Surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the same
Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.
1. A surface-treated copper foil comprising:
a surface-treated layer formed on at least one side of an untreated copper foil; and
an oxidation-preventing layer formed on the surface-treated layer,
wherein the surface-treated layer is formed by Cu-electroplating at a current density of about 5 A/dm 2 to about 10 A/dm 2 ,
wherein the surface-treated layer has a transmission loss of about 0.5 dB/100 mm to about 2.5 dB/100 mm at 20 GHz,
wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P).
2. The surface-treated copper foil of claim 1 , wherein the untreated copper foil is an electrolytic copper foil.
3. The surface-treated copper foil of claim 1 , which satisfies Formula 1:
about 0 μm≤ A 2 −A 1 ≤about 0.2 μm <Formula 1>
wherein Formula 1, A 1 is a 10-point average roughness, R z , before surface treatment of the copper foil, and A 2 is a 10-point average roughness, R z , after surface treatment of the copper foil.
4. The surface-treated copper foil of claim 1 , which satisfies Formula 2:
about 10≤ B 1 −B 2 ≤about 200 <Formula 2>
wherein Formula 2, B 1 is a gloss (Gs 60°) before surface treatment of the copper foil, and B 2 is a gloss (Gs 60°) after surface treatment of the copper foil.
5. The surface-treated copper foil of claim 1 , wherein the surface-treated copper foil has an adhesive strength of about 1.0 kgf/cm or more with a polyimide (PI) film or a polytetrafluoroethylene (PTFE) film.
6. The surface-treated copper foil of claim 1 , wherein the surface-treated copper foil has a transmission loss (S 21 ) of about 3.0 dB/100 mm or less at 20 GHz.
7. A method of manufacturing the surface-treated copper foil of claim 1 , comprising immersing an untreated copper foil in an aqueous solution containing a copper salt at about 10 g/L to about 60 g/L and an additive at about 50 g/L to about 200 g/L and carrying out electroplating at a solution temperature of about 25° C. to about 45° C., a pH of about 1 to about 7, and a current density of about 5 A/dm 2 to about 10 A/dm 2 and thus forming a surface-treated layer,
wherein the copper salt includes copper sulfate, copper nitrate, copper chloride, copper acetate, or a combination thereof, and the additive includes citric acid, ethylenediaminetetraacetic acid, nitrilotriacetic acid, tartaric acid, a salt thereof, or a combination thereof.
8. A copper foil laminate, in which the surface-treated copper foil of claim 1 is laminated on a resin substrate.
9. A printed wiring board formed using the copper foil laminate of claim 8 .