IP Library Granted Patent US 11,655,332
Granted Patent B2
US 11,655,332 · App. 17/104,034 · Granted May 23, 2023

Sealed isocyanates

Inventors: Benjamin R. Lund (Plano, TX); Walter Voit (Richardson, TX)
Assignees: Adaptive 3D Technologies; Board of Regents, The University of Texas System
C08G18/80B29C64/153B33Y10/00B33Y70/00C08F220/12C08G18/3855C08G18/672
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,655,332
App. No.
17/104,034
Granted
May 23, 2023
Kind
B2
Abstract

The present disclosure relates to sealed isocyanate resin compositions. The resin compositions may be used for additive manufacturing. One embodiment of the invention includes a photopolymerizable resin for additive manufacturing, the resin comprising: a blocked isocyanate; at least one monomer or oligomer; and a multifunctional nucleophile.

Claims (23)

1. A photopolymerizable resin for additive manufacturing comprising:

a blocked isocyanate;

about 0.01-5% by weight of a stabilized thiol; and

at least about 30% by weight of one or more acrylic monomers,

wherein the resin is configured to react by exposure to light to form a cured material,

wherein a layer of the resin about 100 μm thick is configured to form the cured material in no more than 30 seconds,

wherein the cured material has a toughness in the range of about 3-100 MJ/m 3 and a strain at break in the range of about 30-1000%.

2. The photopolymerizable resin according to claim 1 , wherein the blocked isocyanate includes at least one of a uretdione, a biuret, an allophanate, an isocyanaurate, methylene dicyclohexyl diisocyanate (MDI), or toluene diisocyanate (TDI).

3. The photopolymerizable resin according to claim 2 , wherein the uretdione is a uretdione of hexamethylene diisocyanate (HDI), a uretdione of isophorone diisocyanate (IDI), a uretdione of methylene dicyclohexyl diisocyanate (MDI), a uretdione of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or a uretdione of toluene diisocyanate (TDI).

4. The photopolymerizable resin according to claim 2 , wherein the isocyanaurate is an isocyanaurate of hexamethylene diisocyanate (HDI), an isocyanaurate of isophorone diisocyanate (IDI), an isocyanaurate of methylene dicyclohexyl diisocyanate (MDI), an isocyanaurate of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or an isocyanaurate of toluene diisocyanate (TDI).

5. The photopolymerizable resin according to claim 2 , wherein the biuret is a biuret of hexamethylene diisocyanate (HDI), a biuret of isophorone diisocyanate (IDI), a biuret of methylene dicyclohexyl diisocyanate (MDI), a biuret of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or a biuret of toluene diisocyanate (TDI).

6. The photopolymerizable resin according to claim 2 , wherein the allophanate is an allophanate of hexamethylene diisocyanate (HDI), an allophanate of isophorone diisocyanate (IDI), an allophanate of methylene dicyclohexyl diisocyanate (MDI), an allophanate of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or an allophanate of toluene diisocyanate (TDI).

7. The photopolymerizable resin according to claim 1 , wherein the blocked isocyanate includes an isocyanate and a blocking agent.

8. The photopolymerizable resin according to claim 7 , wherein the isocyanate is configured to react with the blocking agent such that isocyanate functional groups of the isocyanate are end-capped.

9. The photopolymerizable resin according to claim 7 , wherein the blocking agent includes at least one of a nucleophile, a derivative of an alcohol, a hindered amine, a caprolactam, a phenol, an oxime, or a pyrazole malonate.

10. The photopolymerizable resin according to claim 1 , wherein the cured material has a strain at break in the range of about 100-800%.

11. The photopolymerizable resin according to claim 1 , wherein a layer of the resin in the range of about 100-400 μm thick is configured to form the cured material in no more than 1 second.

12. The photopolymerizable resin according to claim 1 , wherein the layer of the resin about 100 μm thick is configured to form the cured material in no more than 20 seconds.

13. The photopolymerizable resin according to claim 1 , wherein a layer of the resin about 1000 μm thick is configured to form the cured material in no more than 30 seconds.

14. The photopolymerizable resin according to claim 1 , wherein a layer of the resin about 10 μm thick is configured to form the cured material in no more than 2 seconds.

15. The resin mixture according to claim 1 , wherein the stabilized thiol comprises a secondary thiol.

16. The resin mixture according to claim 15 , wherein the secondary thiol includes at least one of Pentaerythritol tetrakis (3-mercaptobutylate), 1,4-bis (3-mercaptobutylyloxy) butane, or 1,3,5-Tris(3-mercaptobutyloxethyl)-1,3,5-triazine.

17. The resin mixture according to claim 1 , further comprising at least one of a photoinitiator, an inhibitor, a dye, or a filler.

Assignments (3)
SECURITY INTEREST Recorded Apr 24, 2026
From: ARC IMPACT ACQUISITION CORPORATION
To: IRON HORSE CREDIT LLC
Reel/Frame 075458/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2023
From: LUND, BENJAMIN R.
To: ADAPTIVE 3D TECHNOLOGIES
Reel/Frame 062330/0070 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2022
From: VOIT, WALTER
To: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
Reel/Frame 061562/0935 →