less and adjacent pixels are spaced apart by 20 microns or less.
15. The method of claim 10 , comprising aligning an array of light emitting semiconductor diodes with the array of wavelength converting pixels and attaching each wavelength converting pixel to a corresponding light emitting semiconductor diode.
16. The method of claim 10 , wherein:
the super base catalyzes reaction of chain ends or cross-linkable substrates of the curable material; and
the pixels in the array have widths of 100 microns or less and adjacent pixels are spaced apart by 20 microns or less.
17. The method of claim 16 , comprising aligning an array of light emitting semiconductor diodes with the array of wavelength converting pixels and attaching each wavelength converting pixel to a corresponding light emitting semiconductor diode.
18. The method of claim 17 , comprising removing the super base by evaporation or thermal decomposition of the super base after curing of the curable material.
19. The method of claim 10 , wherein:
the super base catalyzes a condensation polymerization or a ring opening polymerization of the curable material; and
the pixels in the array have widths of 100 microns or less and adjacent pixels are spaced apart by 20 microns or less.
20. The method of claim 19 , comprising aligning an array of light emitting semiconductor diodes with the array of wavelength converting pixels and attaching each wavelength converting pixel to a corresponding light emitting semiconductor diode.
21. The method of claim 20 , comprising removing the super base by evaporation or thermal decomposition of the super base after curing of the curable material.