Embedding reinforced circuit board, camera module and electronic device
View Patent ↗The present disclosure provides an embedding reinforced circuit board, a camera module, and an electronic device. The embedding reinforced circuit board, comprising a circuit board and a reinforcing plate. The circuit board comprises a first surface and a second surface opposite to the first surface. The first surface is provided with a component installation area. The second surface is provided with an accommodating groove. The width of at least one side of the cross-sectional area of the accommodating groove is wider than the width of the corresponding side of the component installation area. The cross-sectional area of the accommodating groove is parallel to the first surface or the second surface. The reinforcing plate is disposed in the accommodating groove.
1. An embedding reinforced circuit board, comprising:
a circuit board comprising a first surface and a second surface opposite to the first surface, the first surface being provided with a component installation area, the second surface being provided with an accommodating groove, a width of at least one side of the cross-sectional area of the accommodating groove being wider than a width of a corresponding side of the component installation area, the cross-sectional area of the accommodating groove being parallel to the first surface or the second surface; and
a reinforcing plate disposed in the accommodating groove;
wherein the first surface is provided with a component accommodating groove disposed in the component installation area;
wherein the cross-sectional area of the component accommodating groove is smaller than or equal to the cross-sectional area of the component installation area; the cross-sectional area of the component accommodating groove and the cross-sectional area of the component installation area are parallel to the first surface or the second surface.
2. The embedding reinforced circuit board according to claim 1 , wherein the component accommodating groove communicates with the accommodating groove.
3. The embedding reinforced circuit board according to claim 1 , wherein a thickness of the reinforcing plate is smaller than or equal to the depth of the accommodating groove.
4. The embedding reinforced circuit board according to claim 1 , wherein the hardness of the reinforcing plate is greater than the hardness of the circuit board.
5. The embedding reinforced circuit board according to claim 4 , wherein the reinforcing plate is made of metal, metal alloy, or plastic.
6. A camera module, comprising:
an embedding reinforced circuit board according to claim 1 ;
a light sensing component disposed on the circuit board and in the component installation area; and
a lens component disposed on the first surface of the circuit board and in the component installation area, the lens component being disposed on one side of the light sensing component away from the reinforcing plate.
7. The camera module according to claim 6 , wherein the first surface is provided with a component accommodating groove disposed in the component installation area; the light sensing component is disposed in the component accommodating groove.
8. An electronic device, comprising:
an embedding reinforced circuit board, comprising:
a circuit board comprising a first surface and a second surface opposite to the first surface, the first surface being provided with a component installation area, the second surface being provided with an accommodating groove, a width of at least one side of the cross-sectional area of the accommodating groove being wider than a width of a corresponding side of the component installation area, the cross-sectional area of the accommodating groove being parallel to the first surface or the second surface;
a reinforcing plate disposed in the accommodating groove; and
a component disposed on the first surface of the circuit board and in the component accommodating area;
wherein the first surface is provided with a component accommodating groove disposed in the component installation area.
9. The electronic device according to claim 8 , wherein the cross-sectional area of the component accommodating groove is smaller than or equal to the cross-sectional area of the component installation area; the cross-sectional area of the component accommodating groove and the cross-sectional area of the component installation area are parallel to the first surface or the second surface.
10. The electronic device according to claim 8 , wherein the component accommodating groove communicates with the accommodating groove.
11. The electronic device according to claim 8 , wherein a thickness of the reinforcing plate is smaller than or equal to the depth of the accommodating groove.
12. The electronic device according to claim 8 , wherein the hardness of the reinforcing plate is greater than the hardness of the circuit board.
13. The electronic device according to claim 12 , wherein the reinforcing plate is made of metal, metal alloy or plastic.