Thin-film connectors for data acquisition system
Thin film connectors are described for connecting a lead assembly and a data acquisition system. Particularly, a connector includes a button having a housing and conductive pins extending from a proximal end of the housing through a base plate into a cavity on a distal end of the housing. The connector further includes a thin-film adapter having: (i) a supporting structure, (ii) bond pads formed on the supporting structure, (iii) a cable having conductive traces electrically connected to the bond pads, and (iv) feedthroughs that pass through the supporting structure and are electrically connected with the bond pads. Each conductive pin extends through a feedthrough, and each conductive pin is in electrical connection with one or more conductive traces via each bond pad.
1. A thin-film lead assembly comprising:
a cable comprising a proximal end, a distal end, a first supporting structure that extends from the proximal end to the distal end, and a first set of conductive traces formed on a portion of the first supporting structure;
an electrode assembly formed on the first supporting structure at the distal end of the cable, wherein the electrode assembly comprises one or more electrodes in electrical connection with one or more conductive traces of the first set of conductive traces; and
a connector comprising: (i) a button comprising a base plate and a plurality of conductive connectors on the base plate, and (ii) an adapter comprising a second supporting structure, a plurality of bond bands exposed on a surface of the second supporting structure and electrically connected to the plurality of conductive connectors, and a second set of conductive traces that terminate at the plurality of bond bands,
wherein each trace from the second set of conductive traces terminates at a bond pad of the plurality of bond pads, and
wherein the second set of conductive traces of the adapter are in electrical contact with the first set of conductive traces.
2. The thin-film lead assembly of claim 1 , wherein the button further comprises a housing comprising: a proximal end, a distal end, a cavity, and the base plate positioned in the cavity separating the proximal end and the distal end.
3. The thin-film lead assembly of claim 2 , wherein the plurality of conductive connectors extend from the proximal end of the housing through the base plate, and extend into a portion of the cavity on the distal end of the housing.
4. The thin-film lead assembly of claim 2 , wherein the second supporting structure comprises a main body positioned within the portion of the cavity on the distal end of the housing.
5. The thin-film lead assembly of claim 4 , wherein the main body and the cable are monolithic.
6. The thin-film lead assembly of claim 1 , wherein the second supporting structure is comprised of one or more layers of dielectric material, and the dielectric material is polyimide, liquid crystal polymer, parylene, polyether ether ketone, or a combination thereof.
7. The thin-film lead assembly of claim 1 , wherein the second set of conductive traces are comprised of one or more layers of conductive material, and the conductive material is platinum (Pt), platinum/iridium (Pt/Ir), titanium (Ti), gold/titanium (Au/Ti), or any alloy thereof.
8. The thin-film lead assembly of claim 1 , where the plurality of bond pads are comprised of one or more layers of conductive material, and the conductive material is gold (Au), platinum (Pt), platinum/iridium (Pt/Ir), titanium (Ti), gold/titanium (Au/Ti), or any alloy thereof.
9. The thin-film lead assembly of claim 1 , wherein the adapter further comprises a conductive epoxy disposed on a bottom of each conductive connector of the plurality of conductive connectors and each bond pad of the plurality of bond pads, respectively, to electrically connect each conductive connector to a corresponding bond pad.
10. The thin-film lead assembly of claim 4 , wherein the adapter further comprises an insulation layer formed over the main body of the second supporting structure and at least a portion of each bond pad of the plurality of bond pads.
11. The thin-film lead assembly of claim 4 , wherein the adapter further comprises a backfill layer formed over the main body of the second supporting structure and fills a majority of a volume of the cavity of the housing.
12. A data acquisition system comprising:
a measurement and control device comprising an electronics module;
a cable comprising a proximal end, a distal end, a first supporting structure that extends from the proximal end to the distal end, and a first set of conductive traces formed on a portion of the first supporting structure;
an electrode assembly formed on the first supporting structure at the distal end of the cable, wherein the electrode assembly comprises one or more electrodes in electrical connection with one or more conductive traces of the first set of conductive traces; and
a connector comprising: (i) a button comprising a base plate and a plurality of conductive connectors on the base plate, and (ii) an adapter comprising a second supporting structure, a plurality of bond bands exposed on a surface of the second supporting structure and electrically connected to the plurality of conductive connectors, and a second set of conductive traces that terminate at the plurality of bond bands,
wherein each trace from the second set of conductive traces terminates at a bond pad of the plurality of bond pads,
wherein the second set of conductive traces of the adapter are in electrical contact with the first set of conductive traces, and
wherein the connector electrically connects the first set of conductive traces to the electronics module.