Silicon nitride sintered body, silicon nitride substrate, and silicon nitride circuit board
In a silicon nitride sintered body including silicon nitride crystal grains and a grain boundary phase, dislocation defect portions exists inside at least some of the silicon nitride crystal grains. A percentage of a number of the at least some of the silicon nitride crystal grains among any 50 of the silicon nitride crystal grains having completely visible contours in any cross section or surface of the silicon nitride sintered body is not less than 50% and not more than 100%. It is favorable that a plate thickness of the silicon nitride substrate, in which the silicon nitride sintered body is used, is within the range not less than 0.1 mm and not more than 0.4 mm. The TCT characteristics can be improved by using the silicon nitride substrate in the silicon nitride circuit board.
1. A silicon nitride sintered body comprising silicon nitride crystal grains and a grain boundary phase,
dislocation defect portions existing inside at least some of the silicon nitride crystal grains,
a percentage of a number of the at least some of the silicon nitride crystal grains among any 50 of the silicon nitride crystal grains having completely visible contours in a 50 μm×50 μm observation region of any cross section or surface being not less than 80% and not more than 100%,
a percentage of a number of the silicon nitride crystal grains having an occupied area ratio of the dislocation defect portion of 10% or less among the number of the at least some of the silicon nitride crystal grains being 80% or more.
2. The silicon nitride sintered body according to claim 1 , wherein
the percentage is not less than 90% and not more than 100%.
3. The silicon nitride sintered body according to claim 1 , wherein
no aggregate of a component other than silicon, oxygen, and nitrogen is 1 μm 2 or more in the dislocation defect portion of each of the at least some of the silicon nitride crystal grains.
4. The silicon nitride sintered body according to claim 1 , wherein
no component other than silicon, oxygen, and nitrogen is detected to be 10 mol % or more in the dislocation defect portion of each of the at least some of the silicon nitride crystal grains.
5. The silicon nitride sintered body according to claim 4 , wherein
a percentage of a number of the silicon nitride crystal grains having an occupied area ratio of the dislocation defect portion of 10% or less among the number of the at least some of the silicon nitride crystal grains is 70% or more.
6. The silicon nitride sintered body according to claim 5 , wherein
at least one of the silicon nitride crystal grains has a major diameter of 30 μm or more in a 300 μm×300 μm observation region of any cross section.
7. The silicon nitride sintered body according to claim 6 , wherein
an average of major diameters of the silicon nitride crystal grains is not less than 3 μm and not more than 20 μm in a 300 μm×300 μm observation region of any cross section.
8. A silicon nitride substrate, comprising the silicon nitride sintered body according to claim 7 .
9. The silicon nitride substrate according to claim 8 , wherein
a plate thickness of the silicon nitride substrate is not less than 0.1 mm and not more than 0.4 mm.
10. The silicon nitride sintered body according to claim 1 , wherein
at least one of the silicon nitride crystal grains has a major diameter of 30 μm or more in a 300 μm×300 μm observation region of any cross section.
11. The silicon nitride sintered body according to claim 1 , wherein
an average of major diameters of the silicon nitride crystal grains is not less than 3 μm and not more than 20 μm in a 300 μm×300 μm observation region of any cross section.
12. The silicon nitride sintered body according to claim 1 , wherein
a thermal conductivity of the silicon nitride sintered body is 80 W/(m·K) or more.
13. The silicon nitride sintered body according to claim 1 , wherein
a three-point bending strength of the silicon nitride sintered body is 700 MPa or more.
14. The silicon nitride sintered body according to claim 1 , wherein
a fracture toughness value of the silicon nitride sintered body is 7.5 MPa·m 1/2 or more.
15. A silicon nitride substrate, comprising the silicon nitride sintered body according to claim 1 .
16. The silicon nitride substrate according to claim 15 , wherein
a plate thickness of the silicon nitride substrate is not less than 0.1 mm and not more than 0.4 mm.
17. A silicon nitride circuit board, comprising:
the silicon nitride substrate according to claim 15 ; and
a circuit part provided on the silicon nitride substrate.
18. The silicon nitride circuit board according to claim 17 , wherein
the circuit part is a metal plate having a thickness of 0.8 mm or more.