IP Library Patent Application 17122978
Patent Application
App. No. 17/122,978

MATERIAL STACK FOR LEDS WITH A DOME

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Quick Facts
Patent No.
US None
App. No.
17/122,978
Abstract

Various embodiments include methods for forming domed light-emitting diode (LED)-modules and devices constructed by those methods. In one example, the domed LED-module includes a package substrate, an LED die formed on the package substrate, one or more silicone pads formed on the package substrate and at least partially surrounding the LED die, and a high refractive-index material formed over the one or more silicone pads. Other devices and methods are described.

Claims (31)

1 . A domed light-emitting diode (LED)-module, the domed LED-module comprising:

a package substrate;

an LED die formed on the package substrate;

one or more silicone pads formed on the package substrate and at least partially surrounding the LED die; and

a high refractive-index material formed over the one or more silicone pads.

2 . The domed LED-module of claim 1 , wherein the one or more silicone pads comprise at least one layer of methyl silicone.

3 . The domed LED-module of claim 1 , wherein the one or more silicone pads may comprise a plurality of layers.

4 . The domed LED-module of claim 1 , further comprising a colorant comprised of high refractive-index particles dispersed within the one or more silicone pads.

5 . The domed LED-module of claim 4 , wherein high refractive-index particles are selected from one or more particle types including titanium oxide, zinc oxide, aluminum oxide, and magnesium oxide.

6 . The domed LED-module of claim 1 , further comprising a cathode mount and an anode mount formed on the package substrate, the cathode mount and the anode mount being configured to electrically couple to the LED die.

7 . The domed LED-module of claim 1 , wherein the high refractive-index material comprises at least one layer of phenyl silicone.

8 . The domed LED-module of claim 1 , wherein the high refractive-index material is formed in to achieve a desired radiation-distribution pattern.

9 . The domed LED-module of claim 1 , wherein the high refractive-index material is formed to achieve a desired formed to focus radiation from the LED die in a desired direction.

10 . The domed LED-module of claim 1 , wherein the high refractive-index material is formed to achieve a desired formed to focus radiation from the LED die with a desired beam spread.

11 . The domed LED-module of claim 1 , wherein the high refractive-index material has a refractive index of greater than about 1.5.

12 . The domed LED-module of claim 1 , wherein the one or more silicone pads have a glass-transition temperature of at least less than about −40° C.

13 . A light-emitting diode (LED)-module, the LED-module comprising:

a package substrate;

an LED die formed on the package substrate;

one or more pads, comprising methyl silicone, formed on the package substrate and at least partially surrounding the LED die; and

a dome, comprising phenyl silicon, formed over the one or more silicone pads.

14 . The LED-module of claim 13 , further comprising a colorant comprised of high refractive-index particles dispersed within the one or more silicone pads.

15 . The LED-module of claim 13 , wherein the dome is formed in to achieve a desired radiation-distribution pattern.

16 . The LED-module of claim 13 , wherein the dome is formed to achieve a desired formed to focus radiation from the LED die in a desired direction.

17 . The LED-module of claim 13 , wherein the dome is formed to achieve a desired shape to focus radiation from the LED die with a desired beam spread.

18 . A method of forming a domed light-emitting diode (LED)-module, the method comprising:

mounting an LED die on a package substrate;

forming one or more silicone pads formed on the package substrate, the one or more silicone pads at least partially surrounding the LED die; and

forming a high refractive-index material formed over the one or more silicone pads.

19 . The method of claim 18 , wherein the high refractive-index material is compression-moulded over the one or more silicone pads.

20 . The method of claim 18 , wherein the one or more silicone pads are formed to a thickness of at least about 5 μm.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND AND THRID INVENTOR'S NAMES PREVIOUSLY RECORDED AT REEL: 057440 FRAME: 0024. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 19, 2022
From: BASIN, GRIGORIY; HOLUB, MICHAEL ALAN; MIHOPOULOS, THEODOROS; RAMLI, RAFIZA; HIN, TZE YANG
To: LUMILEDS LLC
Reel/Frame 059711/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2021
From: BASIN, GRIGORIY; HOLUB, MICHAEL; MIHOPOULOS, TED; RAMLI, RAFIZA; HIN, TZE YANG
To: LUMILEDS LLC
Reel/Frame 057440/0024 →