COOLING DEVICES AND INSTRUMENTS INCLUDING THEM
Certain configurations are described herein of an instrument comprising a passive cooling device which includes, in part, a loop thermosyphon configured to thermally couple to a component of the instrument to be cooled. In some instances, the cooling device can cool a transistor, transistor pair, an interface or other components of the instrument.
1 - 20 . (canceled)
21 . An instrument comprising:
an atomization device configured to sustain an atomization source;
an induction device configured to receive a portion of the atomization device to provide radio frequency energy into the received portion of the atomization device;
a radio frequency generator electrically coupled to the induction device;
an interface fluidically coupled to the atomization device, in which the interface is thermally coupled to a passive cooling device; and
a detector fluidically coupled to the interface.
22 . The instrument of claim 1 , in which the instrument does not include a chiller configured to cool the interface.
23 . The instrument of claim 21 , in which the passive cooling device is configured as a loop thermosyphon.
24 . The instrument of claim 23 , in which the loop thermosyphon comprises a closed loop heat pipe.
25 . The instrument of claim 23 , in which the loop thermosyphon comprises an evaporator fluidically coupled to a condenser through a downcomer fluid line and fluidically coupled to the condenser through an upcomer fluid line.
26 . The instrument of claim 25 , in which the condenser is positioned external to a housing comprising the atomization device and the interface.
27 . The instrument of claim 25 , in which the evaporator is coupled to the interface with at least one plate.
28 . The instrument of claim 21 , in which the passive cooling device is further thermally coupled to a transistor of the radio frequency generator and is configured to simultaneously cool the interface and the transistor.
29 . The instrument of claim 21 , further comprising a second passive cooling device thermally coupled to a transistor of the radio frequency generator.
30 . The instrument of claim 29 , in which the second passive cooling device is configured as a second loop thermosyphon.
31 . The instrument of claim 30 , in which the second loop thermosyphon comprises an evaporator fluidically coupled to a condenser through a downcomer fluid line and fluidically coupled to the condenser through an upcomer fluid line.
32 . The instrument of claim 21 , in which the passive cooling device is further configured to provide heat to the interface to pre-heat the interface.
33 . The instrument of claim 21 , in which the passive cooling device comprises a plate configured to sandwich the evaporator to the interface to increase surface area contact between an evaporator loop of the cooling device and the interface.
34 . The instrument of claim 33 , in which the passive cooling device is configured as a loop thermosyphon, in which the evaporator loop is sandwiched between the plate and a second plate comprising a groove to receive the evaporator loop, in which the second plate is coupled to the interface, and in which the evaporator loop, the plate and the second plate are coupled to each other through a solder joint.
35 . The instrument of claim 21 , in which the atomization device is configured to sustain an inductively coupled plasma.
36 . The instrument of claim 35 , in which the induction device comprises an induction coil comprising at least one radial fin.
37 . The instrument of claim 36 , in which the detector is a mass spectrometer.
38 . The instrument of claim 36 , in which the detector is an optical detector.
39 . The instrument of claim 21 , in which the atomization device is configured to sustain a flame.
40 . The instrument of claim 21 , in which the atomization device is configured to sustain an inductively coupled plasma, the induction device comprises an induction coil comprising at least one radial fin, and the passive cooling device comprises a loop thermosyphon comprising an evaporator fluidically coupled to a condenser through a downcomer fluid line and fluidically coupled to the condenser through an upcomer fluid line, in which the evaporator of the loop thermosyphon is thermally coupled to the interface.
41 - 128 . (canceled)