IP Library Granted Patent US 12,017,082
Granted Patent B2
US 12,017,082 · App. 17/097,891 · Granted Jun 25, 2024

Manufacturing implantable tissue stimulators

Inventors: Graham Patrick Greene (Miami Beach, FL); Benjamin Speck (Pompano Beach, FL); Paul Lombard (Coral Springs, FL)
Assignee: CURONIX LLC
A61N1/3756A61N1/37223H01L21/56H01L21/60H01L21/64B29C45/14336B29L2031/753H01L2021/60007
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Quick Facts
Patent No.
US 12,017,082
App. No.
17/097,891
Granted
Jun 25, 2024
Kind
B2
Abstract

A method of manufacturing an implantable stimulation device includes providing a circuit board of the implantable stimulation device, the circuit board optionally equipped with circuit components and being electrically connected to an antenna, adhering one or more electrodes to the circuit board, and applying an insulation material to the circuit board such that the insulation material forms a housing that surrounds the circuit board, the optional circuit components and antenna, while leaving the one or more electrodes exposed for stimulating a tissue.

Claims (36)

1. A method of manufacturing an implantable stimulation device, the method comprising:

providing a circuit board of the implantable stimulation device, the circuit board being equipped with circuit components and being electrically connected to an antenna;

attaching one or more joints to the circuit board;

after attaching the one or more joints, adhering one or more electrodes to the circuit board respectively by the one or more joints such that the electrodes are directly coupled to the circuit board by the one or more joints;

and

applying an insulation material to the circuit board such that the insulation material forms a housing that surrounds the circuit board, the circuit components, and the antenna, while leaving the one or more electrodes exposed for stimulating a tissue.

2. The method of claim 1 , further comprising attaching the one or more joints to the circuit board automatically by soldering, laser welding, or applying a conductive epoxy.

3. The method of claim 1 , further comprising forming the one or more joints such that each of the one or more joints has a cube-like shape.

4. The method of claim 1 , further comprising placing an assembly of the circuit board, equipped with the circuit components, the antenna, and the one or more electrodes, within an injection mold and filling the injection mold with the insulation material to form the housing of the implantable stimulation device.

5. The method of claim 1 , wherein the insulation material comprises silicone rubber.

6. The method of claim 1 , further comprising dip coating an assembly of the circuit board, equipped with the circuit components, the antenna, and the one or more electrodes, to form the housing of the implantable stimulation device.

7. A method of manufacturing an implantable stimulation device, the method comprising:

providing a circuit board of the implantable stimulation device, the circuit board being equipped with circuit components and being electrically connected to an antenna;

positioning at least a portion of the circuit board atop a support component, the support component defining a through opening sized to allow passage of a surgical tool;

covering at least a portion of the circuit board with a protective component, the protective component defining a channel that accommodates the circuit components on the circuit board;

adhering one or more electrodes to the circuit board; and

applying an insulation material to the circuit board such that the insulation material forms a housing that surrounds the circuit board, the circuit components, and the antenna, while leaving the one or more electrodes exposed for stimulating a tissue.

8. The method of claim 7 , further comprising:

alternately placing one or more spacers and the one or more electrodes over an assembly of the support component and the circuit board; and

adhering the one or more spacers and the one or more electrodes to the circuit board.

9. The method of claim 8 , wherein the one or more spacers comprise carbothane.

10. The method of claim 9 , wherein the assembly is a first assembly, wherein the first assembly, the one or more spacers, the one or more electrodes, and an extended housing component together form a second assembly, and wherein the method further comprises automatically surrounding the second assembly with a heat shrink tube.

11. The method of claim 10 , wherein at least a portion of the insulation material of the implantable stimulation device is provided by at least one of the extended housing component and the one or more spacers.

12. The method of claim 10 , further comprising:

securing the second assembly, equipped with the heat shrink tube, to a clamp of a reflow tower; and

translating a heating element shuttle of the reflow tower along the second assembly to flow the insulation material around the second assembly.

13. A method of manufacturing an implantable stimulation device, the method comprising:

providing a circuit board of the implantable stimulation device, the circuit board being equipped with circuit components and being electrically connected to an antenna;

placing a conductive material on the circuit board at a location;

after placing the conductive material, moving one or more of the circuit board and an electrode such that a portion of the circuit board passes through an opening of the electrode to position the conductive material in the opening of the electrode; and

attaching the electrode to the circuit board at the location using the conductive material.

14. The method of claim 13 , further comprising after attaching the electrode to the circuit board, applying an insulation material to the circuit board such that the insulation material forms a housing that surrounds the circuit board, the circuit components, and the antenna, while leaving the electrode exposed for stimulating a tissue.

15. The method of claim 13 , further comprising moving one or more of the circuit board and a spacer such that the portion of the circuit board passes through an opening of the spacer to position the spacer along the circuit board.

16. The method of claim 13 , further comprising before moving one or more of the circuit board and the electrode, positioning at least the portion of the circuit board atop a support component, the support component defining a through opening sized to allow passage of a surgical tool, wherein the support component slides through the opening of the electrode with the portion of the circuit board.

17. The method of claim 13 , wherein the circuit board has a length that extends from a first end of the implantable stimulation device to a second end of the implantable stimulation device, the length of the circuit board is coupled to the circuit components and the electrode, and the length of the circuit board is planar.

18. The method of claim 17 , wherein the conductive material has a cross-sectional shape that is triangular, square, circular, square-round, or rectangular.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2023
From: STIMWAVE TECHNOLOGIES INCORPORATED
To: SWT SPV LLC
Reel/Frame 063269/0506 →
CHANGE OF NAME Recorded Apr 6, 2023
From: SWT SPV LLC
To: CURONIX LLC
Reel/Frame 063283/0176 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2022
From: GREENE, GRAHAM PATRICK; SPECK, BENJAMIN; LOMBARD, PAUL
To: STIMWAVE TECHNOLOGIES INCORPORATED
Reel/Frame 061551/0855 →
Continuity (2)
Provisional Application 62934849 · Nov 13, 2019
Related Publication 20210170184A1 · Jun 10, 2021