IP Library Granted Patent US 11,967,588
Granted Patent B2
US 11,967,588 · App. 17/122,992 · Granted Apr 23, 2024

Optical enclosures for LED modules

Inventors: Frederic Stephane Diana (Santa Clara, CA); Charles André Schrama (San Jose, CA)
Assignee: Lumileds LLC
H01L25/165H01L25/167H01L33/58H01L2933/0058
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Quick Facts
Patent No.
US 11,967,588
App. No.
17/122,992
Granted
Apr 23, 2024
Kind
B2
Abstract

Various embodiments include combined lens and safety enclosure apparatuses and methods for forming the apparatuses. In one example a combined lens and safety enclosure apparatus for a light-emitting diode (LED) module is disclosed. The enclosure apparatus includes at least one plastic-material-based optical-lens element mounted over a plurality of LED elements, where a distance between the optical-lens element and any portion of any one of the plurality of LED elements is spaced away from each other by at least 0.8 mm. A driver-on-board (DoB) subsystem, including an electronic circuit configured to provide power to the plurality of LED elements, has a plastic-material-based optical enclosure mounted over the DoB subsystem. A distance between the optical enclosure and any portion of any of the electronic circuit is spaced away from optical enclosure by at least 0.8 mm. Other devices and methods are described.

Claims (28)

1. A combined lens and safety enclosure apparatus for a light-emitting diode (LED) module, the enclosure apparatus comprising:

at least one plastic-material-based optical-lens element mounted over a plurality of LED elements, a distance between the optical-lens element and any portion of any one of the plurality of LED elements being spaced away from each other by at least 0.8 mm;

a driver-on-board (DoB) subsystem; the DoB subsystem including an electronic circuit configured to provide power to the plurality of LED elements;

a plastic-material-based optical enclosure mounted over the DoB subsystem, a distance between the plastic-material-based optical enclosure and any portion of any of the electronic circuit being spaced away from the plastic-material-based optical enclosure by at least 0.8 mm; and

a sidewall-separation portion surrounding the DoB subsystem and below the plastic-material-based optical enclosure, the sidewall-separation portion to provide mechanical reinforcement and prevent accessibility from side portions of the LED module.

2. The enclosure apparatus of claim 1 , wherein the plastic material comprises a polycarbonate.

3. The enclosure apparatus of claim 2 , wherein a thickness of the polycarbonate mounted over the plurality of LED elements is greater than 1.5 mm.

4. The enclosure apparatus of claim 1 , wherein the plastic material comprises substantially-clear silicone.

5. The enclosure apparatus of claim 1 , wherein the plastic material comprises one or more different grades of plastic.

6. The enclosure apparatus of claim 1 , further comprising a plurality of mechanical pillars formed around at least some of the plurality of LED elements.

7. The enclosure apparatus of claim 1 , wherein a thickness of the optical-lens element mounted over the plurality of LED elements is at least 1.5 mm.

8. The enclosure apparatus of claim 1 , wherein a thickness of the optical enclosure mounted over the DoB subsystem is at least 3 mm.

9. A combined lens and safety enclosure apparatus for a light-emitting diode (LED) module, the enclosure apparatus comprising:

at least one plastic-material-based optical-lens element mounted over a plurality of LED elements, a distance between the optical-lens element and any portion of any one of the plurality of LED elements being spaced away from each other by at least 0.8 mm, the at least one plastic-material-based optical-lens element comprising a polycarbonate being at least 1.5 mm in thickness;

a plurality of mechanical pillars formed around at least some of the plurality of LED elements;

a driver-on-board (DoB) subsystem; the DoB subsystem including an electronic circuit configured to provide power to the plurality of LED elements; and

a plastic-material-based optical enclosure mounted over the DoB subsystem, a distance between the optical enclosure and any portion of any of the electronic circuit being spaced away from the plastic-material-based optical enclosure by at least 0.8 mm, the plastic-material-based optical enclosure comprising a polycarbonate being at least 3 mm in thickness.

10. A combined lens and safety enclosure apparatus for a light-emitting diode (LED) module, the enclosure apparatus comprising:

at least one plastic-material-based optical-lens element mounted over a plurality of LED elements, a distance between the optical-lens element and any portion of any one of the plurality of LED elements being spaced away from each other by at least 0.8 mm;

an electronic circuit configured to provide power to the plurality of LED elements;

a plastic-material-based optical enclosure mounted over the electronic circuit; and

a sidewall-separation portion surrounding the electronic circuit and below the plastic-material-based optical enclosure, the sidewall-separation portion to provide mechanical reinforcement and prevent accessibility from side portions of the LED module.

11. A combined lens and safety enclosure apparatus for a light-emitting diode (LED) module, the enclosure apparatus comprising:

at least one plastic-material-based optical-lens element mounted over a plurality of LED elements;

a driver-on-board (DoB) subsystem;

the DoB subsystem including an electronic circuit configured to provide power to the plurality of LED elements;

comprising a plurality of mechanical pillars formed around at least some of the plurality of LED elements; and

a plastic-material-based optical enclosure mounted over the DoB subsystem, a distance between the plastic-material-based optical enclosure and any portion of any of the electronic circuit being spaced away from the plastic-material-based optical enclosure by at least 0.8 mm.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2021
From: DIANA, FREDERIC STEPHANE; SCHRAMA, CHARLES ANDRÉ
To: LUMILEDS LLC
Reel/Frame 056231/0163 →