IP Library Patent Application 17121383
Patent Application
App. No. 17/121,383

VEHICLE INTERIOR TRIM PART FORMED WITH INTERGRATED ELECTRONICS AND METHOD OF MAKING

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Quick Facts
Patent No.
US None
App. No.
17/121,383
Abstract

An assembly, the assembly including: a substrate; an injection molded structural electronic component; and a layer of polymer that partially encapsulates the substrate and the injection molded structural electronic component and unifies the substrate and the injection molded structural electronic component into one component.

Claims (20)

1 . An assembly, comprising:

a substrate;

an injection molded structural electronic component; and

a layer of polymer that partially encapsulates the substrate and the injection molded structural electronic component and unifies the substrate and the injection molded structural electronic component into one component.

2 . The assembly as in claim 1 , further comprising another injection molded structural electronic component.

3 . The assembly as in claim 1 , further comprising alternative electronics.

4 . The assembly as in claim 3 , wherein the injection molded structural electronic component has a cut out portion that is configured to receive the alternative electronics.

5 . The assembly as in claim 1 , wherein the assembly is a portion of a vehicle interior.

6 . The assembly as in claim 1 , wherein the assembly comprises a plurality of icons.

7 . A method for providing an assembly, comprising:

forming an injection molded substrate;

forming at least one injection molded structural electronic component;

placing the injection molded substrate and the at least one injection molded structural electronic component in a tool; and

partially overmolding the injection molded substrate and the at least one injection molded structural electronic component with a polymer injected into the tool; and

unifying the injection molded substrate and the at least one injection molded structural electronic component into one component with the polymer.

8 . The method as in claim 7 , wherein another injection molded structural electronic component is placed in the tool prior to the partially overmolding step.

9 . The method as in claim 7 , wherein alternative electronics are inserted into the tool.

10 . The method as in claim 9 , wherein the at least one injection molded structural electronic component has a cut out portion that is configured to receive the alternative electronics.

11 . The method as in claim 7 , wherein the assembly is a portion of a vehicle interior.

12 . The method as in claim 7 , wherein the assembly comprises a plurality of icons.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2023
From: WHITEHEAD, DAVID; SYBRANDY, THOMAS; NASCIMENTO, AIDANO; BAME, TYLER; KOVAC, DAVID
To: INTEVA PRODUCTS, LLC
Reel/Frame 062717/0475 →
PATENT SECURITY AGREEMENT Recorded Mar 23, 2022
From: INTEVA PRODUCTS, LLC
To: CERBERUS BUSINESS FINANCE, LLC, AS COLLATERAL AGENT
Reel/Frame 059766/0348 →