Display apparatus
A display apparatus including a plurality of display modules each including a module substrate and a plurality of light emitting devices mounted on the module substrate, and a support substrate on which the display modules are disposed and including electrodes, in which the module substrate includes through-holes penetrating the module substrate and vias disposed in the through-holes, and the light emitting devices are electrically connected to the electrodes of the support substrate through the vias.
1. A display apparatus comprising:
a plurality of display modules each comprising a module substrate and a plurality of light emitting devices mounted on the module substrate; and
a support substrate on which the display modules are disposed and including a plurality of electrodes,
wherein the module substrate includes through-holes penetrating the module substrate and vias disposed in the through-holes, and the light emitting devices are electrically connected to the electrodes of the support substrate through the vias,
wherein the module substrate has a first side and a second side opposing each other, and
wherein among the first and second sides, the through-holes are disposed only on the first side.
2. The display apparatus according to claim 1 , wherein each of the vias comprises an upper pad disposed on an upper surface of the module substrate, a lower pad disposed on a lower surface of the module substrate, and an inner electrode disposed in the through-hole, and the lower pad is connected to the support substrate by a ball grid array (BGA).
3. The display apparatus according to claim 1 , further comprising a plurality of connectors disposed on a lower surface of the module substrate,
wherein the connectors are electrically connected to the electrodes on the support substrate.
4. The display apparatus according to claim 3 , wherein the module substrate includes a plurality of recesses formed on the lower surface thereof, and the connectors are disposed in the recesses.
5. The display apparatus according to claim 4 , wherein the module substrate has a pixel region in which the light emitting devices are disposed to display an image and a non-pixel region surrounding the pixel region, and at least some of the connectors are disposed in the pixel region.
6. The display apparatus according to claim 5 , wherein at least some of the through-holes are disposed in the pixel region.
7. The display apparatus according to claim 4 , wherein at least some of the through-holes are disposed in a region corresponding to the recesses.
8. The display apparatus according to claim 4 , wherein the support substrate has protrusions disposed on a surface thereof facing the module substrate and corresponding to the recesses.
9. The display apparatus according to claim 8 , wherein the protrusions comprise a conductive material and are electrically connected to the electrodes on the support substrate.
10. The display apparatus according to claim 9 , wherein the support substrate includes a conductive electrode portion formed on a first surface thereof facing the module substrate, and the vias contact the conductive electrode portion.
11. The display apparatus according to claim 10 , wherein the support substrate has holes disposed on the first surface and corresponding to the through-holes, and the vias are integrally formed with the through-holes and the holes to contact the conductive electrode portion.
12. The display apparatus according to claim 1 , wherein the module substrate further has a third side and a fourth side opposing each other and connecting the first and the second sides, and
wherein, among the third and fourth sides, the through-holes are disposed only on one of the third and fourth sides.
13. A method of manufacturing a display apparatus, comprising:
manufacturing a plurality of display modules; and
disposing the display modules on a support substrate,
wherein manufacturing each of the display modules comprises:
forming light emitting devices on a module substrate;
forming through-holes in the module substrate; and
forming a drive circuit unit on a lower surface of the module substrate, and
electrically connecting the light emitting devices to the drive circuit unit through the through-holes,
wherein the module substrate has a first side and a second side opposing each other, and
wherein among the first and second sides, the through-holes are formed only on the first side.
14. The method according to claim 13 , wherein the through-holes are formed using laser beams.
15. The method according to claim 13 , further comprising grinding an edge of the module substrate on which the light emitting devices are formed.
16. The method according to claim 13 , further comprising forming a plurality of recesses on the lower surface of the module substrate by laser processing.
17. The method according to claim 16 , further comprising forming connectors in the recesses.
18. The method according to claim 17 , further comprising forming protrusions at locations on the support substrate corresponding to the recesses.
19. The method according to claim 13 , further comprising:
forming grooves at locations on an upper surface of the support substrate corresponding to the through-holes; and
forming vias in the through-holes and the grooves,
wherein the display modules are disposed on the support substrate by a ball grid array (BGA).